1,960 research outputs found

    Modular multilevel converter based LCL DC/DC converter for high power DC transmission grids

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    This paper presents a modular multilevel converter (MMC) based DC/DC converter with LCL inner circuit for HVDC transmission and DC grids. Three main design challenges are addressed. The first challenge is the use of MMCs with higher operating frequency compared to common transformer-based DC/DC converters where MMC operating frequency is limited to a few hundred hertz due to core losses. The second issue is the DC fault response. With the LCL circuit, the steady state fault current is limited to a low magnitude which is tolerable by MMC semiconductors. Mechanical DC circuit breakers can therefore be used to interrupt fault current for permanent faults and extra sub-module bypass thyristors are not necessary to protect antiparallel diodes. Thirdly, a novel controller structure is introduced with multiple coordinate frames ensuring zero local reactive power at both bridges in the whole load range. The proposed controller structure is also expandable to a DC hub with multiple ports. Detailed simulations using PSCAD/EMTDC are performed to verify the aforementioned design solutions in normal and fault conditions

    Thermo-mechanical stress of bonded wires used in high power modules with alternating and direct current modes

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    Today, power electronic reliability is a main subject of interest for many companies and laboratories. The main process leading to the IGBT failure is the cycling thermal stress. Indeed the current flow induce local heating and then mechanical stress. This paper deals with electro thermal stress under steady and transient current states. The main objective is to test bonded wires with active current cycle. Consequently, the thermo mechanical stress is obtained. A numerical 3D finite element model is presented and some experimental results are given. Indeed an infrared system monitors the temperature dispatching from an experimental test bench under active current cycle. The overall study is a first step before a global simulation (electrical thermal-mechanical) in order to optimize some geometric parameters of the packaging

    Thermal Design of Power Electronic Circuits

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    The heart of every switched mode converter consists of several switching semiconductor elements. Due to their non-ideal behaviour there are ON state and switching losses heating up the silicon chip. That heat must effectively be transferred to the environment in order to prevent overheating or even destruction of the element. For a cost-effective design, the semiconductors should be operated close to their thermal limits. Unfortunately the chip temperature cannot be measured directly. Therefore a detailed understanding of how losses arise, including their quantitative estimation, is required. Furthermore, the heat paths to the environment must be understood in detail. This paper describes the main issues of loss generation and its transfer to the environment and how it can be estimated by the help of datasheets and/or experiments.Comment: 17 pages, contribution to the 2014 CAS - CERN Accelerator School: Power Converters, Baden, Switzerland, 7-14 May 201

    Contributions to the design of power modules for electric and hybrid vehicles: trends, design aspects and simulation techniques

