77,104 research outputs found
Data Engineering for the Analysis of Semiconductor Manufacturing Data
We have analyzed manufacturing data from several different semiconductor
manufacturing plants, using decision tree induction software called
Q-YIELD. The software generates rules for predicting when a given product
should be rejected. The rules are intended to help the process engineers
improve the yield of the product, by helping them to discover the causes
of rejection. Experience with Q-YIELD has taught us the importance of
data engineering -- preprocessing the data to enable or facilitate
decision tree induction. This paper discusses some of the data engineering
problems we have encountered with semiconductor manufacturing data.
The paper deals with two broad classes of problems: engineering the features
in a feature vector representation and engineering the definition of the
target concept (the classes). Manufacturing process data present special
problems for feature engineering, since the data have multiple levels of
granularity (detail, resolution). Engineering the target concept is important,
due to our focus on understanding the past, as opposed to the more common
focus in machine learning on predicting the future
Semiconductor Packaging
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages
Geopolitics of Semiconductor Supply Chains: The Case of TSMC, US-China-Taiwan Relations, and the COVID-19 Crisis
As the demand for more advanced forms of technology continues to grow, so does the global importance and reliance on semiconductors. This research paper examines the impact of semiconductor shortages on both consumer and military production, as well as the geopolitical implications embedded within the global supply chain.
The paper begins by providing an overview of semiconductors, the global semiconductor market, and the impact of COVID-19 on the industry’s supply chain. It also discusses the importance of the Taiwan Semiconductor Manufacturing Company (TSMC) in the industry and its role in addressing semiconductor shortages.
Next, the paper discusses the impact of semiconductor shortages on the production of consumer goods such as smartphones, laptops, and automobiles. The US-China trade war and further geopolitical tensions between the US, China, and Taiwan have significantly disrupted the semiconductor supply chain, leading to shortages and price increases for consumer electronics industries. The paper also examines recent government intervention within high technology industries and specifically the semiconductor sector aimed at addressing the shortages faced during the pandemic and provides case studies of key companies affected by the semiconductor shortage.
The paper then examines the impact of semiconductor shortages on military technology production, such as advanced weapons and communications systems. The disruptions in the semiconductor supply chain have highlighted the importance of semiconductor manufacturing in national security and the geopolitical implications of these disruptions. The paper discusses the impact of US-China-Taiwan geopolitical tensions on the semiconductor supply chain for military technology production, evaluates key national interests and their reactions to shortages, and provides case studies for affected countries.
The paper has an overall lens of focusing on the geopolitical implications of US-China-Taiwan relations on the semiconductor industry and the role of other countries. It also upholds the sustainability focused value criterion of ensuring fair and reliable semiconductor distribution for fostering a stable and secure global supply chain. It provides future scenarios for the semiconductor industry and how past events and legislation will be either effective or ineffective in managing future supply chain issues. The paper highlights the role and need for international cooperation to address semiconductor distribution and the industry’s geopolitical implications.
In conclusion, the following research provides a comprehensive analysis of the impact of semiconductor shortages on both consumer goods and military technology production and their geopolitical implications. It provides an analysis and further recommendations of government policies and interventions to address shortages and their implications and suggests future research in the field of semiconductor geopolitics. As technology continues to advance, the importance of semiconductors will only grow, making the understanding of the global supply chain and the tensions it raises even more critical
Semiconductor Packaging
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages
Simulation Based Study of Safety Stocks under Short-Term Demand Volatility in Integrated Device Manufacturing.
© IEOM Society InternationalA problem faced by integrated device manufacturers (IDMs) relates to fluctuating demand and can be reflected in long-term demand, middle-term demand, and short-term demand fluctuations. This paper explores safety stock under short term demand fluctuations in integrated device manufacturing. The manufacturing flow of integrated circuits is conceptualized into front end and back end operations with a die bank in between. Using a model of the back-end operations of integrated circuit manufacturing, simulation experiments were conducted based on three scenarios namely a production environment of low demand volatility and high capacity reliability (Scenario A), an environment with lower capacity reliability than scenario A (Scenario B), and an environment of high demand volatility and low capacity reliability (Scenario C). Results show trade-off relation between inventory levels and delivery performance with varied degree of severity between the different scenarios studied. Generally, higher safety stock levels are required to achieve competitive delivery performance as uncertainty in demand increases and manufacturing capability reliability decreases. Back-end cycle time are also found to have detrimental impact on delivery performance as the cycle time increases. It is suggested that success of finished goods safety stock policy relies significantly on having appropriate capacity amongst others to support fluctuations
A Case Study Of E-Supply Chain & Business Process Reengineering Of A Semiconductor Company In Malaysia
Penglibatan e-perniagaan dalam rantaian bekalan telah mewujudkan e-rantaian bekalan yang baru (e-SC) di
firma-firma tempatan dan global.
Due to globalization and advancement in information technology (IT), companies adopt best practices in
e-business and supply chain management to be globally competitive as both are realities and prospects in 21st century
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Supply chain control: Trade-offs and system requirements
The official published version can be accessed from the link below.A paper describes the underlying forces which drive change in manufacturing enterprises and supply chains. It sets out the complexities in modern capitalism and global economics and illustrates the trade-offs that can be made. IT systems which are required to assist improvements to both customer service and enterprise manufacturing performance are explained, alluding to the special case for the semiconductor industry. Arguments are presented showing how the new tools being developed with the ESPRIT project 20544, X-CITTIC, will satisfy the control needs for a virtual enterprise. This paper describes the underlying forces which drive change in manufacturing enterprises and supply chains. It sets out the complexities in modem capitalism and global economics and illustrates the trade-offs that can be made. IT systems which are required to assist improvements to both customer service and enterprise manufacturing performance are explained alluding to the special case for the semiconductor industry. Finally it shows how the new tools being developed with the ESPRIT project 20544, XCITTIC, will satisfy the control needs for a virtual enterprise
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