Spectroscopic investigation of quantum confinement effects in ion implanted silicon-on-sapphire films

Crystalline Silicon-on-Sapphire (SOS) films were implanted with boron (B$^+$) and phosphorous (P$^+$) ions. Different samples, prepared by varying the ion dose in the range $10^{14}$ to 5 x $10^{15}$ and ion energy in the range 150-350 keV, were investigated by the Raman spectroscopy, photoluminescence (PL) spectroscopy and glancing angle x-ray diffraction (GAXRD). The Raman results from dose dependent B$^+$ implanted samples show red-shifted and asymmetrically broadened Raman line-shape for B$^+$ dose greater than $10^{14}$ ions cm$^{-2}$. The asymmetry and red shift in the Raman line-shape is explained in terms of quantum confinement of phonons in silicon nanostructures formed as a result of ion implantation. PL spectra shows size dependent visible luminescence at $\sim$ 1.9 eV at room temperature, which confirms the presence of silicon nanostructures. Raman studies on P$^+$ implanted samples were also done as a function of ion energy. The Raman results show an amorphous top SOS surface for sample implanted with 150 keV P$^+$ ions of dose 5 x $10^{15}$ ions cm$^{-2}$. The nanostructures are formed when the P$^+$ energy is increased to 350 keV by keeping the ion dose fixed. The GAXRD results show consistency with the Raman results.Comment: 9 Pages, 6 Figures and 1 Table, \LaTex format To appear in SILICON(SPRINGER

On the Trade-Off Between Quality Factor and Tuning Ratio in Tunable High-Frequency Capacitors

A benchmark of tunable and switchable devices at microwave frequencies is presented on the basis of physical limitations to show their potential for reconfigurable cellular applications. Performance limitations are outlined for each given technology focusing on the quality factor (Q) and tuning ratio (eta) as figures of merit. The state of the art in terms of these figures of merit of several tunable and switchable technologies is visualized and discussed. If the performance of these criteria is not met, the application will not be feasible. The quality factor can typically be traded off for tuning ratio. The benchmark of tunable capacitor technologies shows that transistor-switched capacitors, varactor diodes, and ferroelectric varactors perform well at 2 GHz for tuning ratios below 3, with an advantage for GaAs varactor diodes. Planar microelectromechanical capacitive switches have the potential to outperform all other technologies at tuning ratios higher than 8. Capacitors based on tunable dielectrics have the highest miniaturization potential, whereas semiconductor devices benefit from the existing manufacturing infrastructure

Contributing Towards Improved Communication Systems for Future Cellular Networks

The rapid growth of wireless communications and upcoming requirements of 5G networks are driving interest in the areas from wireless transceivers to sensor nodes. One of the most vital components of the wireless transmitter is the radio frequency power amplifier. A large-signal device model of the transistor is an essential part of the power amplifier design process. Despite the significant developments in large-signal modelling, the models for commercially available devices from the manufacturers are still under continuous development and often lack accuracy. One of the main objectives of this thesis is the validation and extension of an analytic approach as an alternative to conventional large-signal modelling for power amplifier designing. The first contribution is the derivation of new analytical expressions based on the equivalent circuit model, including the extrinsic parasitic elements introduced by the package, to calculate the optimum source and load impedances and to predict the performance of a radio frequency power amplifier. These expressions allow to evaluate the effects of a package on the optimum impedance values and performance. The second contribution is establishing the accuracy of the analytic approach. Harmonic balance simulation is used as the first benchmark to evaluate the method at various bias points and frequencies. The validity of the analytic approach is demonstrated at a frequency of 3.25 GHz for gallium nitride based high power devices with measurement of prototype radio frequency power amplifier designed for the impedance values obtained from the analytic expressions. The third contribution is extending the analytic approach to determine the optimum impedance values for different criteria of maximum gain, linearity and efficiency. The analytic expressions are utilized to gain an understanding of the relationship among the device performance, the elements of devices and package models and I-V characteristics. The wireless sensor networks are essential elements for the realization of the Internet of Things. Sensor nodes, which are the fundamental building blocks of these networks, have to be energy efficient and able to produce energy to reduce the maintenance cost and to prolong their lifetime. The second main aim of the thesis is designing and implementing an ultra-low power autonomous wireless sensor node that harvests the indoor light energy. The forth contribution of this thesis includes a comprehensive comparison of six different solar cell technologies under a controlled light intensity, carried out to determine the best option for indoor light energy harvesting. The power consumption of the node is reduced by selecting the appropriate hardware and implementing a wake-up receiver to reduce the active and idle mode currents. The low power consumption coupled with light energy harvesting significantly prolong the operating lifetime of the node

