A Survey of Techniques For Improving Energy Efficiency in Embedded Computing Systems

Recent technological advances have greatly improved the performance and features of embedded systems. With the number of just mobile devices now reaching nearly equal to the population of earth, embedded systems have truly become ubiquitous. These trends, however, have also made the task of managing their power consumption extremely challenging. In recent years, several techniques have been proposed to address this issue. In this paper, we survey the techniques for managing power consumption of embedded systems. We discuss the need of power management and provide a classification of the techniques on several important parameters to highlight their similarities and differences. This paper is intended to help the researchers and application-developers in gaining insights into the working of power management techniques and designing even more efficient high-performance embedded systems of tomorrow

Resource and thermal management in 3D-stacked multi-/many-core systems

Continuous semiconductor technology scaling and the rapid increase in computational needs have stimulated the emergence of multi-/many-core processors. While up to hundreds of cores can be placed on a single chip, the performance capacity of the cores cannot be fully exploited due to high latencies of interconnects and memory, high power consumption, and low manufacturing yield in traditional (2D) chips. 3D stacking is an emerging technology that aims to overcome these limitations of 2D designs by stacking processor dies over each other and using through-silicon-vias (TSVs) for on-chip communication, and thus, provides a large amount of on-chip resources and shortens communication latency. These benefits, however, are limited by challenges in high power densities and temperatures. 3D stacking also enables integrating heterogeneous technologies into a single chip. One example of heterogeneous integration is building many-core systems with silicon-photonic network-on-chip (PNoC), which reduces on-chip communication latency significantly and provides higher bandwidth compared to electrical links. However, silicon-photonic links are vulnerable to on-chip thermal and process variations. These variations can be countered by actively tuning the temperatures of optical devices through micro-heaters, but at the cost of substantial power overhead. This thesis claims that unearthing the energy efficiency potential of 3D-stacked systems requires intelligent and application-aware resource management. Specifically, the thesis improves energy efficiency of 3D-stacked systems via three major components of computing systems: cache, memory, and on-chip communication. We analyze characteristics of workloads in computation, memory usage, and communication, and present techniques that leverage these characteristics for energy-efficient computing. This thesis introduces 3D cache resource pooling, a cache design that allows for flexible heterogeneity in cache configuration across a 3D-stacked system and improves cache utilization and system energy efficiency. We also demonstrate the impact of resource pooling on a real prototype 3D system with scratchpad memory. At the main memory level, we claim that utilizing heterogeneous memory modules and memory object level management significantly helps with energy efficiency. This thesis proposes a memory management scheme at a finer granularity: memory object level, and a page allocation policy to leverage the heterogeneity of available memory modules and cater to the diverse memory requirements of workloads. On the on-chip communication side, we introduce an approach to limit the power overhead of PNoC in (3D) many-core systems through cross-layer thermal management. Our proposed thermally-aware workload allocation policies coupled with an adaptive thermal tuning policy minimize the required thermal tuning power for PNoC, and in this way, help broader integration of PNoC. The thesis also introduces techniques in placement and floorplanning of optical devices to reduce optical loss and, thus, laser source power consumption.2018-03-09T00:00:00

Evolutionary Design of the Memory Subsystem

The memory hierarchy has a high impact on the performance and power consumption in the system. Moreover, current embedded systems, included in mobile devices, are specifically designed to run multimedia applications, which are memory intensive. This increases the pressure on the memory subsystem and affects the performance and energy consumption. In this regard, the thermal problems, performance degradation and high energy consumption, can cause irreversible damage to the devices. We address the optimization of the whole memory subsystem with three approaches integrated as a single methodology. Firstly, the thermal impact of register file is analyzed and optimized. Secondly, the cache memory is addressed by optimizing cache configuration according to running applications and improving both performance and power consumption. Finally, we simplify the design and evaluation process of general-purpose and customized dynamic memory manager, in the main memory. To this aim, we apply different evolutionary algorithms in combination with memory simulators and profiling tools. This way, we are able to evaluate the quality of each candidate solution and take advantage of the exploration of solutions given by the optimization algorithm.We also provide an experimental experience where our proposal is assessed using well-known benchmark applications