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    314 p.En la última década, la protección del medio ambiente y el uso alternativo de energías renovables están tomando mayor relevancia tanto en el ámbito social y político, como científico. El sector del transporte es uno de los principales causantes de los gases de efecto invernadero y la polución existente, contribuyendo con hasta el 27 % de las emisiones a nivel global. En este contexto desfavorable, la electrificación de los vehículos de carretera se convierte en un factor crucial. Para ello, la transición de la actual flota de vehículos de carretera debe ser progresiva forzando la investigación y desarrollo de nuevos conceptos a la hora de producir vehículos eléctricos (EV) y vehículos eléctricos híbridos (HEV) más eficientes, fiables, seguros y de menor coste. En consecuencia, para el desarrollo y mejora de los convertidores de potencia de los HEV/EV, este trabajo abarca los siguientes aspectos tecnológicos: - Arquitecturas de la etapa de conversión de potencia. Las principales topologías que pueden ser implementadas en el tren de potencia para HEV/EV son descritas y analizadas, teniendo en cuenta las alternativas que mejor se adaptan a los requisitos técnicos que demandan este tipo de aplicaciones. De dicha exposición se identifican los elementos constituyentes fundamentales de los convertidores de potencia que forman parte del tren de tracción para automoción.- Nuevos dispositivos semiconductores de potencia. Los nuevos objetivos y retos tecnológicos solo pueden lograrse mediante el uso de nuevos materiales. Los semiconductores Wide bandgap (WBG), especialmente los dispositivos electrónicos de potencia basados en nitruro de galio (GaN) y carburo de silicio (SiC), son las alternativas más prometedoras al silicio (Si) debido a las mejores prestaciones que poseen dichos materiales, lo que permite mejorar la conductividad térmica, aumentar las frecuencias de conmutación y reducir las pérdidas.- Análisis de técnicas de rutado, conexionado y ensamblado de módulos de potencia. Los módulos de potencia fabricados con dies en lugar de dispositivos discretos son la opción preferida por los fabricantes para lograr las especificaciones indicadas por la industria de la automoción. Teniendo en cuenta los estrictos requisitos de eficiencia, fiabilidad y coste es necesario revisar y plantear nuevos layouts de las etapas de conversión de potencia, así como esquemas y técnicas de paralelización de los circuitos, centrándose en las tecnologías disponibles.Teniendo en cuenta dichos aspectos, la presente investigación evalúa las alternativas de semiconductores de potencia que pueden ser implementadas en aplicaciones HEV/EV, así como su conexionado para la obtención de las densidades de potencia requeridas, centrándose en la técnica de paralelización de semiconductores. Debido a la falta de información tanto científica como comercial e industrial sobre dicha técnica, una de las principales contribuciones del presente trabajo ha sido la propuesta y verificación de una serie de criterios de diseño para el diseño de módulos de potencia. Finalmente, los resultados que se han extraído de los circuitos de potencia propuestos demuestran la utilidad de dichos criterios de diseño, obteniendo circuitos con bajas impedancias parásitas y equilibrados eléctrica y térmicamente. A nivel industrial, el conocimiento expuesto en la presente tesis permite reducir los tiempos de diseño a la hora de obtener prototipos de ciertas garantías, permitiendo comenzar la fase de prototipado habiéndose realizado comprobaciones eléctricas y térmicas

    Stacking of IGBT devices for fast high-voltage high-current applications

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    The development of solid-state switches for pulsed power applications has been of considerable interest since high-power semiconductor devices became available. However, the use of solid-state devices in the pulsed power environment has usually been restricted by device limitations in either their voltage/current ratings or their switching speed. The stacking of fast medium-voltage devices, such as IGBTs, to improve the voltage rating, makes solid-state switches a potential substitute for conventional switches such as hard glass tubes, thyratrons and spark gaps. Previous studies into stacking IGBTs have been concerned with specific devices, designed or modified particularly for a specific application. The present study is concerned with stacking fast and commercially available IGBTs and their application to the generation of pulsed electric field and the switching of a high intensity Xenon flashlamp. The aim of the first section of the present study was to investigate different solid-state switching devices with a stacking capability and this led to the choice of the Insulated Gate Bipolar Transistor (IGBT). It was found that the collector-emitter voltage decreases in two stages in most of the available IGBTs. Experiments and simulation showed that a reason for this behaviour could be fast variations in device parasitic parameters particularly gate-collector capacitance. Choosing the proper IGBT, as well as dealing with problems such as unbalanced voltage and current sharing, are important aspects of stacking and these were reported in this study. Dynamic and steady state voltage imbalances caused by gate driver delay was controlled using an array of synchronised pulses, isolated with magnetic and optical coupling. The design procedure for pulse transformers, optical modules, the drive circuits required to minimise possible jitter and time delays, and over-voltage protection of IGBT modules are also important aspects of stacking, and were reported in this study. The second purpose of this study was to investigate the switching performance of both magnetically coupled and optically coupled stacks, in pulse power applications such as Pulse Electric Field (PEF) inactivation of microorganisms and UV light inactivation of food-related pathogenic bacteria. The stack, consisting of 50 1.2 kV IGBTs with the voltage and current capabilities of 10 kV, 400 A, was incorporated into a coaxial cable Blumlein type pulse - generator and its performance was successfully tested with both magnetic and optical coupling. As a second application of the switch, a fully integrated solid-state Marx generator was designed and assembled to drive a UV flashlamp for the purpose of microbiological inactivation. The generator has an output voltage rating of 3 kV and a peak current rating of 2 kA, although the modular approach taken allows for a number of voltage and current ratings to be achieved. The performance of the switch was successfully tested over a period of more than 10⁶ pulses when it was applied to pulse a xenon flashlamp.The development of solid-state switches for pulsed power applications has been of considerable interest since high-power semiconductor devices became available. However, the use of solid-state devices in the pulsed power environment has usually been restricted by device limitations in either their voltage/current ratings or their switching speed. The stacking of fast medium-voltage devices, such as IGBTs, to improve the voltage rating, makes solid-state switches a potential substitute for conventional switches such as hard glass tubes, thyratrons and spark gaps. Previous studies into stacking IGBTs have been concerned with specific devices, designed or modified particularly for a specific application. The present study is concerned with stacking fast and commercially available IGBTs and their application to the generation of pulsed electric field and the switching of a high intensity Xenon flashlamp. The aim of the first section of the present study was to investigate different solid-state switching devices with a stacking capability and this led to the choice of the Insulated Gate Bipolar Transistor (IGBT). It was found that the collector-emitter voltage decreases in two stages in most of the available IGBTs. Experiments and simulation showed that a reason for this behaviour could be fast variations in device parasitic parameters particularly gate-collector capacitance. Choosing the proper IGBT, as well as dealing with problems such as unbalanced voltage and current sharing, are important aspects of stacking and these were reported in this study. Dynamic and steady state voltage imbalances caused by gate driver delay was controlled using an array of synchronised pulses, isolated with magnetic and optical coupling. The design procedure for pulse transformers, optical modules, the drive circuits required to minimise possible jitter and time delays, and over-voltage protection of IGBT modules are also important aspects of stacking, and were reported in this study. The second purpose of this study was to investigate the switching performance of both magnetically coupled and optically coupled stacks, in pulse power applications such as Pulse Electric Field (PEF) inactivation of microorganisms and UV light inactivation of food-related pathogenic bacteria. The stack, consisting of 50 1.2 kV IGBTs with the voltage and current capabilities of 10 kV, 400 A, was incorporated into a coaxial cable Blumlein type pulse - generator and its performance was successfully tested with both magnetic and optical coupling. As a second application of the switch, a fully integrated solid-state Marx generator was designed and assembled to drive a UV flashlamp for the purpose of microbiological inactivation. The generator has an output voltage rating of 3 kV and a peak current rating of 2 kA, although the modular approach taken allows for a number of voltage and current ratings to be achieved. The performance of the switch was successfully tested over a period of more than 10⁶ pulses when it was applied to pulse a xenon flashlamp