Modélisation distribuée et évolutive du GaN HEMT

L’industrie de télécommunication et les satellites se base majoritairement sur les technologies Si et GaAs. La demande croissante des hauts débits de données entraine une facture élevée en énergie. En outre, la saturation de la bande des basses fréquences, le besoin des débits élevés et les exigences de la haute puissance imposait l’utilisation de la bande hautes fréquences. Dans le but de résoudre les problèmes cités auparavant, la technologie GaN est introduite comme un candidat prometteur qui peut offrir de la haute puissance, taille du circuit plus faible avec une meilleure stabilité mécanique aux environnements hostiles/milieux agressifs. À titre d’exemple, l‘agence spatiale européenne sont en cours de développement d’un circuit à base du GaN sur substrat en Si pour faible cout, une hautes performance et une grande fiabilité. La technologie GaN est assez mature pour proposer de nouveaux systèmes intégrés utilisés pour les puissances microonde ce qui permet une réduction considérable de la taille du système. Étant un semiconducteur à grande bande interdite, GaN peut offrir une haute puissance sous hautes températures (>225oC) avec une bonne stabilité mécanique. Elle présente un facteur de bruit faible, qui est intéressant notamment pour les circuits intégrés aux ondes millimétriques. À noter que la mobilité du GaN par rapport à la température est assez élevée pour proposer des amplificateurs dans la bande W. Avec le progrès du procédé de fabrication du GaN, notre objectif est l’introduction de cette technologie dans des applications industrielles. À cette fin, on désire avoir un modèle du dispositif qui correspond à la meilleure performance. Ensuite, on veut le valider dans une modélisation du circuit. Cette thèse, basée sur la technologie GaN unique développée au 3IT, a pour objectif l’amélioration de l’outil de conception en réduisant son erreur avec une validation de son utilisation dans la conception du circuit. Ce travail est réalisé pour la première fois au 3IT avec des résultats de simulation pour une conception idéale d’un circuit MMIC ainsi que sa démonstration. Une caractérisation des échantillons a été réalisée avec objectif d’extraction de données qui vont servir à l’alimentation de modélisation des transistors sur l’outil ADS. Une fois complétée, la modélisation a été validée par une modélisation des petits et grands signaux et a été testée par une mesure load-pull. Enfin, ce modèle a été utilisé lors de la conception d’un amplificateur pour les applications RF. L’innovation de ce travail réside dans la modélisation de la résistance d’une grille large sous forme de quadripôles parallèles à structure 3D (ou à résistances de grille distribuées) du transistor MOSHEMT GaN. La conception et la fabrication de l’amplificateur à haute puissance (HPA) aux fréquences microondes (≤4GHz) sont réalisés au LNN du 3IT et inclus une couche d’oxyde de grille afin de réduire le courant de fuite notamment pour les tensions Vgs élevées, la grille du transistor forme un serpentin pour fournir une puissance de sortie élevée avec un encombrement spatial minimal et une grille présentant une électrode de champ pour permettre d’augmenter la tension de claquage.Abstract : The telecommunication and satellite industry is mainly relying on Si and GaAs technologies as the demand for a high data rate is continuously growing, leading to higher power consumption. Moreover, the lower frequency band's saturation, the need for high data rate, and high-power force to utilize the high-frequency band. In pursuit of solving the issues mentioned earlier, GaN technology has been introduced as a promising candidate that can offer high power at a smaller circuit footprint and higher mechanical stability in harsh environments. For example, currently, the European space agency (ESA) is developing an integrated circuit with GaN on Si substrate for low cost, high performance, and high reliability. GaN technology is sufficiently mature to propose integrated new systems which are needed for microwave power range. This technology reduces the size of the system considerably. GaN is a wide bandgap semiconductor which can offer remarkably high power at high temperature (>225℃), and it is very stable mechanically. It presents a low noise factor, very interesting for a millimeter-wave integrated circuit. Finally, the mobility of GaN vs. temperature is sufficiently elevated to propose a power amplifier in W-Band. With the improvement of the GaN process, our objective is to introduce this technology for industrial applications. For this purpose, we wish to have a better model of the device that corresponds to the best performance and then validate it by using this model in a circuit. Based on the 3IT's GaN process, which is unique in its context, this thesis aims to improve the design kit by reducing the design model's error and validating it by using it in circuit design. This work is the first to realize in 3IT with simulation results to design an MMIC circuit for demonstration. I first characterized the new samples by performing different measurements than using these measurement data; transistor is modeled in ADS software. Once the model was completed, it is validated by small-signal modeling, and then the large-signal model is tested with non-linear capacitances, current source, and transconductance modeling. Finally, we used this model to design a power amplifier for RF application. The innovation comes from modeling large gate resistance as distributed gate resistance for GaN MOSHEMT transistor and then designing high-power amplifier (HPA) in the frequency range (≤ 4GHz) while using 3IT GaN process which includes first oxide layer to have low gate current and more voltage of Vgs, the second transistor is meander to have high power and third, field plate - gate for high breakdown voltage

