Optocoupler Integration of LTCC-based Gate Driver in a SiC Power Module

The growing demand for electrical energy in today’s industrialized economy has driven the need for innovative approaches to meet diverse application requirements. Notably, advancements have been made in the field of power electronic systems, as reliable power electronic converters are essential for managing multiple power sources and loads. However, the development of these systems poses challenges related to power device switching speed, system weight and size, and power losses. The integration of a gate driver into a SiC power module offers a solution to many of these challenges, thereby driving the advancement of electrical power density expansion. An LTCC-based gate driver with an LTCC-based optical isolator was developed and integrated into a fabricated 1.2kV SiC power module. This development was done specifically for high temperature applications as part of a wider research on the reliability of the integrated power module at higher temperatures. Therefore, this high temperature gate driver integrated SiC power module was tested from 25oC to 200oC. Double pulse testing of the fabricated integrated SiC power module was done to characterize the switching performance of the power module. The test results indicate a minimal voltage overshoot of approximately 3.5V during both the turn-on and turn-off periods. Additionally, the current overshoot ranges from ~5A to ~8A as the temperature increases from 25oC to 200oC. The results show good switching performance resulting in minimal losses over higher temperatures. Therefore, with these results, the integrated SiC power module can enhance better power density, and lower losses even in high temperature applications

Passive and active components development for broadband applications

Recently, GaN HEMTs have been proven to have numerous physical properties, resulting in transistors with greatly increased power densities when compared to the other well-established FET technologies. This advancement spurred research and product development towards power-band applications that require both high power and high efficiency over the wide band. Even though the use of multiple narrow band PAs covering the whole band has invariably led to better performance in terms of efficiency and noise, there is an associated increase in cost and in the insertion loss of the switches used to toggle between the different operating bands. The goal, now, of the new technology is to replace the multiple narrow band PAs with one broadband PA that has a comparable efficiency performance. In our study here, we have investigated a variety of wide band power amplifiers, including class AB PAs and their implementation in distributed and feedback PAs.Additionally, our investigation has included switching-mode PAs as they are well-known for achieving a relatively high efficiency. Besides having a higher efficiency, they are also less susceptible to parameter variations and could impose a lower thermal stress on the transistors than the conventional-mode PAs. With GaN HEMTs, we have demonstrated: a higher than 37 dBm output power and a more than 30% drain efficiency over 0.02 to 3 GHz for the distributed power amplifier; a higher than 30 dBm output power with more than a 22% drain efficiency over 0.1 to 5 GHz for the feedback amplifier; and at least a 43 dBm output power with a higher than 63% drain efficiency over 0.05 to 0.55 GHz for the class D PA. In many communication applications, however, achieving both high efficiency and linearity in the PA design is required. Therefore, in our research, we have evaluated several linearization and efficiency enhancement techniques.We selected the LInear amplification with Nonlinear Components (LINC) approach. Highly efficient combiner and novel efficiency enhancement techniques like the power recycling combiner and adaptive bias LINC schemes have been successfully developed and verified to achieve a combined high efficiency with a relatively high linearity

Optocoupler Integration of LTCC-based Gate Driver in a SiC Power Module

The growing demand for electrical energy in today’s industrialized economy has driven the need for innovative approaches to meet diverse application requirements. Notably, advancements have been made in the field of power electronic systems, as reliable power electronic converters are essential for managing multiple power sources and loads. However, the development of these systems poses challenges related to power device switching speed, system weight and size, and power losses. The integration of a gate driver into a SiC power module offers a solution to many of these challenges, thereby driving the advancement of electrical power density expansion. An LTCC-based gate driver with an LTCC-based optical isolator was developed and integrated into a fabricated 1.2kV SiC power module. This development was done specifically for high temperature applications as part of a wider research on the reliability of the integrated power module at higher temperatures. Therefore, this high temperature gate driver integrated SiC power module was tested from 25oC to 200oC. Double pulse testing of the fabricated integrated SiC power module was done to characterize the switching performance of the power module. The test results indicate a minimal voltage overshoot of approximately 3.5V during both the turn-on and turn-off periods. Additionally, the current overshoot ranges from ~5A to ~8A as the temperature increases from 25oC to 200oC. The results show good switching performance resulting in minimal losses over higher temperatures. Therefore, with these results, the integrated SiC power module can enhance better power density, and lower losses even in high temperature applications

Circuits Techniques for Wireless Sensing Systems in High-Temperature Environments

