Fiabilité de l’underfill et estimation de la durée de vie d’assemblages microélectroniques

Abstract : In order to protect the interconnections in flip-chip packages, an underfill material layer is used to fill the volumes and provide mechanical support between the silicon chip and the substrate. Due to the chip corner geometry and the mismatch of coefficient of thermal expansion (CTE), the underfill suffers from a stress concentration at the chip corners when the temperature is lower than the curing temperature. This stress concentration leads to subsequent mechanical failures in flip-chip packages, such as chip-underfill interfacial delamination and underfill cracking. Local stresses and strains are the most important parameters for understanding the mechanism of underfill failures. As a result, the industry currently relies on the finite element method (FEM) to calculate the stress components, but the FEM may not be accurate enough compared to the actual stresses in underfill. FEM simulations require a careful consideration of important geometrical details and material properties. This thesis proposes a modeling approach that can accurately estimate the underfill delamination areas and crack trajectories, with the following three objectives. The first objective was to develop an experimental technique capable of measuring underfill deformations around the chip corner region. This technique combined confocal microscopy and the digital image correlation (DIC) method to enable tri-dimensional strain measurements at different temperatures, and was named the confocal-DIC technique. This techique was first validated by a theoretical analysis on thermal strains. In a test component similar to a flip-chip package, the strain distribution obtained by the FEM model was in good agreement with the results measured by the confocal-DIC technique, with relative errors less than 20% at chip corners. Then, the second objective was to measure the strain near a crack in underfills. Artificial cracks with lengths of 160 μm and 640 μm were fabricated from the chip corner along the 45° diagonal direction. The confocal-DIC-measured maximum hoop strains and first principal strains were located at the crack front area for both the 160 μm and 640 μm cracks. A crack model was developed using the extended finite element method (XFEM), and the strain distribution in the simulation had the same trend as the experimental results. The distribution of hoop strains were in good agreement with the measured values, when the model element size was smaller than 22 μm to capture the strong strain gradient near the crack tip. The third objective was to propose a modeling approach for underfill delamination and cracking with the effects of manufacturing variables. A deep thermal cycling test was performed on 13 test cells to obtain the reference chip-underfill delamination areas and crack profiles. An artificial neural network (ANN) was trained to relate the effects of manufacturing variables and the number of cycles to first delamination of each cell. The predicted numbers of cycles for all 6 cells in the test dataset were located in the intervals of experimental observations. The growth of delamination was carried out on FEM by evaluating the strain energy amplitude at the interface elements between the chip and underfill. For 5 out of 6 cells in validation, the delamination growth model was consistent with the experimental observations. The cracks in bulk underfill were modelled by XFEM without predefined paths. The directions of edge cracks were in good agreement with the experimental observations, with an error of less than 2.5°. This approach met the goal of the thesis of estimating the underfill initial delamination, areas of delamination and crack paths in actual industrial flip-chip assemblies.Afin de protéger les interconnexions dans les assemblages, une couche de matériau d’underfill est utilisée pour remplir le volume et fournir un support mécanique entre la puce de silicium et le substrat. En raison de la géométrie du coin de puce et de l’écart du coefficient de dilatation thermique (CTE), l’underfill souffre d’une concentration de contraintes dans les coins lorsque la température est inférieure à la température de cuisson. Cette concentration de contraintes conduit à des défaillances mécaniques dans les encapsulations de flip-chip, telles que la délamination interfaciale puce-underfill et la fissuration d’underfill. Les contraintes et déformations locales sont les paramètres les plus importants pour comprendre le mécanisme des ruptures de l’underfill. En conséquent, l’industrie utilise actuellement la méthode des éléments finis (EF) pour calculer les composantes de la contrainte, qui ne sont pas assez précises par rapport aux contraintes actuelles dans l’underfill. Ces simulations nécessitent un examen minutieux de détails géométriques importants et des propriétés des matériaux. Cette thèse vise à proposer une approche de modélisation permettant d’estimer avec précision les zones de délamination et les trajectoires des fissures dans l’underfill, avec les trois objectifs suivants. Le premier objectif est de mettre au point une technique expérimentale capable de mesurer la déformation de l’underfill dans la région du coin de puce. Cette technique, combine la microscopie confocale et la méthode de corrélation des images numériques (DIC) pour permettre des mesures tridimensionnelles des déformations à différentes températures, et a été nommée le technique confocale-DIC. Cette technique a d’abord été validée par une analyse théorique en déformation thermique. Dans un échantillon similaire à un flip-chip, la distribution de la déformation obtenues par le modèle EF était en bon accord avec les résultats de la technique confocal-DIC, avec des erreurs relatives inférieures à 20% au coin de puce. Ensuite, le second objectif est de mesurer la déformation autour d’une fissure dans l’underfill. Des fissures artificielles d’une longueuer de 160 μm et 640 μm ont été fabriquées dans l’underfill vers la direction diagonale de 45°. Les déformations circonférentielles maximales et principale maximale étaient situées aux pointes des fissures correspondantes. Un modèle de fissure a été développé en utilisant la méthode des éléments finis étendue (XFEM), et la distribution des contraintes dans la simuation a montré la même tendance que les résultats expérimentaux. La distribution des déformations circonférentielles maximales était en bon accord avec les valeurs mesurées lorsque la taille des éléments était plus petite que 22 μm, assez petit pour capturer le grand gradient de déformation près de la pointe de fissure. Le troisième objectif était d’apporter une approche de modélisation de la délamination et de la fissuration de l’underfill avec les effets des variables de fabrication. Un test de cyclage thermique a d’abord été effectué sur 13 cellules pour obtenir les zones délaminées entre la puce et l’underfill, et les profils de fissures dans l’underfill, comme référence. Un réseau neuronal artificiel (ANN) a été formé pour établir une liaison entre les effets des variables de fabrication et le nombre de cycles à la délamination pour chaque cellule. Les nombres de cycles prédits pour les 6 cellules de l’ensemble de test étaient situés dans les intervalles d’observations expérimentaux. La croissance de la délamination a été réalisée par l’EF en évaluant l’énergie de la déformation au niveau des éléments interfaciaux entre la puce et l’underfill. Pour 5 des 6 cellules de la validation, le modèle de croissance du délaminage était conforme aux observations expérimentales. Les fissures dans l’underfill ont été modélisées par XFEM sans chemins prédéfinis. Les directions des fissures de bord étaient en bon accord avec les observations expérimentales, avec une erreur inférieure à 2,5°. Cette approche a répondu à la problématique qui consiste à estimer l’initiation des délamination, les zones de délamination et les trajectoires de fissures dans l’underfill pour des flip-chips industriels

