Moisture and Interfacial Adhesion in Microelectronic Assemblies

In this research, a systematic and multi-disciplinary study was conducted to understand the fundamental science of moisture-induced degradation of interfacial adhesion. The research is comprised of both experimental and modeling components of analysis and consists of four primary components. First, the moisture transport behavior within underfill adhesives is experimentally characterized and incorporated into a finite element model to depict the moisture ingress and interfacial moisture concentration for each respective level of moisture preconditioning. Second, the effect of moisture on the variation of the underfill elastic modulus is demonstrated and the physical mechanisms for the change identified. Third, the aggregate effect of moisture on the interfacial fracture toughness of underfill to both copper and FR-4 board substrates is determined. This includes the primary effect of moisture being physically present at the interface and the secondary effect of moisture changing the elastic modulus of the adhesive when absorbed. Last, the recovery of both the elastic modulus and interfacial fracture toughness from moisture preconditioning is assessed with reversible and irreversible components identified. Using adsorption theory in conjunction with fracture mechanics, an analytical model is developed that predicts the loss in interfacial fracture toughness as a function of moisture content. The model incorporates key parameters relevant to the problem of moisture in epoxy joints identified from the experimental portion of this research, including the interfacial hydrophobicity, epoxy nanopore density, saturation concentration, and density of water. This research results in a comprehensive understanding of the primary mechanisms responsible for the interfacial degradation due to the presence of moisture. The experimental results obtained through this research provide definitive data for the electronics industry to use in their product design, failure analysis, and reliability modeling. The predictive model developed in this research provides a useful tool for developing new adhesives, innovative surface treatment methods, and effective protection methodologies for enhancing interfacial adhesion.Ph.D.Committee Chair: Jianmin Qu; Committee Member: C. P. Wong; Committee Member: S. Mostafa Ghiaasiaan; Committee Member: Suresh K. Sitaraman; Committee Member: W. Steven Johnso

Dynamic Mechanical and Failure Properties of Solder Joints

Ph.DDOCTOR OF PHILOSOPH

Collected Papers in Structural Mechanics Honoring Dr. James H. Starnes, Jr.

This special publication contains a collection of structural mechanics papers honoring Dr. James H. Starnes, Jr. presented at the 46th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference held in Austin, Texas, April 18-21, 2005. Contributors to this publication represent a small number of those influenced by Dr. Starnes' technical leadership, his technical prowess and diversity, and his technical breath and depth in engineering mechanics. These papers cover some of the research areas Dr. Starnes investigated, which included buckling, postbuckling, and collapse of structures; composite structural mechanics, residual strength and damage tolerance of metallic and composite structures; and aircraft structural design, certification and verification. He actively pursued technical understanding and clarity, championed technical excellence, and modeled humility and perseverance

International Conference on Civil Infrastructure and Construction (CIC 2020)

This is the proceedings of the CIC 2020 Conference, which was held under the patronage of His Excellency Sheikh Khalid bin Khalifa bin Abdulaziz Al Thani in Doha, Qatar from 2 to 5 February 2020. The goal of the conference was to provide a platform to discuss next-generation infrastructure and its construction among key players such as researchers, industry professionals and leaders, local government agencies, clients, construction contractors and policymakers. The conference gathered industry and academia to disseminate their research and field experiences in multiple areas of civil engineering. It was also a unique opportunity for companies and organizations to show the most recent advances in the field of civil infrastructure and construction. The conference covered a wide range of timely topics that address the needs of the construction industry all over the world and particularly in Qatar. All papers were peer reviewed by experts in their field and edited for publication. The conference accepted a total number of 127 papers submitted by authors from five different continents under the following four themes: Theme 1: Construction Management and Process Theme 2: Materials and Transportation Engineering Theme 3: Geotechnical, Environmental, and Geo-environmental Engineering Theme 4: Sustainability, Renovation, and Monitoring of Civil InfrastructureThe list of the Sponsors are listed at page 1

Aeronautical engineering: A continuing bibliography with indexes (supplement 291)

This bibliography lists 757 reports, articles, and other documents introduced into the NASA scientific and technical information system in May. 1993. Subject coverage includes: design, construction and testing of aircraft and aircraft engines; aircraft components, equipment, and systems; ground support systems; and theoretical and applied aspects of aerodynamics and general fluid dynamics