Development of an oceanographic application in HPC

High Performance Computing (HPC) is used for running advanced application programs efficiently, reliably, and quickly. In earlier decades, performance analysis of HPC applications was evaluated based on speed, scalability of threads, memory hierarchy. Now, it is essential to consider the energy or the power consumed by the system while executing an application. In fact, the High Power Consumption (HPC) is one of biggest problems for the High Performance Computing (HPC) community and one of the major obstacles for exascale systems design. The new generations of HPC systems intend to achieve exaflop performances and will demand even more energy to processing and cooling. Nowadays, the growth of HPC systems is limited by energy issues Recently, many research centers have focused the attention on doing an automatic tuning of HPC applications which require a wide study of HPC applications in terms of power efficiency. In this context, this paper aims to propose the study of an oceanographic application, named OceanVar, that implements Domain Decomposition based 4D Variational model (DD-4DVar), one of the most commonly used HPC applications, going to evaluate not only the classic aspects of performance but also aspects related to power efficiency in different case of studies. These work were realized at Bsc (Barcelona Supercomputing Center), Spain within the Mont-Blanc project, performing the test first on HCA server with Intel technology and then on a mini-cluster Thunder with ARM technology. In this work of thesis it was initially explained the concept of assimilation date, the context in which it is developed, and a brief description of the mathematical model 4DVAR. After this problem’s close examination, it was performed a porting from Matlab description of the problem of data-assimilation to its sequential version in C language. Secondly, after identifying the most onerous computational kernels in order of time, it has been developed a parallel version of the application with a parallel multiprocessor programming style, using the MPI (Message Passing Interface) protocol. The experiments results, in terms of performance, have shown that, in the case of running on HCA server, an Intel architecture, values of efficiency of the two most onerous functions obtained, growing the number of process, are approximately equal to 80%. In the case of running on ARM architecture, specifically on Thunder mini-cluster, instead, the trend obtained is labeled as "SuperLinear Speedup" and, in our case, it can be explained by a more efficient use of resources (cache memory access) compared with the sequential case. In the second part of this paper was presented an analysis of the some issues of this application that has impact in the energy efficiency. After a brief discussion about the energy consumption characteristics of the Thunder chip in technological landscape, through the use of a power consumption detector, the Yokogawa Power Meter, values of energy consumption of mini-cluster Thunder were evaluated in order to determine an overview on the power-to-solution of this application to use as the basic standard for successive analysis with other parallel styles. Finally, a comprehensive performance evaluation, targeted to estimate the goodness of MPI parallelization, is conducted using a suitable performance tool named Paraver, developed by BSC. Paraver is such a performance analysis and visualisation tool which can be used to analyse MPI, threaded or mixed mode programmes and represents the key to perform a parallel profiling and to optimise the code for High Performance Computing. A set of graphical representation of these statistics make it easy for a developer to identify performance problems. Some of the problems that can be easily identified are load imbalanced decompositions, excessive communication overheads and poor average floating operations per second achieved. Paraver can also report statistics based on hardware counters, which are provided by the underlying hardware. This project aimed to use Paraver configuration files to allow certain metrics to be analysed for this application. To explain in some way the performance trend obtained in the case of analysis on the mini-cluster Thunder, the tracks were extracted from various case of studies and the results achieved is what expected, that is a drastic drop of cache misses by the case ppn (process per node) = 1 to case ppn = 16. This in some way explains a more efficient use of cluster resources with an increase of the number of processes

3rd Many-core Applications Research Community (MARC) Symposium. (KIT Scientific Reports ; 7598)

This manuscript includes recent scientific work regarding the Intel Single Chip Cloud computer and describes approaches for novel approaches for programming and run-time organization

Large-Eddy Simulations of Flow and Heat Transfer in Complex Three-Dimensional Multilouvered Fins

The paper describes the computational procedure and results from large-eddy simulations in a complex three-dimensional louver geometry. The three-dimensionality in the louver geometry occurs along the height of the fin, where the angled louver transitions to the flat landing and joins with the tube surface. The transition region is characterized by a swept leading edge and decreasing flow area between louvers. Preliminary results show a high energy compact vortex jet forming in this region. The jet forms in the vicinity of the louver junction with the flat landing and is drawn under the louver in the transition region. Its interaction with the surface of the louver produces vorticity of the opposite sign, which aids in augmenting heat transfer on the louver surface. The top surface of the louver in the transition region experiences large velocities in the vicinity of the surface and exhibits higher heat transfer coefficients than the bottom surface.Air Conditioning and Refrigeration Project 9