    Modular Multilevel Converter Modelling, Control and Analysis under Grid Frequency Deviations

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    A tool for component sizing for MMCs has been developed and tested through simulations in PLECS. The steady-state behaviour under grid frequency deviations — interesting for offshore wind farm connections — has been analysed, providing insights in MMC characteristics and further testing the proposed tool

    Short-Circuit Instabilities in Silicon IGBTs and Silicon Carbide Power MOSFETs

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    Reliability Assessment of IGBT through Modelling and Experimental Testing

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    Lifetime of power electronic devices, in particular those used for wind turbines, is short due to the generation of thermal stresses in their switching device e.g., IGBT particularly in the case of high switching frequency. This causes premature failure of the device leading to an unreliable performance in operation. Hence, appropriate thermal assessment and implementation of associated mitigation procedure are required to put in place in order to improve the reliability of the switching device. This paper presents two case studies to demonstrate the reliability assessment of IGBT. First, a new driving strategy for operating IGBT based power inverter module is proposed to mitigate wire-bond thermal stresses. The thermal stress is characterised using finite element modelling and validated by inverter operated under different wind speeds. High-speed thermal imaging camera and dSPACE system are used for real time measurements. Reliability of switching devices is determined based on thermoelectric (electrical and/or mechanical) stresses during operations and lifetime estimation. Second, machine learning based data-driven prognostic models are developed for predicting degradation behaviour of IGBT and determining remaining useful life using degradation raw data collected from accelerated aging tests under thermal overstress condition. The durations of various phases with increasing collector-emitter voltage are determined over the device lifetime. A data set of phase durations from several IGBTs is trained to develop Neural Network (NN) and Adaptive Neuro Fuzzy Inference System (ANFIS) models, which is used to predict remaining useful life (RUL) of IGBT. Results obtained from the presented case studies would pave the path for improving the reliability of IGBTs
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