Scalability of broadcast performance in wireless network-on-chip

Networks-on-Chip (NoCs) are currently the paradigm of choice to interconnect the cores of a chip multiprocessor. However, conventional NoCs may not suffice to fulfill the on-chip communication requirements of processors with hundreds or thousands of cores. The main reason is that the performance of such networks drops as the number of cores grows, especially in the presence of multicast and broadcast traffic. This not only limits the scalability of current multiprocessor architectures, but also sets a performance wall that prevents the development of architectures that generate moderate-to-high levels of multicast. In this paper, a Wireless Network-on-Chip (WNoC) where all cores share a single broadband channel is presented. Such design is conceived to provide low latency and ordered delivery for multicast/broadcast traffic, in an attempt to complement a wireline NoC that will transport the rest of communication flows. To assess the feasibility of this approach, the network performance of WNoC is analyzed as a function of the system size and the channel capacity, and then compared to that of wireline NoCs with embedded multicast support. Based on this evaluation, preliminary results on the potential performance of the proposed hybrid scheme are provided, together with guidelines for the design of MAC protocols for WNoC.Peer ReviewedPostprint (published version

Best bang for your buck: GPU nodes for GROMACS biomolecular simulations

The molecular dynamics simulation package GROMACS runs efficiently on a wide variety of hardware from commodity workstations to high performance computing clusters. Hardware features are well exploited with a combination of SIMD, multi-threading, and MPI-based SPMD/MPMD parallelism, while GPUs can be used as accelerators to compute interactions offloaded from the CPU. Here we evaluate which hardware produces trajectories with GROMACS 4.6 or 5.0 in the most economical way. We have assembled and benchmarked compute nodes with various CPU/GPU combinations to identify optimal compositions in terms of raw trajectory production rate, performance-to-price ratio, energy efficiency, and several other criteria. Though hardware prices are naturally subject to trends and fluctuations, general tendencies are clearly visible. Adding any type of GPU significantly boosts a node's simulation performance. For inexpensive consumer-class GPUs this improvement equally reflects in the performance-to-price ratio. Although memory issues in consumer-class GPUs could pass unnoticed since these cards do not support ECC memory, unreliable GPUs can be sorted out with memory checking tools. Apart from the obvious determinants for cost-efficiency like hardware expenses and raw performance, the energy consumption of a node is a major cost factor. Over the typical hardware lifetime until replacement of a few years, the costs for electrical power and cooling can become larger than the costs of the hardware itself. Taking that into account, nodes with a well-balanced ratio of CPU and consumer-class GPU resources produce the maximum amount of GROMACS trajectory over their lifetime

The Thermal-Constrained Real-Time Systems Design on Multi-Core Platforms -- An Analytical Approach

Over the past decades, the shrinking transistor size enabled more transistors to be integrated into an IC chip, to achieve higher and higher computing performances. However, the semiconductor industry is now reaching a saturation point of Moore’s Law largely due to soaring power consumption and heat dissipation, among other factors. High chip temperature not only significantly increases packing/cooling cost, degrades system performance and reliability, but also increases the energy consumption and even damages the chip permanently. Although designing 2D and even 3D multi-core processors helps to lower the power/thermal barrier for single-core architectures by exploring the thread/process level parallelism, the higher power density and longer heat removal path has made the thermal problem substantially more challenging, surpassing the heat dissipation capability of traditional cooling mechanisms such as cooling fan, heat sink, heat spread, etc., in the design of new generations of computing systems. As a result, dynamic thermal management (DTM), i.e. to control the thermal behavior by dynamically varying computing performance and workload allocation on an IC chip, has been well-recognized as an effective strategy to deal with the thermal challenges. Over the past decades, the shrinking transistor size, benefited from the advancement of IC technology, enabled more transistors to be integrated into an IC chip, to achieve higher and higher computing performances. However, the semiconductor industry is now reaching a saturation point of Moore’s Law largely due to soaring power consumption and heat dissipation, among other factors. High chip temperature not only significantly increases packing/cooling cost, degrades system performance and reliability, but also increases the energy consumption and even damages the chip permanently. Although designing 2D and even 3D multi-core processors helps to lower the power/thermal barrier for single-core architectures by exploring the thread/process level parallelism, the higher power density and longer heat removal path has made the thermal problem substantially more challenging, surpassing the heat dissipation capability of traditional cooling mechanisms such as cooling fan, heat sink, heat spread, etc., in the design of new generations of computing systems. As a result, dynamic thermal management (DTM), i.e. to control the thermal behavior by dynamically varying computing performance and workload allocation on an IC chip, has been well-recognized as an effective strategy to deal with the thermal challenges. Different from many existing DTM heuristics that are based on simple intuitions, we seek to address the thermal problems through a rigorous analytical approach, to achieve the high predictability requirement in real-time system design. In this regard, we have made a number of important contributions. First, we develop a series of lemmas and theorems that are general enough to uncover the fundamental principles and characteristics with regard to the thermal model, peak temperature identification and peak temperature reduction, which are key to thermal-constrained real-time computer system design. Second, we develop a design-time frequency and voltage oscillating approach on multi-core platforms, which can greatly enhance the system throughput and its service capacity. Third, different from the traditional workload balancing approach, we develop a thermal-balancing approach that can substantially improve the energy efficiency and task partitioning feasibility, especially when the system utilization is high or with a tight temperature constraint. The significance of our research is that, not only can our proposed algorithms on throughput maximization and energy conservation outperform existing work significantly as demonstrated in our extensive experimental results, the theoretical results in our research are very general and can greatly benefit other thermal-related research

Space Station Freedom data management system growth and evolution report

The Information Sciences Division at the NASA Ames Research Center has completed a 6-month study of portions of the Space Station Freedom Data Management System (DMS). This study looked at the present capabilities and future growth potential of the DMS, and the results are documented in this report. Issues have been raised that were discussed with the appropriate Johnson Space Center (JSC) management and Work Package-2 contractor organizations. Areas requiring additional study have been identified and suggestions for long-term upgrades have been proposed. This activity has allowed the Ames personnel to develop a rapport with the JSC civil service and contractor teams that does permit an independent check and balance technique for the DMS