Fracture Behavior of Silica- and Rubber-Nanoparticle-Toughed Epoxies

Particle-toughened crosslinked epoxies are popular materials for a variety of applications, including the microelectronics industry. For this application, the properties of these materials, such as a high fracture toughness and a low coefficient of thermal expansion, are highly appealing. In order to achieve these properties, inorganic particles are often added into the matrix. For this study, both inorganic and organic particles-toughened epoxies are investigated in the hopes of finding an optimized system.In particular, in this study, micron-sized silica and nano-sized rubbery block copolymers are added to an amine-cured epoxy matrix. A series of rubber-only and silica-only systems are investigated for their contribution to the fracture toughness. Then, a series of hybrid systems are investigated.The hypothesis is that the rubber will contribute toughness through rubber particle cavitation and matrix void growth and the silica will contribute toughness through crack pinning and bridging and particle debonding. In the hybrid systems, these mechanisms will take place at a different scale. Therefore, the nanoscale mechanisms of the rubber will be able to function at the same time as the micron sized mechanisms of the silica and the resultant toughness will be synergistically higher.The results from this study show an interesting contribution from the rubber particles both in the rubber-only systems and the hybrid system. Ultimately, there was a marked increase in the fracture toughness of the hybrid systems, although not synergistic. This increase indicates that it would be possible to create an optimized hybrid system from the combined addition of these particles

Moisture and Interfacial Adhesion in Microelectronic Assemblies

In this research, a systematic and multi-disciplinary study was conducted to understand the fundamental science of moisture-induced degradation of interfacial adhesion. The research is comprised of both experimental and modeling components of analysis and consists of four primary components. First, the moisture transport behavior within underfill adhesives is experimentally characterized and incorporated into a finite element model to depict the moisture ingress and interfacial moisture concentration for each respective level of moisture preconditioning. Second, the effect of moisture on the variation of the underfill elastic modulus is demonstrated and the physical mechanisms for the change identified. Third, the aggregate effect of moisture on the interfacial fracture toughness of underfill to both copper and FR-4 board substrates is determined. This includes the primary effect of moisture being physically present at the interface and the secondary effect of moisture changing the elastic modulus of the adhesive when absorbed. Last, the recovery of both the elastic modulus and interfacial fracture toughness from moisture preconditioning is assessed with reversible and irreversible components identified. Using adsorption theory in conjunction with fracture mechanics, an analytical model is developed that predicts the loss in interfacial fracture toughness as a function of moisture content. The model incorporates key parameters relevant to the problem of moisture in epoxy joints identified from the experimental portion of this research, including the interfacial hydrophobicity, epoxy nanopore density, saturation concentration, and density of water. This research results in a comprehensive understanding of the primary mechanisms responsible for the interfacial degradation due to the presence of moisture. The experimental results obtained through this research provide definitive data for the electronics industry to use in their product design, failure analysis, and reliability modeling. The predictive model developed in this research provides a useful tool for developing new adhesives, innovative surface treatment methods, and effective protection methodologies for enhancing interfacial adhesion.Ph.D.Committee Chair: Jianmin Qu; Committee Member: C. P. Wong; Committee Member: S. Mostafa Ghiaasiaan; Committee Member: Suresh K. Sitaraman; Committee Member: W. Steven Johnso

