Advanced information processing system for advanced launch system: Hardware technology survey and projections

The major goals of this effort are as follows: (1) to examine technology insertion options to optimize Advanced Information Processing System (AIPS) performance in the Advanced Launch System (ALS) environment; (2) to examine the AIPS concepts to ensure that valuable new technologies are not excluded from the AIPS/ALS implementations; (3) to examine advanced microprocessors applicable to AIPS/ALS, (4) to examine radiation hardening technologies applicable to AIPS/ALS; (5) to reach conclusions on AIPS hardware building blocks implementation technologies; and (6) reach conclusions on appropriate architectural improvements. The hardware building blocks are the Fault-Tolerant Processor, the Input/Output Sequencers (IOS), and the Intercomputer Interface Sequencers (ICIS)

Advanced flight computer. Special study

This report documents a special study to define a 32-bit radiation hardened, SEU tolerant flight computer architecture, and to investigate current or near-term technologies and development efforts that contribute to the Advanced Flight Computer (AFC) design and development. An AFC processing node architecture is defined. Each node may consist of a multi-chip processor as needed. The modular, building block approach uses VLSI technology and packaging methods that demonstrate a feasible AFC module in 1998 that meets that AFC goals. The defined architecture and approach demonstrate a clear low-risk, low-cost path to the 1998 production goal, with intermediate prototypes in 1996

Early analysis of VLSI systems with packaging considerations

There is an explosive growth in the size of the VLSI (Very Large Scale Integration) systems today. Microelectronic system designers are packing millions of transistors in a single IC chip. Packaging techniques like Multi-chip module (MCM) and flip-chip bonding offer faster interconnects and IC\u27s capable of accommodating a larger number of inputs and outputs. The complexity of today\u27s designs and the availability of advanced packaging techniques call for an early analysis of the system based on estimation of system parameters to select from a wide choice of circuit partitioning, architecture alternatives and packaging options which give the best cost/performance. A procedure for the early analysis of VLSI systems under packaging considerations has been developed and implemented in this dissertation work. The early analysis tool was used to evaluate the inter-relationship between partitioning and packaging and to determine the best system design considering cost, size and delays. The functional unit level description of a 750,000-transistor MicroSparc processor was studied using an exhaustive search technique. The early analysis performed on the MicroSparc design suggested that the three chip multi-chip design using flip-chip IC\u27s interconnected on a MCM-D substrate is the most cost effective. An early bond pitch analysis performed using the tool concluded that a 250-micron bond pitch is the best choice for the multi-chip MicroSparc designs. The tool was also used to perform an early cache analysis which showed that the use of separate memory and logic processes made it feasible to design the MicroSparc design with larger cache sizes than the use of a combined logic and memory process. The designs based on the separate processes gave equivalent or better performance than the design candidates with smaller cache sizes. Future extensions of the procedure are also outlined here

GSFC Cutting Edge Avionics Technologies for Spacecraft

With the launch of NASA's first fiber optic bus on SAMPEX in 1992, GSFC has ushered in an era of new technology development and insertion into flight programs. Predating such programs the Lewis and Clark missions and the New Millenium Program, GSFC has spearheaded the drive to use cutting edge technologies on spacecraft for three reasons: to enable next generation Space and Earth Science, to shorten spacecraft development schedules, and to reduce the cost of NASA missions. The technologies developed have addressed three focus areas: standard interface components, high performance processing, and high-density packaging techniques enabling lower cost systems. To realize the benefits of standard interface components GSFC has developed and utilized radiation hardened/tolerant devices such as PCI target ASICs, Parallel Fiber Optic Data Bus terminals, MIL-STD-1773 and AS1773 transceivers, and Essential Services Node. High performance processing has been the focus of the Mongoose I and Mongoose V rad-hard 32-bit processor programs as well as the SMEX-Lite Computation Hub. High-density packaging techniques have resulted in 3-D stack DRAM packages and Chip-On-Board processes. Lower cost systems have been demonstrated by judiciously using all of our technology developments to enable "plug and play" scalable architectures. The paper will present a survey of development and insertion experiences for the above technologies, as well as future plans to enable more "better, faster, cheaper" spacecraft. Details of ongoing GSFC programs such as Ultra-Low Power electronics, Rad-Hard FPGAs, PCI master ASICs, and Next Generation Mongoose processors

Materials for high-density electronic packaging and interconnection

Electronic packaging and interconnections are the elements that today limit the ultimate performance of advanced electronic systems. Materials in use today and those becoming available are critically examined to ascertain what actions are needed for U.S. industry to compete favorably in the world market for advanced electronics. Materials and processes are discussed in terms of the final properties achievable and systems design compatibility. Weak points in the domestic industrial capability, including technical, industrial philosophy, and political, are identified. Recommendations are presented for actions that could help U.S. industry regain its former leadership position in advanced semiconductor systems production

The 1991 3rd NASA Symposium on VLSI Design

Papers from the symposium are presented from the following sessions: (1) featured presentations 1; (2) very large scale integration (VLSI) circuit design; (3) VLSI architecture 1; (4) featured presentations 2; (5) neural networks; (6) VLSI architectures 2; (7) featured presentations 3; (8) verification 1; (9) analog design; (10) verification 2; (11) design innovations 1; (12) asynchronous design; and (13) design innovations 2

Center for Aeronautics and Space Information Sciences

This report summarizes the research done during 1991/92 under the Center for Aeronautics and Space Information Science (CASIS) program. The topics covered are computer architecture, networking, and neural nets

Neurostream: Scalable and Energy Efficient Deep Learning with Smart Memory Cubes

open4siHigh-performance computing systems are moving towards 2.5D and 3D memory hierarchies, based on High Bandwidth Memory (HBM) and Hybrid Memory Cube (HMC) to mitigate the main memory bottlenecks. This trend is also creating new opportunities to revisit near-memory computation. In this paper, we propose a flexible processor-in-memory (PIM) solution for scalable and energy-efficient execution of deep convolutional networks (ConvNets), one of the fastest-growing workloads for servers and high-end embedded systems. Our co-design approach consists of a network of Smart Memory Cubes (modular extensions to the standard HMC) each augmented with a many-core PIM platform called NeuroCluster. NeuroClusters have a modular design based on NeuroStream coprocessors (for Convolution-intensive computations) and general-purpose RISC-V cores. In addition, a DRAM-friendly tiling mechanism and a scalable computation paradigm are presented to efficiently harness this computational capability with a very low programming effort. NeuroCluster occupies only 8 percent of the total logic-base (LoB) die area in a standard HMC and achieves an average performance of 240 GFLOPS for complete execution of full-featured state-of-the-art (SoA) ConvNets within a power budget of 2.5 W. Overall 11 W is consumed in a single SMC device, with 22.5 GFLOPS/W energy-efficiency which is 3.5X better than the best GPU implementations in similar technologies. The minor increase in system-level power and the negligible area increase make our PIM system a cost-effective and energy efficient solution, easily scalable to 955 GFLOPS with a small network of just four SMCs.openAzarkhish, Erfan*; Rossi, Davide; Loi, Igor; Benini, LucaAzarkhish, Erfan*; Rossi, Davide; Loi, Igor; Benini, Luc

Fault-Tolerant Single-Chip Vector Processor : architecture and performance analysis using Livermore loop benchmarks

Electrical Engineerin