Multi-objective Pareto front and particle swarm optimization algorithms for power dissipation reduction in microprocessors

The progress of microelectronics making possible higher integration densities, and a considerable development of on-board systems are currently undergoing, this growth comes up against a limiting factor of power dissipation. Higher power dissipation will cause an immediate spread of generated heat which causes thermal problems. Consequently, the system's total consumed energy will increase as the system temperature increase. High temperatures in microprocessors and large thermal energy of computer systems produce huge problems of system confidence, performance, and cooling expenses. Power consumed by processors are mainly due to the increase in number of cores and the clock frequency, which is dissipated in the form of heat and causes thermal challenges for chip designers. As the microprocessor’s performance has increased remarkably in Nano-meter technology, power dissipation is becoming non-negligible. To solve this problem, this article addresses power dissipation reduction issues for high performance processors using multi-objective Pareto front (PF), and particle swarm optimization (PSO) algorithms to achieve power dissipation as a prior computation that reduces the real delay of a target microprocessor unit. Simulation is verified the conceptual fundamentals and optimization of joint body and supply voltages (Vth-VDD) which showing satisfactory findings

Micro-architecture level low power design for microprocessors

Ph.DDOCTOR OF PHILOSOPH

Investigation into the wafer-scale integration of fine-grain parallel processing computer systems

This thesis was submitted for the degree of Doctor of Philosophy and awarded by Brunel University.This thesis investigates the potential of wafer-scale integration (WSI) for the implementation of low-cost fine-grain parallel processing computer systems. As WSI is a relatively new subject, there was little work on which to base investigations. Indeed, most WSI architectures existed only as untried and sometimes vague proposals. Accordingly, the research strategy approached this problem by identifying a representative WSI structure and architecture on which to base investigations. An analysis of architectural proposals identified associative memory to be general purpose parallel processing component used in a wide range of WSI architectures. Furthermore, this analysis provided a set of WSI-level design requirements to evaluate the sustainability of different architectures as research vehicles. The WSI-ASP (WASP) device, which has a large associative memory as its main component is shown to meet these requirements and hence was chosen as the research vehicle. Consequently, this thesis addresses WSI potential through an in-depth investigation into the feasibility of implementing a large associative memory for the WASP device that meets the demanding technological constraints of WSI. Overall, the thesis concludes that WSI offers significant potential for the implementation of low-cost fine-grain parallel processing computer systems. However, due to the dual constraints of thermal management and the area required for the power distribution network, power density is a major design constraint in WSI. Indeed, it is shown that WSI power densities need to be an order of magnitude lower than VLSI power densities. The thesis demonstrates that for associative memories at least, VLSI designs are unsuited to implementation in WSI. Rather, it is shown that WSI circuits must be closely matched to the operational environment to assure suitable power densities. These circuits are significantly larger than their VLSI equivalents. Nonetheless, the thesis demonstrates that by concentrating on the most power intensive circuits, it is possible to achieve acceptable power densities with only a modest increase in area overheads.SER

Enhancing Power Efficient Design Techniques in Deep Submicron Era

Excessive power dissipation has been one of the major bottlenecks for design and manufacture in the past couple of decades. Power efficient design has become more and more challenging when technology scales down to the deep submicron era that features the dominance of leakage, the manufacture variation, the on-chip temperature variation and higher reliability requirements, among others. Most of the computer aided design (CAD) tools and algorithms currently used in industry were developed in the pre deep submicron era and did not consider the new features explicitly and adequately. Recent research advances in deep submicron design, such as the mechanisms of leakage, the source and characterization of manufacture variation, the cause and models of on-chip temperature variation, provide us the opportunity to incorporate these important issues in power efficient design. We explore this opportunity in this dissertation by demonstrating that significant power reduction can be achieved with only minor modification to the existing CAD tools and algorithms. First, we consider peak current, which has become critical for circuit's reliability in deep submicron design. Traditional low power design techniques focus on the reduction of average power. We propose to reduce peak current while keeping the overhead on average power as small as possible. Second, dual Vt technique and gate sizing have been used simultaneously for leakage savings. However, this approach becomes less effective in deep submicron design. We propose to use the newly developed process-induced mechanical stress to enhance its performance. Finally, in deep submicron design, the impact of on-chip temperature variation on leakage and performance becomes more and more significant. We propose a temperature-aware dual Vt approach to alleviate hot spots and achieve further leakage reduction. We also consider this leakage-temperature dependency in the dynamic voltage scaling approach and discover that a commonly accepted result is incorrect for the current technology. We conduct extensive experiments with popular design benchmarks, using the latest industry CAD tools and design libraries. The results show that our proposed enhancements are promising in power saving and are practical to solve the low power design challenges in deep submicron era

IDPAL – A Partially-Adiabatic Energy-Efficient Logic Family: Theory and Applications to Secure Computing

