An FPGA Noise Resistant Digital Temperature Sensor with Auto Calibration

In recent years, thermal sensing in digital devices has become increasingly important. From a security perspective, new thermal-based attacks have revealed vulnerabilities in digital devices. Traditional temperature sensors using analog-to-digital converters consume significant power and are not conducive to rapid development. As a result, there has been an escalating demand for low cost, low power digital temperature sensors that can be seamlessly integrated onto digital devices. This research seeks to create a modular Field Programmable Gate Array digital temperature sensor with auto one-point calibration to eliminate the excessive costs and time associated with calibrating existing digital temperature sensors. In addition, to support the auxiliary protection role, the sensor is evaluated alongside a RSA circuit implemented on the same chip, with methods developed to mitigate noise and power fluctuations introduced by the main circuit. The result is a digital temperature sensor resistant to noise and suitable for quick mass deployment in digital devices

Integrated temperature sensors in deep sub-micron CMOS technologies

textIntegrated temperature sensors play an important role in enhancing the performance of on-chip power and thermal management systems in today's highly-integrated system-on-chip (SoC) platforms, such as microprocessors. Accurate on-chip temperature measurement is essential to maximize the performance and reliability of these SoCs. However, due to non-uniform power consumption by different functional blocks, microprocessors have fairly large thermal gradient (and variation) across their chips. In the case of multi-core microprocessors for example, there are task-specific thermal gradients across different cores on the same die. As a result, multiple temperature sensors are needed to measure the temperature profile at all relevant coordinates of the chip. Subsequently, the results of the temperature measurements are used to take corrective measures to enhance the performance, or save the SoC from catastrophic over-heating situations which can cause permanent damage. Furthermore, in a large multi-core microprocessor, it is also imperative to continuously monitor potential hot-spots that are prone to thermal runaway. The locations of such hot spots depend on the operations and instruction the processor carries out at a given time. Due to practical limitations, it is an overkill to place a big size temperature sensor nearest to all possible hot spots. Thus, an ideal on-chip temperature sensor should have minimal area so that it can be placed non-invasively across the chip without drastically changing the chip floor plan. In addition, the power consumption of the sensors should be very low to reduce the power budget overhead of thermal monitoring system, and to minimize measurement inaccuracies due to self-heating. The objective of this research is to design an ultra-small size and ultra-low power temperature sensor such that it can be placed in the intimate proximity of all possible hot spots across the chip. The general idea is to use the leakage current of a reverse-bias p-n junction diode as an operand for temperature sensing. The tasks within this project are to examine the theoretical aspect of such sensors in both Silicon-On-Insulator (SOI), and bulk Complementary Metal-Oxide Semiconductor (CMOS) technologies, implement them in deep sub-micron technologies, and ultimately evaluate their performances, and compare them to existing solutions.Electrical and Computer Engineerin

Dynamic voltage and frequency scaling with multi-clock distribution systems on SPARC core

The current implementation of dynamic voltage and frequency scaling (DVS and DFS) in microprocessors is based on a single clock domain per core. In architectures that adopt Instruction Level Parallelism (ILP), multiple execution units may exist and operate concurrently. Performing DVS and DFS on such cores may result in low utilization and power efficiency. In this thesis, a methodology that implements DVFS with multi Clock distribution Systems (DCS) is applied on a processor core to achieve higher throughput and better power efficiency. DCS replaces the core single clock distribution tree with multi-clock domain systems which, along with dynamic voltage and frequency scaling, creates multiple clock-voltage domains. DCS implements a self-timed interface between the different domains to maintain functionality and ensure data integrity. DCS was implemented on a SPARC core of UltraSPARC T1 architecture, and synthesized targeting TSMC 120nm process technology. Two clock domains were used on SPARC core. The maximum achieved speedup relative to original core was 1.6X. The power consumed by DCS was 0.173mW compared to the core total power of ~ 10W

Magnetometric techniques for the measurement of initial susceptibility and for non-contact sensing of displacement

PhD ThesisPart 1 of the thesis describes a new instrument that simultaneously measures the real magnetic susceptibility X' and the imaginary magnetic susceptibility X". The instrument measures the temperature dependences of X' and X" in rock samples between 16°C and 800°C; natural developments are working down to -200°C and measuring the anisotropy of susceptibility. The instrument's heart is a tuned circuit driven at its natural frequency by a 5MHz crystal oscillator. The tuned circuit's inductance is a sample coil that encloses-a furnace. The random noise level in the signal for X' is 7.4 x l0-13 m3 r. m. s., the noise level in the signal for X" is 2x 10 ^12 m3 r. m. s. Sample volumes are 0.1 cm3 or less. Equations describing the instrument are derived and verified, particular attention is paid to the sample coil. Circuit diagrams are included. Some results are presented and equations that broadly describe the observed temperature dependences of X' and X" are developed. Some methods for substantially improving the instrument's performance are outlined. Part 2 of the thesis describes a new method for non-contact sensing of displacement. A magnet is mounted on the object whose displacement is to be measured. The magnet's field is sensed and fed to a 6502 microprocessor programmed to display the distance between the magnet and the sensor; intervening barriers with a permeability very close to unity do not affect the readings. The accuracy is better than 2.0% of full scale deflection (FSD) over the useful range of 250 mm and better than 0.1% FSD over a range of 110 mm. The magnet's volume is 4.00 mm3 and the moment is 3.1 x 10-7 Vbm. Circuit diagrams are presented and a complete software listing is included, the design will work with any magnet and magnetometer. There are directions for greatly improving the instrument's performance.Natural Environment Research Council

