The Virtual Block Interface: A Flexible Alternative to the Conventional Virtual Memory Framework

Computers continue to diversify with respect to system designs, emerging memory technologies, and application memory demands. Unfortunately, continually adapting the conventional virtual memory framework to each possible system configuration is challenging, and often results in performance loss or requires non-trivial workarounds. To address these challenges, we propose a new virtual memory framework, the Virtual Block Interface (VBI). We design VBI based on the key idea that delegating memory management duties to hardware can reduce the overheads and software complexity associated with virtual memory. VBI introduces a set of variable-sized virtual blocks (VBs) to applications. Each VB is a contiguous region of the globally-visible VBI address space, and an application can allocate each semantically meaningful unit of information (e.g., a data structure) in a separate VB. VBI decouples access protection from memory allocation and address translation. While the OS controls which programs have access to which VBs, dedicated hardware in the memory controller manages the physical memory allocation and address translation of the VBs. This approach enables several architectural optimizations to (1) efficiently and flexibly cater to different and increasingly diverse system configurations, and (2) eliminate key inefficiencies of conventional virtual memory. We demonstrate the benefits of VBI with two important use cases: (1) reducing the overheads of address translation (for both native execution and virtual machine environments), as VBI reduces the number of translation requests and associated memory accesses; and (2) two heterogeneous main memory architectures, where VBI increases the effectiveness of managing fast memory regions. For both cases, VBI significanttly improves performance over conventional virtual memory

Design Space Exploration and Resource Management of Multi/Many-Core Systems

The increasing demand of processing a higher number of applications and related data on computing platforms has resulted in reliance on multi-/many-core chips as they facilitate parallel processing. However, there is a desire for these platforms to be energy-efficient and reliable, and they need to perform secure computations for the interest of the whole community. This book provides perspectives on the aforementioned aspects from leading researchers in terms of state-of-the-art contributions and upcoming trends

Extending systems-on-chip to the third dimension : performance, cost and technological tradeoffs.

Because of the today's market demand for high-performance, high-density portable hand-held applications, electronic system design technology has shifted the focus from 2-D planar SoC single-chip solutions to different alternative options as tiled silicon and single-level embedded modules as well as 3-D integration. Among the various choices, finding an optimal solution for system implementation dealt usually with cost, performance and other technological trade-off analysis at the system conceptual level. It has been identified that the decisions made within the first 20% of the total design cycle time will ultimately result up to 80% of the final product cost. In this paper, we discuss appropriate and realistic metric for performance and cost trade-off analysis both at system conceptual level (up-front in the design phase) and at implementation phase for verification in the three-dimensional integration. In order to validate the methodology, two ubiquitous electronic systems are analyzed under various implementation schemes and discuss the pros and cons of each of them

Demystifying the Characteristics of 3D-Stacked Memories: A Case Study for Hybrid Memory Cube

Three-dimensional (3D)-stacking technology, which enables the integration of DRAM and logic dies, offers high bandwidth and low energy consumption. This technology also empowers new memory designs for executing tasks not traditionally associated with memories. A practical 3D-stacked memory is Hybrid Memory Cube (HMC), which provides significant access bandwidth and low power consumption in a small area. Although several studies have taken advantage of the novel architecture of HMC, its characteristics in terms of latency and bandwidth or their correlation with temperature and power consumption have not been fully explored. This paper is the first, to the best of our knowledge, to characterize the thermal behavior of HMC in a real environment using the AC-510 accelerator and to identify temperature as a new limitation for this state-of-the-art design space. Moreover, besides bandwidth studies, we deconstruct factors that contribute to latency and reveal their sources for high- and low-load accesses. The results of this paper demonstrates essential behaviors and performance bottlenecks for future explorations of packet-switched and 3D-stacked memories.Comment: EEE Catalog Number: CFP17236-USB ISBN 13: 978-1-5386-1232-

Coordinate Channel-Aware Page Mapping Policy and Memory Scheduling for Reducing Memory Interference Among Multimedia Applications