Low-power circuits and issues associated with them have gained a significant amount of attention in recent years due to the boom in portable electronic devices. Historically, low-power operation relied heavily on technology scaling and reduced operating voltage, however this trend has been slowing down recently due to the increased power density on chips. This dissertation introduces a new very-low power partially-adiabatic logic family called Input-Decoupled Partially-Adiabatic Logic (IDPAL) with applications in low-power circuits. Experimental results show that IDPAL reduces energy usage by 79% compared to equivalent CMOS implementations and by 25% when compared to the best adiabatic implementation. Experiments ranging from a simple buffer/inverter up to a 32-bit multiplier are explored and result in consistent energy savings, showing that IDPAL could be a viable candidate for a low-power circuit implementation. This work also shows an application of IDPAL to secure low-power circuits against power analysis attacks. It is often assumed that encryption algorithms are perfectly secure against attacks, however, most times attacks using side channels on the hardware implementation of an encryption operation are not investigated. Power analysis attacks are a subset of side channel attacks and can be implemented by measuring the power used by a circuit during an encryption operation in order to obtain secret information from the circuit under attack. Most of the previously proposed solutions for power analysis attacks use a large amount of power and are unsuitable for a low-power application. The almost-equal energy consumption for any given input in an IDPAL circuit suggests that this logic family is a good candidate for securing low-power circuits again power analysis attacks. Experimental results ranging from small circuits to large multipliers are performed and the power-analysis attack resistance of IDPAL is investigated. Results show that IDPAL circuits are not only low-power but also the most secure against power analysis attacks when compared to other adiabatic low-power circuits. Finally, a hybrid adiabatic-CMOS microprocessor design is presented. The proposed microprocessor uses IDPAL for the implementation of circuits with high switching activity (e.g. ALU) and CMOS logic for other circuits (e.g. memory, controller). An adiabatic-CMOS interface for transforming adiabatic signals to square-wave signals is presented and issues associated with a hybrid implementation and their solutions are also discussed

Electro-Thermal Codesign in Liquid Cooled 3D ICs: Pushing the Power-Performance Limits

The performance improvement of today's computer systems is usually accompanied by increased chip power consumption and system temperature. Modern CPUs dissipate an average of 70-100W power while spatial and temporal power variations result in hotspots with even higher power density (up to 300W/cm^2). The coming years will continue to witness a significant increase in CPU power dissipation due to advanced multi-core architectures and 3D integration technologies. Nowadays the problems of increased chip power density, leakage power and system temperatures have become major obstacles for further improvement in chip performance. The conventional air cooling based heat sink has been proved to be insufficient for three dimensional integrated circuits (3D-ICs). Hence better cooling solutions are necessary. Micro-fluidic cooling, which integrates micro-channel heat sinks into silicon substrates of the chip and uses liquid flow to remove heat inside the chip, is an effective active cooling scheme for 3D-ICs. While the micro-fluidic cooling provides excellent cooling to 3D-ICs, the associated overhead (cooling power consumed by the pump to inject the coolant through micro-channels) is significant. Moreover, the 3D-IC structure also imposes constraints on micro-channel locations (basically resource conflict with through-silicon-vias TSVs or other structures). In this work, we investigate optimized micro-channel configurations that address the aforementioned considerations. We develop three micro-channel structures (hotspot optimized cooling configuration, bended micro-channel and hybrid cooling network) that can provide sufficient cooling to 3D-IC with minimum cooling power overhead, while at the same time, compatible with the existing electrical structure such as TSVs. These configurations can achieve up to 70% cooling power savings compared with the configuration without any optimization. Based on these configurations, we then develop a micro-fluidic cooling based dynamic thermal management approach that maintains the chip temperature through controlling the fluid flow rate (pressure drop) through micro-channels. These cooling configurations are designed after the electrical parts, and therefore, compatible with the current standard IC design flow. Furthermore, the electrical, thermal, cooling and mechanical aspects of 3D-IC are interdependent. Hence the conventional design flow that designs the cooling configuration after electrical aspect is finished will result in inefficiencies. In order to overcome this problem, we then investigate electrical-thermal co-design methodology for 3D-ICs. Two co-design problems are explored: TSV assignment and micro-channel placement co-design, and gate sizing and fluidic cooling co-design. The experimental results show that the co-design enables a fundamental power-performance improvement over the conventional design flow which separates the electrical and cooling design. For example, the gate sizing and fluidic cooling co-design achieves 12% power savings under the same circuit timing constraint and 16% circuit speedup under the same power budget