Study of Interfacial Crack Propagation in Flip Chip Assemblies with Nano-filled Underfill Materials

No-flow underfill materials that cure during the solder reflow process is a relatively new technology. Although there are several advantages in terms of cost, time and processing ease, there are several reliability challenges associated with no-flow underfills. When micron-sized filler particles are introduced in no-flow underfills to enhance the solder bump reliability, such filler particles could prevent the solder bumps making reliable electrical contacts with the substrate pads during solder reflow, and therefore, the assembly yield would be adversely affected. The use of nano-sized filler particles can potentially improve assembly yield while offering the advantages associated with filled underfill materials. The objective of this thesis is to study the thermo-mechanical reliability of nano-filled epoxy underfills (NFU) through experiments and theoretical modeling. In this work, the thermo-mechanical properties of NFUs with 20-nm filler particles have been measured. An innovative residual stress test method has been developed to measure the interfacial fracture toughness. Using the developed residual stress method and the single-leg bending test, the mode-mixity-dependent fracture toughness for NFU-SiN interface has been determined. In addition to such monotonic interfacial fracture characterization, the interface crack propagation under thermo-mechanical fatigue loading has been experimentally characterized, and a model for fatigue interface crack propagation has been developed. A test vehicle comprising of several flip chips was assembled using the NFU material and the reliability of the flip-chip assemblies was assessed under thermal shock cycles between -40oC and 125oC. The NFU-SiN interfacial delamination propagation and the solder bump reliability were monitored. In parallel, numerical models were developed to study the interfacial delamination propagation in the flip chip assembly using conventional interfacial fracture mechanics as well as cohesive zone modeling. Predictions for interfacial delamination propagation using the two approaches have been compared. Based on the theoretical models and the experimental data, guidelines for design of NFUs against interfacial delamination have been developed.Ph.D.Committee Chair: Sitaraman, Suresh; Committee Member: Qu, Jianmin; Committee Member: Tonapi, Sandeep; Committee Member: Tummala, Rao; Committee Member: Ume, Charles; Committee Member: White, Georg

Challenges towards Structural Integrity and Performance Improvement of Welded Structures

Welding is a fabrication process that joint materials, is extensively utilized in almost every field of metal constructions. Heterogeneity in mechanical properties, metallurgical and geometrical defects, post-weld residual stresses and distortion due to non-linear welding processes are prime concerns for performance reduction and failures of welded structures. Consequently, structural integrity analysis and performance improvement of weld joints are important issues that must be considered for structural safety and durability under loading. In this study, an extensive experimental program and analysis were undertaken on the challenges towards structural integrity analysis and performance improvement of different welded joints. Two widely used welding techniques including solid-state “friction- stir- welding (FSW)” and fusion arc “gas tungsten arc welding (GTAW)” were employed on two widely utilized materials, namely aluminum alloys and structural steels. Various destructive and non-destructive techniques were utilized for structural integrity analysis of the welded joints. Furthermore, various “post-weld treatment (PWT)” techniques were employed to improve mechanical performances of weld joints. The work herein is divided into six different sections including: (i) Establishment of an empirical correlation for FSW of aluminum alloys. The developed empirical correlation relates the three critical FSW process parameters and was found to successfully distinguish defective and defect-free weld schedules; (ii) Development of an optimized “adaptive neuro-fuzzy inference system (ANFIS)” model utilizing welding process parameters to predict ultimate tensile strength (UTS) of FSW joints; (iii) Determination of an optimum post-weld heat treatment (PWHT) condition for FS-welded aluminum alloys; (iv) Exploration on the influence of non-destructively evaluated weld-defects and obtain an optimum PWHT condition for GTA-welded aluminum alloys; (v) Investigation on the influence of PWHT and electrolytic-plasma-processing (EPP) on the performance of welded structural steel joints; and finally, (vi) Biaxial fatigue behavior evaluation of welded structural steel joints. The experimental research could be utilized to obtain defect free weld joints, establish weld acceptance/rejection criteria, and for the better design of welded aluminum alloy and steel structures. All attempted research steps mentioned above were carried out successfully. The results obtained within this effort will increase overall understanding of the structural integrity of welded aluminum alloys and steel structures

