A Contamination Sensor Based on an Array of Microfibers with Nanoscale-Structured Film

A contamination sensor based on an array of microfibers with nanoscale-structured film using evanescent field is proposed and demonstrated theoretically and experimentally. When the molecular contaminants deposit on the nanoscale-structured film, the refractive index of the film will change and the additional loss will be produced due to the disturbance of evanescent field. The possibility of the sensor is demonstrated theoretically by using three-dimensional finite-difference time domain (3D-FDTD). The corresponding experiments have also been carried out in order to demonstrate the theoretical results. Microfibers are fabricated by using hydrogen-oxygen flame-heated scanning fiber drawing method and the nanoscale-structured film coated on the surface of microfibers is deposited by using dip coating process. Then an array of microfibers is assembled to demonstrate the feasibility of the device. The experimental results show that contaminants detection with the device can agree well with the results measured by the laser-scattering particle counter, which demonstrates the feasibility of the new type of contaminant sensor. The device can be used to monitor contaminants on-line in the high-power laser system

Piezoelectric Transformer and Hall-Effect Based Sensing and Disturbance Monitoring Methodology for High-Voltage Power Supply Lines

Advancements in relaying algorithms have led to an accurate and robust protection system widely used in power distribution. However, in low power sections of relaying systems, standard voltage and current measurement techniques are still used. These techniques have disadvantages like higher cost, size, electromagnetic interference, resistive losses and measurement errors and hence provide a number of opportunities for improvement and integration. We present a novel microsystem methodology to sense low-power voltage and current signals and detect disturbances in high-voltage power distribution lines. The system employs dual sensor architecture that consists of a piezoelectric transformer in combination with Hall-effect sensor, used to detect the disturbances whose harmonics are in the kHz frequency range. Our numerical analysis is based on three-dimensional finite element models of the piezoelectric transformer (PT) and the principle of Hall-effect based “Integrated Magnetic Concentrator (IMC)” sensor. This model is verified by using experimental data recorded in the resonant frequency and low frequency regions of operation of PT for voltage sensing. Actual measurements with the commercial IMC sensor too validate the modelling results. These results describe a characteristic low frequency behaviour of rectangular piezoelectric transformer, which enables it to withstand voltages as high as 150V. In the frequency range of 10Hz to 250Hz, the PT steps down 10-150V input with a linearity of ±1%. The recorded group delay data shows that propagation delay through PT reduces to few microseconds above 1kHz input signal frequency. Similarly, the non-intrusive current sensor detects current with a response time of 8μs and converts the current into corresponding output voltage. These properties, in addition to frequency spectrum of voltage and current input signals, have been used to develop a signal processing and fault detection system for two real-time cases of faults to produce a 6-bit decision logic capable of detecting various types of line disturbances in less than 3ms of delay

A novel traveling-wave-based method improved by unsupervised learning for fault location of power cables via sheath current monitoring

In order to improve the practice in maintenance of power cables, this paper proposes a novel traveling-wave-based fault location method improved by unsupervised learning. The improvement mainly lies in the identification of the arrival time of the traveling wave. The proposed approach consists of four steps: (1) The traveling wave associated with the sheath currents of the cables are grouped in a matrix; (2) the use of dimensionality reduction by t-SNE (t-distributed Stochastic Neighbor Embedding) to reconstruct the matrix features in a low dimension; (3) application of the DBSCAN (density-based spatial clustering of applications with noise) clustering to cluster the sample points by the closeness of the sample distribution; (4) the arrival time of the traveling wave can be identified by searching for the maximum slope point of the non-noise cluster with the fewest samples. Simulations and calculations have been carried out for both HV (high voltage) and MV (medium voltage) cables. Results indicate that the arrival time of the traveling wave can be identified for both HV cables and MV cables with/without noise, and the method is suitable with few random time errors of the recorded data. A lab-based experiment was carried out to validate the proposed method and helped to prove the effectiveness of the clustering and the fault location

