Dielectric Breakdown in Chemical Vapor Deposited Hexagonal Boron Nitride

Insulating films are essential in multiple electronic devices because they can provide essential functionalities, such as capacitance effects and electrical fields. Two-dimensional (2D) layered materials have superb electronic, physical, chemical, thermal, and optical properties, and they can be effectively used to provide additional performances, such as flexibility and transparency. 2D layered insulators are called to be essential in future electronic devices, but their reliability, degradation kinetics, and dielectric breakdown (BD) process are still not understood. In this work, the dielectric breakdown process of multilayer hexagonal boron nitride (h-BN) is analyzed on the nanoscale and on the device level, and the experimental results are studied via theoretical models. It is found that under electrical stress, local charge accumulation and charge trapping/detrapping are the onset mechanisms for dielectric BD formation. By means of conductive atomic force microscopy, the BD event was triggered at several locations on the surface of different dielectrics (SiO2, HfO2, Al2O3, multilayer h-BN, and monolayer h-BN); BD-induced hillocks rapidly appeared on the surface of all of them when the BD was reached, except in monolayer h-BN. The high thermal conductivity of h-BN combined with the one-atom-thick nature are genuine factors contributing to heat dissipation at the BD spot, which avoids self-accelerated and thermally driven catastrophic BD. These results point to monolayer h-BN as a sublime dielectric in terms of reliability, which may have important implications in future digital electronic devices.Fil: Jiang, Lanlan. Soochow University; ChinaFil: Shi, Yuanyuan. Soochow University; China. University of Stanford; Estados UnidosFil: Hui, Fei. Soochow University; China. Massachusetts Institute of Technology; Estados UnidosFil: Tang, Kechao. University of Stanford; Estados UnidosFil: Wu, Qian. Soochow University; ChinaFil: Pan, Chengbin. Soochow University; ChinaFil: Jing, Xu. Soochow University; China. University of Texas at Austin; Estados UnidosFil: Uppal, Hasan. University of Manchester; Reino UnidoFil: Palumbo, Félix Roberto Mario. Comisión Nacional de Energía Atómica; Argentina. Universidad Tecnológica Nacional; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas; ArgentinaFil: Lu, Guangyuan. Chinese Academy of Sciences; República de ChinaFil: Wu, Tianru. Chinese Academy of Sciences; República de ChinaFil: Wang, Haomin. Chinese Academy of Sciences; República de ChinaFil: Villena, Marco A.. Soochow University; ChinaFil: Xie, Xiaoming. Chinese Academy of Sciences; República de China. ShanghaiTech University; ChinaFil: McIntyre, Paul C.. University of Stanford; Estados UnidosFil: Lanza, Mario. Soochow University; Chin

Investigation of Gate Dielectric Materials and Dielectric/Silicon Interfaces for Metal Oxide Semiconductor Devices

The progress of the silicon-based complementary-metal-oxide-semiconductor (CMOS) technology is mainly contributed to the scaling of the individual component. After decades of development, the scaling trend is approaching to its limitation, and there is urgent needs for the innovations of the materials and structures of the MOS devices, in order to postpone the end of the scaling. Atomic layer deposition (ALD) provides precise control of the deposited thin film at the atomic scale, and has wide application not only in the MOS technology, but also in other nanostructures. In this dissertation, I study rapid thermal processing (RTP) treatment of thermally grown SiO2, ALD growth of SiO2, and ALD growth of high-k HfO2 dielectric materials for gate oxides of MOS devices. Using a lateral heating treatment of SiO2, the gate leakage current of SiO2 based MOS capacitors was reduced by 4 order of magnitude, and the underlying mechanism was studied. Ultrathin SiO2 films were grown by ALD, and the electrical properties of the films and the SiO2/Si interface were extensively studied. High quality HfO2 films were grown using ALD on a chemical oxide. The dependence of interfacial quality on the thickness of the chemical oxide was studied. Finally I studied growth of HfO2 on two innovative interfacial layers, an interfacial layer grown by in-situ ALD ozone/water cycle exposure and an interfacial layer of etched thermal and RTP SiO2. The effectiveness of growth of high-quality HfO2 using the two interfacial layers are comparable to that of the chemical oxide. The interfacial properties are studied in details using XPS and ellipsometry

The ReaxFF reactive force-field : development, applications and future directions

