Skybridge: 3-D Integrated Circuit Technology Alternative to CMOS

Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, scaling to sub-20nm technologies is proving to be challenging as MOSFETs are reaching their fundamental limits and interconnection bottleneck is dominating IC operational power and performance. Migrating to 3-D, as a way to advance scaling, has eluded us due to inherent customization and manufacturing requirements in CMOS that are incompatible with 3-D organization. Partial attempts with die-die and layer-layer stacking have their own limitations. We propose a 3-D IC fabric technology, Skybridge[TM], which offers paradigm shift in technology scaling as well as design. We co-architect Skybridge's core aspects, from device to circuit style, connectivity, thermal management, and manufacturing pathway in a 3-D fabric-centric manner, building on a uniform 3-D template. Our extensive bottom-up simulations, accounting for detailed material system structures, manufacturing process, device, and circuit parasitics, carried through for several designs including a designed microprocessor, reveal a 30-60x density, 3.5x performance per watt benefits, and 10X reduction in interconnect lengths vs. scaled 16-nm CMOS. Fabric-level heat extraction features are shown to successfully manage IC thermal profiles in 3-D. Skybridge can provide continuous scaling of integrated circuits beyond CMOS in the 21st century.Comment: 53 Page

Interconnects architectures for many-core era using surface-wave communication

PhD ThesisNetworks-on-chip (NoCs) is a communication paradigm that has emerged aiming to address on-chip communication challenges and to satisfy interconnection demands for chip-multiprocessors (CMPs). Nonetheless, there is continuous demand for even higher computational power, which is leading to a relentless downscaling of CMOS technology to enable the integration of many-cores. However, technology downscaling is in favour of the gate nodes over wires in terms of latency and power consumption. Consequently, this has led to the era of many-core processors where power consumption and performance are governed by inter-core communications rather than core computation. Therefore, NoCs need to evolve from being merely metalbased implementations which threaten to be a performance and power bottleneck for many-core efficiency and scalability. To overcome such intensified inter-core communication challenges, this thesis proposes a novel interconnect technology: the surface-wave interconnect (SWI). This new RF-based on-chip interconnect has notable characteristics compared to cutting-edge on-chip interconnects in terms of CMOS compatibility, high speed signal propagation, low power dissipation, and massive signal fan-out. Nonetheless, the realization of the SWI requires investigations at different levels of abstraction, such as the device integration and RF engineering levels. The aim of this thesis is to address the networking and system level challenges and highlight the potential of this interconnect. This should encourage further research at other levels of abstraction. Two specific system-level challenges crucial in future many-core systems are tackled in this study, which are cross-the-chip global communication and one-to-many communication. This thesis makes four major contributions towards this aim. The first is reducing the NoC average-hop count, which would otherwise increase packet-latency exponentially, by proposing a novel hybrid interconnect architecture. This hybrid architecture can not only utilize both regular metal-wire and SWI, but also exploits merits of both bus and NoC architectures in terms of connectivity compared to other general-purpose on-chip interconnect architectures. The second contribution addresses global communication issues by developing a distance-based weighted-round-robin arbitration (DWA) algorithm. This technique prioritizes global communication to be send via SWI short-cuts, which offer more efficient power dissipation and faster across-the-chip signal propagation. Results obtained using a cycleaccurate simulator demonstrate the effectiveness of the proposed system architecture in terms of significant power reduction, considervii able average delay reduction and higher throughput compared to a regular NoC. The third contribution is in handling multicast communications, which are normally associated with traffic overload, hotspots and deadlocks and therefore increase, by an order of magnitude the power consumption and latency. This has been achieved by proposing a novel routing and centralized arbitration schemes that exploits the SWI0s remarkable fan-out features. The evaluation demonstrates drastic improvements in the effectiveness of the proposed architecture in terms of power consumption ( 2-10x) and performance ( 22x) but with negligible hardware overheads ( 2%). The fourth contribution is to further explore multicast contention handling in a flexible decentralized manner, where original techniques such as stretch-multicast and ID-tagging flow control have been developed. A comparison of these techniques shows that the decentralized approach is superior to the centralized approach with low traffic loads, while the latter outperforms the former near and after NoC saturation

Development of a Waveform Sampling ASIC with Femtosecond Timing for a Low Occupancy Vertex Detector.

Ph.D. Thesis. University of Hawaiʻi at Mānoa 2018