"© 2017 IEEE. Personal use of this material is permitted. Permissíon from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertisíng or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works."[EN] In a modern multicore system, memory is shared among more and more concurrently running multimedia applications. Therefore, memory contention and interference are more andmore serious, inducing system performance degradation significantly, the performance degradation of each thread differently, unfairness in resource sharing, and priority inversion, even starvation. In this paper, we propose an approach of coordinating channel-aware page mapping policy and memory scheduling (CCPS) to reduce intermultimedia application interference in a memory system. The idea is to map the data of different threads to different channels, together with memory scheduling. The key principles of the policies of page mapping and memory scheduling are: 1) the memory address space, the thread priority, and the load balance; and 2) prioritizing a low-memory request thread, a row-buffer hit access, and an older request. We evaluate the CCPS on a variety of mixed single-thread and multithread benchmarks and system configurations, and we compare them with four previously proposed state-of-the-art interference-reducing policies. Experimental results demonstrate that the CCPS improves the performance while reducing the energy consumption significantly; moreover, the CCPS incurs a much lower hardware overhead than the current existing policies.This work was supported in part by the Qing Lan Project; by the National Science Foundation of China under Grant 61003077, Grant 61100193, and Grant 61401147; and by the Zhejiang Provincial Natural Science Foundation under Grant LQ14F020011.Jia, G.; Han, G.; Li, A.; Lloret, J. (2017). Coordinate Channel-Aware Page Mapping Policy and Memory Scheduling for Reducing Memory Interference Among Multimedia Applications. IEEE Systems Journal. 11(4):2839-2851. https://doi.org/10.1109/JSYST.2015.2430522S2839285111

Hardware/Software Co-design for Multicore Architectures

Siirretty Doriast

Exploring Adaptive Implementation of On-Chip Networks

As technology geometries have shrunk to the deep submicron regime, the communication delay and power consumption of global interconnections in high performance Multi- Processor Systems-on-Chip (MPSoCs) are becoming a major bottleneck. The Network-on- Chip (NoC) architecture paradigm, based on a modular packet-switched mechanism, can address many of the on-chip communication issues such as performance limitations of long interconnects and integration of large number of Processing Elements (PEs) on a chip. The choice of routing protocol and NoC structure can have a significant impact on performance and power consumption in on-chip networks. In addition, building a high performance, area and energy efficient on-chip network for multicore architectures requires a novel on-chip router allowing a larger network to be integrated on a single die with reduced power consumption. On top of that, network interfaces are employed to decouple computation resources from communication resources, to provide the synchronization between them, and to achieve backward compatibility with existing IP cores. Three adaptive routing algorithms are presented as a part of this thesis. The first presented routing protocol is a congestion-aware adaptive routing algorithm for 2D mesh NoCs which does not support multicast (one-to-many) traffic while the other two protocols are adaptive routing models supporting both unicast (one-to-one) and multicast traffic. A streamlined on-chip router architecture is also presented for avoiding congested areas in 2D mesh NoCs via employing efficient input and output selection. The output selection utilizes an adaptive routing algorithm based on the congestion condition of neighboring routers while the input selection allows packets to be serviced from each input port according to its congestion level. Moreover, in order to increase memory parallelism and bring compatibility with existing IP cores in network-based multiprocessor architectures, adaptive network interface architectures are presented to use multiple SDRAMs which can be accessed simultaneously. In addition, a smart memory controller is integrated in the adaptive network interface to improve the memory utilization and reduce both memory and network latencies. Three Dimensional Integrated Circuits (3D ICs) have been emerging as a viable candidate to achieve better performance and package density as compared to traditional 2D ICs. In addition, combining the benefits of 3D IC and NoC schemes provides a significant performance gain for 3D architectures. In recent years, inter-layer communication across multiple stacked layers (vertical channel) has attracted a lot of interest. In this thesis, a novel adaptive pipeline bus structure is proposed for inter-layer communication to improve the performance by reducing the delay and complexity of traditional bus arbitration. In addition, two mesh-based topologies for 3D architectures are also introduced to mitigate the inter-layer footprint and power dissipation on each layer with a small performance penalty.Siirretty Doriast

Architectural Techniques to Enable Reliable and Scalable Memory Systems

High capacity and scalable memory systems play a vital role in enabling our desktops, smartphones, and pervasive technologies like Internet of Things (IoT). Unfortunately, memory systems are becoming increasingly prone to faults. This is because we rely on technology scaling to improve memory density, and at small feature sizes, memory cells tend to break easily. Today, memory reliability is seen as the key impediment towards using high-density devices, adopting new technologies, and even building the next Exascale supercomputer. To ensure even a bare-minimum level of reliability, present-day solutions tend to have high performance, power and area overheads. Ideally, we would like memory systems to remain robust, scalable, and implementable while keeping the overheads to a minimum. This dissertation describes how simple cross-layer architectural techniques can provide orders of magnitude higher reliability and enable seamless scalability for memory systems while incurring negligible overheads.Comment: PhD thesis, Georgia Institute of Technology (May 2017