A Survey of Memristive Threshold Logic Circuits

In this paper, we review the different memristive threshold logic (MTL) circuits that are inspired from the synaptic action of flow of neurotransmitters in the biological brain. Brain like generalisation ability and area minimisation of these threshold logic circuits aim towards crossing the Moores law boundaries at device, circuits and systems levels.Fast switching memory, signal processing, control systems, programmable logic, image processing, reconfigurable computing, and pattern recognition are identified as some of the potential applications of MTL systems. The physical realization of nanoscale devices with memristive behaviour from materials like TiO2, ferroelectrics, silicon, and polymers has accelerated research effort in these application areas inspiring the scientific community to pursue design of high speed, low cost, low power and high density neuromorphic architectures

Which type of solar cell is best for low power indoor devices?

Low power devices such as sensors and wireless communication nodes, focused towards indoor applications, face serious challenges in terms of harvesting nearby natural sources of energy for power. Nowadays, these wireless systems use batteries as source of energy. These batteries need to be replaced in due time and this factor plays a major role in determining the life of the device. Often, the cost of replacing the battery outweighs the cost of the device itself. Also from an environmental perspective, reducing battery waste is laudable. In order to obtain an “infinite” lifetime of the system, the device should be able to harvest energy from renewable resources in the device’s environment. Photovoltaic (PV) energy is an efficient natural energy source for outdoor applications. However, for indoor applications, the efficiency of classical crystalline silicon PV cells is much lower. Typically, the light intensity under artificial lighting conditions found in offices and homes is less than 10 W/m² as compared to 100-1000 W/m² under outdoor conditions. Moreover, the spectrum is different from the outdoor solar spectrum. Although the crystalline Si cell is still dominating the PV market, second generation solar cells, i.e. thin film technologies, are rapidly entering the market. The different PV cells are rated by their power output under standard test conditions (AM1.5 global spectrum and light intensity of 1000 W/m²) but those conditions are not relevant for indoor applications. The question therefore arises: which type of solar cell is best for indoor devices? This paper contributes to answering that question by comparing the power output of different thin film solar cells (CdTe, CIGS, amorphous Si, GaAs and an organic cell with active layer P3HT:PCBM) with the classical crystalline silicon solar cell as reference. This comparison is made for typical artificial light sources, i.e. an LED lamp, a “warm” and a “cool” fluorescent tube and a common incandescent and halogen lamp, which are compared to the outdoor AM1.5 spectrum as reference. All light sources (including the outdoor spectrum) are scaled to an illumination of 500 lux to obtain a correct comparison. The best artificial light source for all cell types is the incandescent lamp which, for Si and CIGS, improves the performance of the cell with a factor of 3 compared with AM 1.5. The LED lamp is the worst light source for indoor PV with a decrease in performance of a quarter for amorphous silicon to two thirds for crystalline silicon cells. The best solar cells for indoor use depend heavily on the light source. For an incandescent lamp, crystalline silicon remains the best. However, for an LED lamp or “warm” fluorescent tube, amorphous silicon is significantly better. For “cold” fluorescent tubes as light sources, CdTe solar cells perform the best

Integrated capacitors for conductive lithographic film circuits

This paper reports on fabrication of low-value embedded capacitors in conductive lithographic film (CLF) circuit boards. The CLF process is a low-cost and high speed manufacturing technique for flexible circuits and systems. We report on the construction and electrical characteristics of CLF capacitor structures printed onto flexible substrates. These components comprise a single polyester dielectric layer, which separates the printed electrode films. Multilayer circuit boards with printed components and interconnect can be fabricated using this technique

Microwave integrated circuit for Josephson voltage standards

A microwave integrated circuit comprised of one or more Josephson junctions and short sections of microstrip or stripline transmission line is fabricated from thin layers of superconducting metal on a dielectric substrate. The short sections of transmission are combined to form the elements of the circuit and particularly, two microwave resonators. The Josephson junctions are located between the resonators and the impedance of the Josephson junctions forms part of the circuitry that couples the two resonators. The microwave integrated circuit has an application in Josephson voltage standards. In this application, the device is asymmetrically driven at a selected frequency (approximately equal to the resonance frequency of the resonators), and a d.c. bias is applied to the junction. By observing the current voltage characteristic of the junction, a precise voltage, proportional to the frequency of the microwave drive signal, is obtained

3D lithium ion batteries—from fundamentals to fabrication

3D microbatteries are proposed as a step change in the energy and power per footprint of surface mountable rechargeable batteries for microelectromechanical systems (MEMS) and other small electronic devices. Within a battery electrode, a 3D nanoarchitecture gives mesoporosity, increasing power by reducing the length of the diffusion path; in the separator region it can form the basis of a robust but porous solid, isolating the electrodes and immobilising an otherwise fluid electrolyte. 3D microarchitecture of the whole cell allows fabrication of interdigitated or interpenetrating networks that minimise the ionic path length between the electrodes in a thick cell. This article outlines the design principles for 3D microbatteries and estimates the geometrical and physical requirements of the materials. It then gives selected examples of recent progress in the techniques available for fabrication of 3D battery structures by successive deposition of electrodes, electrolytes and current collectors onto microstructured substrates by self-assembly methods

Exploitation of Transparent Conductive Oxides in the Implementation of a Window-Integrated Wireless Sensor Node

Exploitation of transparent conductive oxides (TCO) to implement an energy-autonomous sensor node for a wireless sensor network (WSN) is studied and a practical solution presented. In the practical implementations, flexible and rigid substrates that is polyimide and glass, are coated with TCO, namely aluminum doped zinc oxide (AZO). AZO-coated flexible substrates are used to form thermoelectric generators (TEG) that produce electricity for the sensor electronics of the node from thermal gradients on a window. As the second solution to utilize AZO, its conductive properties are exploited to implement transparent antennas for the sensor node. Antennas for a UHF RFID transponder and the Bluetooth radio of the node are implemented. A prototype of a flexible transparent TEG, with the area of 67 cm2 when folded, was measured to produce power of 1.6 uW with a temperature difference of 43 K. A radiation efficiency of -9.1 dB was measured for the transparent RFID antenna prototype with the center frequency of 900 MHz. Radiation efficiencies between -3.8 dB and -0.4 dB, depending on the substrate, were obtained for the 2.45 GHz Bluetooth antenna.Comment: 10 pages, 14 figures, last author version accepted for publication in IEEE Sensors Journa

Design, processing and testing of LSI arrays hybrid microelectronics task

Those factors affecting the cost of electronic subsystems utilizing LSI microcircuits were determined and the most efficient methods for low cost packaging of LSI devices as a function of density and reliability were developed