Integrated sensors for robotic laser welding

A welding head is under development with integrated sensory systems for robotic laser welding applications. Robotic laser welding requires sensory systems that are capable to accurately guide the welding head over a seam in three-dimensional space and provide information about the welding process as well as the quality of the welding result. In this paper the focus is on seam tracking. It is difficult to measure three-dimensional parameters of a ream during a robotic laser welding task, especially when sharp corners are present. The proposed sensory system is capable to provide the three dimensional parameters of a seam in one measurement and guide robots over sharp corners

Sensor integration for robotic laser welding processes

The use of robotic laser welding is increasing among industrial applications, because of its ability to weld objects in three dimensions. Robotic laser welding involves three sub-processes: seam detection and tracking, welding process control, and weld seam inspection. Usually, for each sub-process, a separate sensory system is required. The use of separate sensory systems leads to heavy and bulky tools, in contrast to compact and light sensory systems that are needed to reach sufficient accuracy and accessibility. In the solution presented in this paper all three subprocesses are integrated in one compact multipurpose welding head. This multi-purpose tool is under development and consists of a laser welding head, with integrated sensors for seam detection and inspection, while also carrying interfaces for process control. It can provide the relative position of the tool and the work piece in three-dimensional space. Additionally, it can cope with the occurrence of sharp corners along a three-dimensional weld path, which are difficult to detect and weld with conventional equipment due to measurement errors and robot dynamics. In this paper the process of seam detection will be mainly elaborated

An overview of microflown technologies

The Microflown is an acoustic sensor measuring particle velocity instead of sound pressure, which is usually measured by conventional microphones. Since its recent invention it is mostly used for measurement purposes (1D and 3D-sound intensity measurement and acoustic impedance). The Microflown is also used for measuring DC-flows, that can be considered as particle velocity with a frequency of 0Hz. Furthermore the Microflown is used in the professional audio as a low frequency add on microphone for pressure gradient microphones (figure of eight; directional microphones). Due to its small dimensions and silicon based production method the Microflown is very suitable for mobile applications like mobile telephones or smartcards. Nowadays sound-energy determination, array applications and three-dimensional impulse response are under investigation. Although the Microflown was invented only some years ago, the device is already commercially available

Optimization of a Thermal Flow Sensor for Acoustic Particle Velocity Measurements

In this paper, a thermal flow sensor consisting of two or three heated wires, the Microflown, is treated for application to acoustic measurements. It is sensitive to flow ("particle velocity"), contrary to conventional microphones that measure acoustic pressures. A numerical analysis, allowing for detailed parametric studies, is presented. The results are experimentally verified. Consequently, improved devices were fabricated, and also sensors with a new geometry consisting of three wires, instead of the usual two, of which the central wire is relatively most heated. These devices are the best performing Microflowns to date with a frequency range extending from 0 to over 5 kHz and a minimum detectable particle velocity level of about 70 nm/s at 2 to 5 kHz (i.e., 3 dB PVL or SPL, corresponding to a pressure of 3.1/spl middot/10/sup -5/ Pa at a free field specific acoustic impedance)

Extending systems-on-chip to the third dimension : performance, cost and technological tradeoffs.

Because of the today's market demand for high-performance, high-density portable hand-held applications, electronic system design technology has shifted the focus from 2-D planar SoC single-chip solutions to different alternative options as tiled silicon and single-level embedded modules as well as 3-D integration. Among the various choices, finding an optimal solution for system implementation dealt usually with cost, performance and other technological trade-off analysis at the system conceptual level. It has been identified that the decisions made within the first 20% of the total design cycle time will ultimately result up to 80% of the final product cost. In this paper, we discuss appropriate and realistic metric for performance and cost trade-off analysis both at system conceptual level (up-front in the design phase) and at implementation phase for verification in the three-dimensional integration. In order to validate the methodology, two ubiquitous electronic systems are analyzed under various implementation schemes and discuss the pros and cons of each of them