RÉSUMÉ Dans ce projet, nous proposons de nouvelles techniques d’intégration basées sur la technologie de nitrure de gallium (GaN). Ces techniques permettent de mettre en œuvre un système de transmission de données sans fil entièrement intégré dédié aux capteurs de surveillance pour des applications d'environnement hostile. Le travail nécessite de trouver une technologie capable de résister à l'environnement sévère, principalement à haute température, et de permettre un niveau d'intégration élevé. Le système réalisé serait le premier dispositif de transmission de données basé sur la technologie GaN. En plus de supporter les conditions de haute température (HT) dépassant 600 oC, le système de transmission sans fil attendu devrait fonctionner à travers une barrière métallique séparant le module émetteur du récepteur. Une revue de la littérature sur les applications en environnements hostiles ainsi que sur l'électronique correspondante a été réalisée pour sélectionner la technologie AlGaN/GaN HEMT (transistor à haute mobilité d'électrons) comme une technologie appropriée. Le kit de conception GaN500, fourni par le Conseil national de recherches du Canada (CNRC), a été adopté pour concevoir et mettre en œuvre le système proposé. Cette technologie a été initialement introduite pour desservir les applications radiofréquences (RF) et micro-ondes. Par conséquent, elle n'avait pas été validée pour concevoir et fabriquer des circuits intégrés analogiques et numériques complexes et son utilisation à des températures extrêmes n’était pas validée. Nous avons donc caractérisé à haute température des dispositifs fabriqués en GaN500 et des éléments passifs intégrés correspondants ont été réalisés. Ces composants ont été testés sur la plage de température comprise entre 25 et 600 oC dans cette thèse. Les résultats de caractérisation ont été utilisés pour extraire les modèles HT des HEMT intégrés et des éléments passifs à utiliser dans les simulations. En outre, plusieurs composants intégrés basés sur la technologie GaN500, notamment des NOT, NOR, NAND, XOR, XNOR, registres, éléments de délais et oscillateurs ont été mis en œuvre et testés en HT. Des circuits analogiques à base de GaN500, comprenant un amplificateur de tension, un comparateur, un redresseur simple alternance, un redresseur double alternance, une pompe de charge et une référence de tension ont également été mis en œuvre et testés en HT. Le système de transmission de données mis en œuvre se compose d'un module de modulation situé dans la partie émettrice et d'un module de démodulation situé dans la partie réceptrice.----------ABSTRACT In this project, we propose new integrated-circuit design techniques based on the Gallium Nitride (GaN) technology to implement a fully-integrated data transmission system dedicated to wireless sensing in harsh environment applications. The goal in this thesis is to find a proper technology able to withstand harsh-environments (HEs), mainly characterized by high temperatures, and to allow a high-integration level. The reported design is the first data transmission system based on GaN technology. In addition to high temperature (HT) environment exceeding 600 oC, the expected wireless transmission systems may need to operate through metallic barriers separating the transmitting from the receiving modules. A wide literature review on the HE applications and corresponding electronics has been done to select the AlGaN/GaN HEMT (high-electron-mobility transistor) technology. The GaN500 design kit, provided by National Research Council of Canada (NRC), was adopted to design and implement the proposed system. This technology was initially provided to serve radio frequency (RF) and microwave circuits and applications. Consequently, it was not validated to implement complex integrated systems and to withstand extreme temperatures. Therefore, the high-temperature characterization of fabricated GaN500 devices and corresponding integrated passive elements was performed over the temperature range 25-600 oC in this thesis. The characterization results were used to extract HT models of the integrated HEMTs and passive elements to be used in simulations. Also, several GaN500-based digital circuits including NOT, NOR, NAND, XOR, XNOR, register, Delay and Ring oscillator were implemented and tested at HT. GaN500-based Analog circuits including front-end amplifier, comparator, half-bridge rectifier, full-bridge rectifier, charge pump and voltage reference were implemented and tested at HT as well. The implemented data transmission system consists of a modulation module located in the transmitting part and a demodulation block located in the receiving part. The proposed modulation system is based on the delta-sigma modulation technique and composed of a front-end amplifier, a comparator, a register, a charge pump and a ring oscillator. The output stage of the transmitter is intended to perform the load-shift-keying (LSK) modulation required to accomplish the data transmission through the dedicated inductive link. At the receiver level, three demodulation topologies were proposed to acquire the delivered LSK-modulated signals

High-Temperature Optoelectronic Device Characterization and Integration Towards Optical Isolation for High-Density Power Modules

Power modules based on wide bandgap (WBG) materials enhance reliability and considerably reduce cooling requirements that lead to a significant reduction in total system cost and weight. Although these innovative properties lead power modules to higher power density, some concerns still need to be addressed to take full advantage of WBG-based modules. For example, the use of bulky transformers as a galvanic isolation system to float the high voltage gate driver limits further size reduction of the high-temperature power modules. Bulky transformers can be replaced by integrating high-temperature optocouplers to scale down power modules further and achieve disrupting performance in terms of thermal management, power efficiency, power density, operating environments, and reliability. However, regular semiconductor optoelectronic materials and devices have significant difficulty functioning in high-temperature environments. Modular integration of optoelectronic devices into high-temperature power modules is restricted due to the significant optical efficiency drop at elevated temperatures. The quantum efficiency and long-term reliability of optoelectronic devices decrease at elevated temperatures. The motivation for this study is to develop optoelectronic devices, specifically optocouplers, that can be integrated into high-density power modules. A detailed study on optoelectronic devices at high temperature enables us to explore the possibility of scaling high-density power modules by integrating high-temperature optoelectronic devices into the power module. The primary goal of this study is to characterize and verify the high-temperature operation of optoelectronic devices, including light-emitting diodes and photodiodes based on WBG materials. The secondary goal is to identify and integrate optoelectronic devices to achieve galvanic isolation in high-density power modules working at elevated temperatures. As part of the study, a high-temperature packaging, based on low temperature co-fired ceramic (LTCC), suitable to accommodate optoelectronic devices, will also be designed and developed