Gallium nitride-based microwave high-power heterostructure field-effect transistors

The research described in this thesis has been carried out within a joint project between the Radboud Universiteit Nijmegen (RU) and the Technische Universiteit Eindhoven (TU/e) with the title: "Performance enhancement of GaN-based microwave power amplifiers: material, device and design issues". This project has been granted by the Dutch Technology Foundation STW under project number NAF 5040. The aims of this project have been to develop the technology required to grow state-of-the-art AlGaN/GaN epilayers on sapphire and semi-insulating (s.i.) SiC substrates using metal organic chemical vapor deposition (MOCVD) and to fabricate microwave (f > 1 GHz) high-power (Pout > 10 W) heterostructure field-effect transistors (HFETs) on these epitaxial films. MOCVD growth of AlGaN/GaN epilayers and material characterization has been done within the group Applied Materials Science (AMS) of RU. Research at the Opto-Electronic Devices group (OED) of TU/e has focused on both electrical characterization of AlGaN/GaN epilayers and design, process technology development, and characterization of GaN-based HFETs and CPW passive components. Although a considerable amount of work has been done during this research with respect to processing of CPW passive components on s.i. SiC substrates, this thesis focused on active AlGaN/GaN devices only. GaN is an excellent option for high-power/high-temperature microwave applications because of its high electric breakdown field (3 MV/cm) and high electron saturation velocity (1.5 x 107 cm/s). The former is a result of the wide bandgap (3.44 eV at RT) and enables the application of high supply voltages (> 50 V), which is one of the two requirements for highpower device performance. In addition, the wide bandgap allows the material to withstand much higher operating temperatures (300oC - 500oC) than can the conventional semiconductor materials such as Si, GaAs, and InP. A big advantage of GaN over SiC is the possibility to grow heterostructures, e.g. AlGaN/GaN. The resulting two-dimensional electron gas (2DEG) at the AlGaN/GaN heterojunction serves as the conductive channel. Large drain currents (> 1 A/mm), which are the second requirement for a power device, can be achieved because of the high electron sheet densities (> 1 x 1013 cm-2) and high electron saturation velocity. These material properties clearly indicate why GaN is a very suitable candidate for next-generation microwave high-power/high-temperature applications such as high-power amplifiers (HPAs) for GSM base stations, and microwave monolithic integrated circuits (MMICs) for radar systems. In this thesis we have presented the design, technology, and measurement results of n.i.d. AlGaN/GaN:Fe HFETs grown on s.i. 4H-SiC substrates by MOCVD. These devices have submicrometer T- or FP-gates with a gate length (Lg) of 0.7 µm and total gate widths (Wg) of 0.25 mm, 0.5 mm, and 1.0 mm, respectively. The 1.0 mm devices are capable of producing a maximum microwave output power (Pout) of 11.9 W at S-band (2 GHz - 4 GHz) using class AB bias conditions of VDS = 50 V and VGS = -4.65 V. It has to be noted that excellent scaling of Pout with Wg has been demonstrated. In addition, the associated power gain (Gp) ranges between 15 dB and 20 dB, and for the power added efficiency (PAE) values from 54 % up to 70 % have been obtained. These results clearly illustrate both the successful development of the MOCVD growth process, and the successful development and integration of process modules such as ohmic and Schottky contact technology, device isolation, electron beam lithography, surface passivation, and air bridge technology, into a process flow that enables the fabrication of state-of-the-art large periphery n.i.d. AlGaN/GaN:Fe HFETs on s.i. SiC substrates, which are perfectly suitable for application in e.g. HPAs at S-band