Design automation and analysis of three-dimensional integrated circuits

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2004.Includes bibliographical references (p. 165-176).This dissertation concerns the design of circuits and systems for an emerging technology known as three-dimensional integration. By stacking individual components, dice, or whole wafers using a high-density electromechanical interconnect, three-dimensional integration can achieve scalability and performance exceeding that of conventional fabrication technologies. There are two main contributions of this thesis. The first is a computer-aided design flow for the digital components of a three-dimensional integrated circuit (3-D IC). This flow primarily consists of two software tools: PR3D, a placement and routing tool for custom 3-D ICs based on standard cells, and 3-D Magic, a tool for designing, editing, and testing physical layout characteristics of 3-D ICs. The second contribution of this thesis is a performance analysis of the digital components of 3-D ICs. We use the above tools to determine the extent to which 3-D integration can improve timing, energy, and thermal performance. In doing so, we verify the estimates of stochastic computational models for 3-D IC interconnects and find that the models predict the optimal 3-D wire length to within 20% accuracy. We expand upon this analysis by examining how 3-D technology factors affect the optimal wire length that can be obtained. Our ultimate analysis extends this work by directly considering timing and energy in 3-D ICs. In all cases we find that significant performance improvements are possible. In contrast, thermal performance is expected to worsen with the use of 3-D integration. We examine precisely how thermal behavior scales in 3-D integration and determine quantitatively how the temperature may be controlled during the circuit placement process. We also show how advanced packaging(cont.) technologies may be leveraged to maintain acceptable die temperatures in 3-D ICs. Finally, we explore two issues for the future of 3-D integration. We determine how technology scaling impacts the effect of 3-D integration on circuit performance. We also consider how to improve the performance of digital components in a mixed-signal 3-D integrated circuit. We conclude with a look towards future 3-D IC design tools.by Shamik Das.Ph.D

Emerging Technologies - NanoMagnets Logic (NML)

In the last decades CMOS technology has ruled the electronic scenario thanks to the constant scaling of transistor sizes. With the reduction of transistor sizes circuit area decreases, clock frequency increases and power consumption decreases accordingly. However CMOS scaling is now approaching its physical limits and many believe that CMOS technology will not be able to reach the end of the Roadmap. This is mainly due to increasing difficulties in the fabrication process, that is becoming very expensive, and to the unavoidable impact of leakage losses, particularly thanks to gate tunnel current. In this scenario many alternative technologies are studied to overcome the limitations of CMOS transistors. Among these possibilities, magnetic based technologies, like NanoMagnet Logic (NML) are among the most interesting. The reason of this interest lies in their magnetic nature, that opens up entire new possibilities in the design of logic circuits, like the possibility to mix logic and memory in the same device. Moreover they have no standby power consumption and potentially a much lower power consumption of CMOS transistors. In literature NML logic is well studied and theoretical and experimental proofs of concept were already found. However two important points are not enough considered in the analysis approach followed by most of the work in literature. First of all, no complex circuits are analyzed. NML logic is very different from CMOS technologies, so to completely understand the potential of this technology it is mandatory to investigate complex architectures. Secondly, most of the solutions proposed do not take into account the constraints derived from fabrication process, making them unrealistic and difficult to be fabricated experimentally. This thesis focuses therefore on NML logic keeping into account these two important limitations in the research approach followed in literature. The aim is to obtain a complete and accurate overview of NML logic, finding realistic circuital solutions and trying to improve at the same time their performance. After a brief and complete introduction (Chapter 1), the thesis is divided in two parts, which cover the two fundamental points followed in this three years of research: A circuits architecture analysis and a technological analysis. In the architecture analysis first an innovative VHDL model is described in Chapter 2. This model is extensively used in the analysis because it allows fast simulation of complex circuits, with, at the same time, the possibility to estimate circuit per- formance, like area and power consumption. In Chapter 3 the problem of signals synchronization in complex NML circuits is analyzed and solved, using as benchmark a simple but complete NML microprocessor. Different solutions based on asynchronous logic are studied and a new asynchronous solution, specifically designed to exploit the potential of NML logic, is developed. In Chapter 4 the layout of NML circuits is studied on a more physical level, considering the limitations of fabrication processes. The layout of NML circuits is therefore changed accordingly to these constraints. Secondly CMOS circuits architectures are compared to more simple architectures, evaluating therefore which one is more suited for NML logic. Finally the problem of interconnections in NML technology is analyzed and solutions to improve it are found. In Chapter 5 the problem of feedback signals in heavy pipelined technologies, like NML, is studied. Solutions to improve performances and synchronize signals are developed. Systolic arrays are then analyzed as possible candidate to exploit NML potential. Finally in Chapter 6 ToPoliNano, a simulator dedicated to NML and other emerging technologies, that we are developing, is described. This simulator allows to follow the same top-down approach followed for CMOS technology. The layout generator and the simulation engine are detailed described. In the first chapter of the technological analysis (Chapter 7), the performance of NML logic is explored throughout low level simulations. The aim is to understand if these circuits can be fabricated with optical lithography, allowing therefore the commercial development of NML logic. Basic logic gates and the clock system are there analyzed from a low level perspective. In Chapter 8 an innovative electric clock system for NML technology is shown and the first experimental results are reported. This clock system allows to achieve true low power for NML technology, obtaining a reduction of power consumption of 20 times considering the best CMOS transistors available. This power consumption takes into account all the losses, also the clock system losses. Moreover the solution presented can be fabricated with current technological processes. The research work behind this thesis represents an important breakthrough in NML logic. The solutions here presented allow the design and fabrication of complex NML circuits, considering the particular characteristics of this technology and considerably improving the performance. Moreover the technological solutions here presented allow the design and fabrication of circuits with available fabrication process with a considerable advantage over CMOS in terms of power consumption. This thesis represents therefore a considerable step froward in the study and development of NML technolog