Enabling Solutions for Integration and Interconnectivity in Millimeter-wave and Terahertz Systems

Recently, Terahertz (THz) systems have witnessed increasing attention due to the continuous need for high data rate transmission which is mainly driven by next-generation telecommunication and imaging systems. In that regard, the THz range emerged as a potential domain suitable for realizing such systems by providing a wide bandwidth capable of achieving and meeting the market requirements. However, the realization of such systems faces many challenges, one of which is interconnectivity and high level of integration. Conventional packaging techniques would not be suitable from performance perspective above 100 GHz and new approaches need to be developed. This thesis proposes and demonstrates several approaches to implement interconnects that operate above 100 GHz. One of the most attractive techniques discussed in this work is to implement on-chip coupling structures and insert the monolithic microwave integrated circuit (MMIC) directly into a waveguide (WG). Such approach provides high level of integration and eliminates the need of galvanic contacts; however, it suffers from a major drawback which isthe propagation of parasitic modes in the circuit cavity if the MMIC is large enough to allow such modes to propagate. To mitigate this problem, this work suggests and investigates the use of electromagnetic bandgap (EBG) structures that suppresses those modes such as bed of nails and mushroom-type EBG structures. The proposed techniques are used to implement several on-chip packaging solutions that have an insertion loss as low as 0.6 dB at D-band (110-170 GHz). Moreover, the solutions are demonstrated in several active systems using various commercial MMIC technologies. The thesis also investigates the possibility of utilizing the commercially available packaging technologies such as Embedded Wafer Level Ball Grid Array (eWLB) packaging. Such technology has been widely used for integrated circuits operating below 100 GHz but was not attempted in the THz range before. This work attempts to push the limits of the technology and proposes novel solutions based on coupling structures implemented in the technology’s redistribution layers. The proposed solutions achieve reasonable performance at D-band that are suitable for low-cost mass production while allowing heterogeneous integration with other technologies as well. This work addresses integration challenges facing systems operating in the THz range and proposes high-performance interconnectivity solutions demonstrated in a wide range of commercial technologies and hence enables such systems to reach their full potential and meet the increasing market demands

Millimeter-Wave Active Array Antennas Integrating Power Amplifier MMICs through Contactless Interconnects

Next-generation mobile wireless technologies demand higher data capacity than the modern sub-6 GHz technologies can provide. With abundantly available bandwidth, millimeter waves (e.g., Ka/K bands) can offer data rates of around 10 Gbit/s; however, this shift to higher frequency bands also leads to at least 20 dB more free-space path loss. Active integrated antennas have drawn much attention to compensate for this increased power loss with high-power, energy- efficient, highly integrated array transmitters. Traditionally, amplifiers and antennas are designed separately and interconnected with 50 Ohm intermediate impedance matching networks. The design process typically de-emphasizes the correlation between antenna mutual coupling effects and amplifier nonlinearity, rendering high power consumption and poor linearity. This research aims to overcome the technical challenges of millimeter-wave active integrated array antennas on delivering high power (15–25 dBm) and high energy efficiency (≥25%) with above 10% bandwidth. A co-design methodology was proposed to maximize the output power, power efficiency, bandwidth, and linearity with defined optimal interface impedances. Contrary to conventional approaches, this methodology accounts for the correlation between mutual coupling effects and nonlinearity. A metallic cavity-backed bowtie slot antenna, with sufficient degrees of freedom in synthesizing a non 50 Ohm complex-valued optimal impedance, was adopted for high radiation efficiency and enhanced bandwidth. To overcome interconnection’s bandwidth and power loss limitations, an on-chip E-plane probe contactless transition be- tween the antenna and amplifier was proposed. An array of such antennas be- comes connected bowtie slots, allowing for wideband and wide-scan array performance. An infinite array active integrated unit cell approach was introduced for large-scale (aperture area ≈100 λ2) active array designs. The proposed co-design flow is applied in designing a Ka-band wideband, wide scan angle (\ub155\ub0/\ub140\ub0) active array antenna, consisting of the connected bowtie slot radiator fed through the on-chip probe integrated onto the output of a class AB GaAs pHEMT MMIC PA. The infinite array performance of such elements is experimentally verified, presenting a 11.3% bandwidth with a peak 40% power efficiency, 28 dBm EIRP, and 22 dBm saturated power