Timing speculation and adaptive reliable overclocking techniques for aggressive computer systems

Computers have changed our lives beyond our own imagination in the past several decades. The continued and progressive advancements in VLSI technology and numerous micro-architectural innovations have played a key role in the design of spectacular low-cost high performance computing systems that have become omnipresent in today\u27s technology driven world. Performance and dependability have become key concerns as these ubiquitous computing machines continue to drive our everyday life. Every application has unique demands, as they run in diverse operating environments. Dependable, aggressive and adaptive systems improve efficiency in terms of speed, reliability and energy consumption. Traditional computing systems run at a fixed clock frequency, which is determined by taking into account the worst-case timing paths, operating conditions, and process variations. Timing speculation based reliable overclocking advocates going beyond worst-case limits to achieve best performance while not avoiding, but detecting and correcting a modest number of timing errors. The success of this design methodology relies on the fact that timing critical paths are rarely exercised in a design, and typical execution happens much faster than the timing requirements dictated by worst-case design methodology. Better-than-worst-case design methodology is advocated by several recent research pursuits, which exploit dependability techniques to enhance computer system performance. In this dissertation, we address different aspects of timing speculation based adaptive reliable overclocking schemes, and evaluate their role in the design of low-cost, high performance, energy efficient and dependable systems. We visualize various control knobs in the design that can be favorably controlled to ensure different design targets. As part of this research, we extend the SPRIT3E, or Superscalar PeRformance Improvement Through Tolerating Timing Errors, framework, and characterize the extent of application dependent performance acceleration achievable in superscalar processors by scrutinizing the various parameters that impact the operation beyond worst-case limits. We study the limitations imposed by short-path constraints on our technique, and present ways to exploit them to maximize performance gains. We analyze the sensitivity of our technique\u27s adaptiveness by exploring the necessary hardware requirements for dynamic overclocking schemes. Experimental analysis based on SPEC2000 benchmarks running on a SimpleScalar Alpha processor simulator, augmented with error rate data obtained from hardware simulations of a superscalar processor, are presented. Even though reliable overclocking guarantees functional correctness, it leads to higher power consumption. As a consequence, reliable overclocking without considering on-chip temperatures will bring down the lifetime reliability of the chip. In this thesis, we analyze how reliable overclocking impacts the on-chip temperature of a microprocessor and evaluate the effects of overheating, due to such reliable dynamic frequency tuning mechanisms, on the lifetime reliability of these systems. We then evaluate the effect of performing thermal throttling, a technique that clamps the on-chip temperature below a predefined value, on system performance and reliability. Our study shows that a reliably overclocked system with dynamic thermal management achieves 25% performance improvement, while lasting for 14 years when being operated within 353K. Over the past five decades, technology scaling, as predicted by Moore\u27s law, has been the bedrock of semiconductor technology evolution. The continued downscaling of CMOS technology to deep sub-micron gate lengths has been the primary reason for its dominance in today\u27s omnipresent silicon microchips. Even as the transition to the next technology node is indispensable, the initial cost and time associated in doing so presents a non-level playing field for the competitors in the semiconductor business. As part of this thesis, we evaluate the capability of speculative reliable overclocking mechanisms to maximize performance at a given technology level. We evaluate its competitiveness when compared to technology scaling, in terms of performance, power consumption, energy and energy delay product. We present a comprehensive comparison for integer and floating point SPEC2000 benchmarks running on a simulated Alpha processor at three different technology nodes in normal and enhanced modes. Our results suggest that adopting reliable overclocking strategies will help skip a technology node altogether, or be competitive in the market, while porting to the next technology node. Reliability has become a serious concern as systems embrace nanometer technologies. In this dissertation, we propose a novel fault tolerant aggressive system that combines soft error protection and timing error tolerance. We replicate both the pipeline registers and the pipeline stage combinational logic. The replicated logic receives its inputs from the primary pipeline registers while writing its output to the replicated pipeline registers. The organization of redundancy in the proposed Conjoined Pipeline system supports overclocking, provides concurrent error detection and recovery capability for soft errors, intermittent faults and timing errors, and flags permanent silicon defects. The fast recovery process requires no checkpointing and takes three cycles. Back annotated post-layout gate-level timing simulations, using 45nm technology, of a conjoined two-stage arithmetic pipeline and a conjoined five-stage DLX pipeline processor, with forwarding logic, show that our approach, even under a severe fault injection campaign, achieves near 100% fault coverage and an average performance improvement of about 20%, when dynamically overclocked