Simulation of superjunction MOSFET devices

Master'sMASTER OF ENGINEERIN

Optimization of power MOSFET devices suitable for integrated circuits

Táto doktorská práca sa zaoberá návrhom laterálnych výkonových tranzistorov s nízkym špecifickým odporom pri zapnutom stave, vhodných pre integráciu do Integrovaných Obvodov.This doctoral thesis deals with the design of lateral power transistor with lower specific on-resistance for integration into IC.The new model of MOSFET with waffle gate pattern is there described. For first, time the conformal transformation the Schwarz-Christoffel mapping has been used for the description of nonhomogeneous current distribution in the channel area of MOSFET with waffle gate pattern. In addition base on the figure of merit definition Area Increment (AI) the topological theoretical limit of MOSFET with waffle gate pattern has been a first time defined

O impacto dos efeitos da memória de longo termo na linearizabilidade de amplificadores de potência baseados em AlGaN/GaN HEMT

AlGaN/GaN High Electron Mobility Transistor (HEMT)s are among the preferred options for radio-frequency power amplification in cellular base station transmitters and radar applications. However, despite their promising outlook, the pervasiveness of trapping effects makes them resilient to conventional digital predistortion schemes, which not only decrease their current range of applications but could also preclude their integration in future small cells and multiple-input multiple-output architectures where simpler predistortion schemes are mandatory. So, this PhD thesis aims at developing a meaningful link between the device physics and the linearizability of the AlGaN/GaN HEMT-based Power Amplifier (PA). In order to bridge this gap, this thesis begins with a clear explanation for the mechanisms governing the dominant source of trapping effects in standard AlGaN/GaN HEMTs, namely buffer traps. Based on this knowledge, we explain why the best known physically-supported trapping models, used to represent these devices, are insufficient and present a possible improvement to what we consider to be the most accurate model, supported by Technology Computer-Aided Design (TCAD) simulations. This has also been corroborated through a novel double-pulse technique able to describe experimentally both the capture and emission transients in a wide temporal span under guaranteed isothermal conditions. The measured stretched capture transients validated our understanding of the process while the temperature dependence of the emission profiles confirmed buffer traps as the dominant source of trapping effects. Finally, through both simulations and experimental results, we elaborate here the relationship between the emission time constant and the achievable linearity of GaN HEMT-based PAs, showing that the worst-case scenario happens when the emission time constant is on the order of the time between consecutive envelope peaks above a certain amplitude threshold. This is the case in which we observed a more pronounced hysteresis on the gain and phase-shift characteristics, and so, a stronger impact of the memory effects. The main outcome of this thesis suggests that the biggest linearizability concern in standard AlGaN/GaN HEMT-based PAs lies on the large emission time constants of buffer traps.AlGaN/GaN HEMTs estão entre as opções preferidas para amplificação de potência de radiofrequência em transmissores de estacão base celular e aplicações de radar. No entanto, apesar de sua perspetiva promissora, a influência dos efeitos de defeitos com níveis profundos torna-os imunes aos esquemas convencionais de pre-distorção digital. Assim, esta tese de doutoramento visa desenvolver uma ligação significativa entre a física do dispositivo e a linearização de amplificadores de potência baseados em Al- GaN/GaN HEMTs. Por forma a preencher esta lacuna, esta tese começa com uma explicação clara dos mecanismos que governam a fonte dominante de efeitos de defeitos com níveis profundos em AlGaN/GaN HEMTs standard, especificamente defeitos no buffer. Com base neste conhecimento, são aparentadas as falhas dos modelos físicos mais conhecidos de defeitos de nível profundo usados para representar estes dispositivos, assim como uma possível melhoria suportada em simulações de TCAD. Isto é também corroborado por uma nova técnica de duplo-pulso capaz de descrever experimentalmente os transientes de captura e emissão num amplo intervalo temporal sob condições isotérmicas. Os transientes de captura medidos validam a nossa compreensão do processo, enquanto que a dependência da temperatura nos perfis de emissão confirmou os defeitos no buffer como a fonte dominante de efeitos de defeitos com níveis profundos. Por fim, através de simulações e resultados experimentais, elabora-se aqui a relação entre a constante de tempo de emissão e a linearizabilidade dos amplificadores baseados em AlGaN/GaN HEMT, mostrando que o pior cenário acontece quando a constante de tempo de emissão é da mesma ordem do tempo entre picos consecutivos da envolvente acima de um certo limiar de amplitude. Este é o caso para o qual se observa uma histerese mais pronunciada nas características de ganho e fase e, consequentemente, um impacto mais forte dos efeitos de memória. O resultado principal desta tese sugere que a maior preocupação na linearização de amplificadores baseados em AlGaN/GaN HEMTs standard está nas grandes constantes de tempo de emissão dos defeitos no buffer.Programa Doutoral em Engenharia Eletrotécnic

Oxide bypassed power MOSFET devices

Master'sMASTER OF ENGINEERIN