The reactive force-field (ReaxFF) interatomic potential is a powerful computational tool for exploring, developing and optimizing material properties. Methods based on the principles of quantum mechanics (QM), while offering valuable theoretical guidance at the electronic level, are often too computationally intense for simulations that consider the full dynamic evolution of a system. Alternatively, empirical interatomic potentials that are based on classical principles require significantly fewer computational resources, which enables simulations to better describe dynamic processes over longer timeframes and on larger scales. Such methods, however, typically require a predefined connectivity between atoms, precluding simulations that involve reactive events. The ReaxFF method was developed to help bridge this gap. Approaching the gap from the classical side, ReaxFF casts the empirical interatomic potential within a bond-order formalism, thus implicitly describing chemical bonding without expensive QM calculations. This article provides an overview of the development, application, and future directions of the ReaxFF method

Doped And Chemically Transformed Transition Metal Dichalcogenides (tmdcs) For Two-Dimensional (2d) Electronics

Transition metal dichalcogenides (TMDCs) as the semiconductor counterparts of gra-phene have emerged as promising channel materials for flexible electronic and optoelectronic devices. The 2D layer structure of TMDCs enables the ultimate scaling of TMDC-based devices down to atomic thickness. Furthermore, the absence of dangling bonds in these materials helps to form high quality heterostructures with ultra-clean interfaces. The main objective of this work is to develop novel approaches to fabricating TMDC-based 2D electronic devices such as diodes and transistors. In the first part, we have fabricated 2D p-n junction diodes through van der Waals assembly of heavily p-doped MoS2 (WSe2) and lightly n-doped MoS2 to form vertical homo-(hetero-) junctions, which allows to continuously tune the electron concentration on the n-side for a wide range. In sharp contrast to conventional p-n junction diodes, we have observed nearly exponential dependence of the reverse-current on gate-voltage in our 2D p-n junction devices, which can be attributed to band-to-band tunneling through a gate-tunable tunneling barrier. In the second part, we developed a new strategy to engineer high-κ dielectrics by con-verting atomically thin metallic 2D TMDCs into high-κ dielectrics because it remains a signifi-cant challenge to deposit uniform high-κ dielectric thin films on TMDCs with ALD due to the lack of dangling bonds on the surfaces of TMDCs. In our study, we converted mechanically ex-foliated atomically thin layers of a 2D metal, TaS2 (HfSe2) into a high-κ dielectric, Ta2O5 (HfO2) by thermal oxidation. X-ray photoelectron spectroscopy (XPS), transmission electron microscopy (TEM), energy dispersive spectroscopy (EDS), and atomic force microscopy (AFM) were used to understand the phase conversion process. Capacitance-voltage (C-V) measure-ments were carried out to determine the dielectric constant of thermally oxidized dielec-trics. We fabricated MoS2 field-effect transistors (FETs) with thermally oxidized ultra-thin and ultra-smooth Ta2O5 as top-gate and bottom-gate high-κ dielectric layers. We observed promis-ing device performance, including a nearly ideal subthreshold swing of ~ 61 mV/dec at room temperature, negligible hysteresis, drain-current saturation in the output characteristics, a high on/off ratio ~ 106, and a room temperature field-effect mobility exceeding 60 cm2/Vs. To fur-ther reduce the leak current and improve the device performance, we have also investigated the chemical transformation of HfSe2 to HfO2 high-κ dielectric, which has significantly larger band gap than Ta2O5

Electrical Transport Properties of Single-Layer WS2

We report on the fabrication of field-effect transistors based on single and bilayers of the semiconductor WS2 and the investigation of their electronic transport properties. We find that the doping level strongly depends on the device environment and that long in-situ annealing drastically improves the contact transparency allowing four-terminal measurements to be performed and the pristine properties of the material to be recovered. Our devices show n-type behavior with high room-temperature on/off current ratio of ~106. They show clear metallic behavior at high charge carrier densities and mobilities as high as ~140 cm2/Vs at low temperatures (above 300 cm2/Vs in the case of bi-layers). In the insulating regime, the devices exhibit variable-range hopping, with a localization length of about 2 nm that starts to increase as the Fermi level enters the conduction band. The promising electronic properties of WS2, comparable to those of single-layer MoS2 and WSe2, together with its strong spin-orbit coupling, make it interesting for future applications in electronic, optical and valleytronic devices

Interface properties of NO-annealed N2O-grown oxynitride

The oxide/Si interface properties of gate dielectric prepared by annealing N2O-grown oxide in an NO ambient are intensively investigated and compared to those of O2-grown oxide with the same annealing conditions. Hot-carrier stressings show that the former has a harder oxide/Si interface and near-interface oxide than the latter. As confirmed by SIMS analysis, this is associated with a higher nitrogen peak concentration near the oxide/Si interface and a larger total nitrogen content in the former, both arising from the initial oxidation in N2O instead of O2.published_or_final_versio