EFFECT OF MOISTURE ON THE ELASTIC MODULUS AND INTERFACIAL ADHESION OF POLYMER-METAL COMPONENTS IN MICROELECTRONIC ASSEMBLIES

ABSTRACT Moisture poses a significant threat to the reliability of microelectronic assemblies and can be attributed as being one of the principal causes of many premature package failures. It is a multi-dimensional concern in electronic packaging, having an adverse effect on package reliability by changing both the mechanical properties and interfacial adhesion of the microelectronic assembly. In this paper, a study has been conducted to evaluate the moisture-induced degradation of both the elastic modulus of a commercially available no-flow underfill and the interfacial adhesion of the underfill to a copper alloy substrate. Three different levels of moisture preconditioning, 85C/50%RH, 85C/65%RH, and 85C/85RH%, were implemented in this study. Diffusion coefficient test specimens were constructed to experimentally measure the moisture diffusivity into the underfill resin and obtain the moisture saturation concentration for each level of moisture preconditioning. Flexural bend test specimens were made to characterize the effect of moisture on the elastic modulus of the underfill adhesive. Last, interfacial fracture toughness specimens with prefabricated interface cracks were used in a four point bending test to quantify the effect of moisture on interfacial fracture toughness. The results of this study will aid in the development of more robust microelectronic assemblies, demonstrating how both the elastic modulus and interfacial toughness change as a function of moisture concentration. INTRODUCTION Microelectronic packaging is a very transient, rapidly progressing technology. With interconnect density increasing and package size decreasing, several adaptations to microelectronic assemblies have been developed t

Friction Stir Welding Manufacturing Advancement by On-Line High Temperature Phased Array Ultrasonic Testing and Correlation of Process Parameters to Joint Quality

Welding, a manufacturing process for joining, is widely employed in aerospace, aeronautical, maritime, nuclear, and automotive industries. Optimizing these techniques are paramount to continue the development of technologically advanced structures and vehicles. In this work, the manufacturing technique of friction stir welding (FSW) with aluminum alloy (AA) 2219-T87 is investigated to improve understanding of the process and advance manufacturing efficiency. AAs are widely employed in aerospace applications due to their notable strength and ductility. The extension of good strength and ductility to cryogenic temperatures make AAs suitable for rocket oxidizer and fuel tankage. AA-2219, a descendent of the original duralumin used to make Zeppelin frames, is currently in wide use in the aerospace industry. FSW, a solid-state process, joins the surfaces of a seam by stirring the surfaces together with a pin while the metal is held in place by a shoulder. The strength and ductility of friction stir (FS) welds depends upon the weld parameters, chiefly spindle rotational speed, feedrate, and plunge force (pinch force for self-reacting welds). Between conditions that produce defects, it appears in this study as well as those studies of which we are aware that FS welds show little variation in strength; however, outside this process parameter “window” the weld strength drops markedly. Manufacturers operate within this process parameter window, and the parameter establishment phase of welding operations constitutes the establishment of this process parameter window. The work herein aims to improve the manufacturing process of FSW by creating a new process parameter window selection methodology, creation of a weld quality prediction model, developing an analytical defect suppression model, and constructing a high temperature on-line phased array ultrasonic testing system for quality inspection

Aromatic hyperbranched polyester/RTM6 epoxy resin for EXTREME dynamic loading aeronautical applications

The effects of the addition of an aromatic hyperbranched polyester (AHBP) on thermal, mechanical, and fracture toughness properties of a thermosetting resin system were investigated. AHBP filler, synthesized by using a bulk poly-condensation reaction, reveals a glassy state at room temperature. Indeed, according to differential scanning calorimetry measurements, the glass transition temperature (Tg) of AHBP is 95 °C. Three different adduct weight percentages were employed to manufacture the AHBP/epoxy samples, respectively, 0.1, 1, and 5 wt%. Dynamical Mechanical Analysis tests revealed that the addition of AHBP induces a negligible variation in terms of conservative modulus, whereas a slight Tg reduction of about 4 °C was observed at 5 wt% of filler content. Fracture toughness results showed an improvement of both critical stress intensity factor (+18%) and critical strain energy release rate (+83%) by adding 5 wt% of AHBP compared to the neat epoxy matrix. Static and dynamic compression tests covering strain rates ranging from 0.0008 to 1000 s−1 revealed a pronounced strain rate sensitivity for all AHBP/epoxy systems. The AHBP composites all showed an increase of the true peak yield compressive strength with the best improvement associated with the sample with 0.1 wt% of AHBP