Current-mode processing based Temperature-to-Digital Converters for MEMS applications

This thesis presents novel Temperature-to-Digital Converters (TDCs) designed and fabricated in CMOS technology. These integrated smart temperature sensing circuits are widely employed in the Micro-Electro-Mechanical Systems (MEMS) field in order to mitigate the impact of the ambient temperature on their performance. In this framework, the increasingly stringent demands of the market have led the cost-effectiveness specification of these compensation solutions to an higher and higher level, directly translating into the requirement of more and more compact designs (< 0.1 mm²); in addition to this, considering that the great majority of the systems whose thermal drift needs to be compensated is battery supplied, ultra-low energy-per-conversion (< 10 nJ) is another requirement of primary importance. This thesis provides a detailed description of two different test-chips (mas fuerte and es posible) that have been designed with this orientation and that are the result of three years of research activity; for both devices, the conception, design, layout and testing phases are all described in detail and are supported by simulation and measurement results.This thesis presents novel Temperature-to-Digital Converters (TDCs) designed and fabricated in CMOS technology. These integrated smart temperature sensing circuits are widely employed in the Micro-Electro-Mechanical Systems (MEMS) field in order to mitigate the impact of the ambient temperature on their performance. In this framework, the increasingly stringent demands of the market have led the cost-effectiveness specification of these compensation solutions to an higher and higher level, directly translating into the requirement of more and more compact designs (< 0.1 mm²); in addition to this, considering that the great majority of the systems whose thermal drift needs to be compensated is battery supplied, ultra-low energy-per-conversion (< 10 nJ) is another requirement of primary importance. This thesis provides a detailed description of two different test-chips (mas fuerte and es posible) that have been designed with this orientation and that are the result of three years of research activity; for both devices, the conception, design, layout and testing phases are all described in detail and are supported by simulation and measurement results

Re-thinking Analog Integrated Circuits in Digital Terms: A New Design Concept for the IoT Era

A steady trend towards the design of mostly-digital and digital-friendly analog circuits, suitable to integration in mainstream nanoscale CMOS by a highly automated design flow, has been observed in the last years to address the requirements of the emerging Internet of Things (IoT) applications. In this context, this tutorial brief presents an overview of concepts and design methodologies that emerged in the last decade, aimed to the implementation of analog circuits like Operational Transconductance Amplifiers, Voltage References and Data Converters by digital circuits. The current design challenges and application scenarios as well as the future perspectives and opportunities in the field of digital-based analog processing are finally discussed

Novel Current-Mode Sensor Interfacing and Radio Blocks for Cell Culture Monitoring

Since 2004 Imperial College has been developing the world’s first application-specific instrumentation aiming at the on-line, in-situ, physiochemical monitoring of adult stem cell cultures. That effort is internationally known as the ‘Intelligent Stem Cell Culture Systems’ (ISCCS) project. The ISCCS platform is formed by the functional integration of biosensors, interfacing electronics and bioreactors. Contrary to the PCB-level ISCCS platform the work presented in this thesis relates to the realization of a miniaturized cell culture monitoring platform. Specifically, this thesis details the synthesis and fabrication of pivotal VLSI circuit blocks suitable for the construction of a miniaturized microelectronic cell monitoring platform. The thesis is composed of two main parts. The first part details the design and operation of a two-stage current-input currentoutput topology suitable for three-electrode amperometric sensor measurements. The first stage is a CMOS-dual rail-class AB-current conveyor providing a low impedancevirtual ground node for a current input. The second stage is a novel hyperbolic-sinebased externally-linear internally-non-linear current amplification stage. This stage bases its operation upon the compressive sinh−1 conversion of the interfaced current to an intermediate auxiliary voltage and the subsequent sinh expansion of the same voltage. The proposed novel topology has been simulated for current-gain values ranging from 10 to 1000 using the parameters of the commercially available 0.8μm AMS CMOS process. Measured results from a chip fabricated in the same technology are also reported. The proposed interfacing/amplification architecture consumes 0.88-95μW. The second part describes the design and practical evaluation of a 13.56MHz frequency shift keying (FSK) short-range (5cm) telemetry link suitable for the monitoring of incubated cultures. Prior to the design of the full FSK radio system, a pair of 13.56MHz antennae are characterized experimentally. The experimental S-parameter-value determination of the 13.56MHz wireless link is incorporated into the Cadence Design Framework allowing a high fidelity simulation of the reported FSK radio. The transmitter of the proposed system is a novel multi-tapped seven-stage ring-oscillator-based VCO whereas the core of the receiver is an appropriately modified phase locked loop (PLL). Simulated and measured results from a 0.8μm CMOS technology chip are reported