218 research outputs found
Design Methodology of Very Large Scale Integration
Very Large Scale Integration (VLSI) deals with systems complexity rather than transistor size or circuit performance. VLSI design methodology is supported by Computer Aided Design (CAD) and Design Automation (DA) tools, which help VLSI designers to implement more complex and guaranteed designs. The increasing growth in VLSI complexity dictates a hierarchical design approach and the need for hardware DA tools.
This paper discusses the generalized Design Procedure for CAD circuit design; the commercial CADs offered by CALMA and the Caesar System, supported by the Berkeley design tools. A complete design of a Content Addressable Memory (CAM) cell, using the Caesar system, supported by Berkeley CAD tools, is illustrated
Interfaces, modularity and ecosystem emergence: How DARPA modularized the semiconductor ecosystem
Scholars have identified the pivotal role that modularity plays in promoting innovation. Modularity affects industry structure by breaking up the value chain along technical interfaces, thereby allowing new entrants to specialize and innovate. Less well-understood is where modularity comes from. Firms seem to behave consistently with the theory in some settings, especially the information technology sector, but not in others, such as automobiles. Here we show how the government has a role to play in generating open interfaces needed for modularity, utilizing a case study of the semiconductor industry from 1970 to 1980. We show how the Defense Department\u27s support for this effort aligned with its mission-based interest in semiconductors. We thus contribute a new source of open standards to the modularity literature, as well as a new analytical perspective to the public research funding literature
Open-access silicon photonics: current status and emerging initiatives
Silicon photonics is widely acknowledged as a game-changing technology driven by the needs of datacom and telecom. Silicon photonics builds on highly capital-intensive manufacturing infrastructure, and mature open-access silicon photonics platforms are translating the technology from research fabs to industrial manufacturing levels. To meet the current market demands for silicon photonics manufacturing, a variety of open-access platforms is offered by CMOS pilot lines, R&D institutes, and commercial foundries. This paper presents an overview of existing and upcoming commercial and noncommercial open-access silicon photonics technology platforms. We also discuss the diversity in these open-access platforms and their key differentiators
Product assurance technology for custom LSI/VLSI electronics
The technology for obtaining custom integrated circuits from CMOS-bulk silicon foundries using a universal set of layout rules is presented. The technical efforts were guided by the requirement to develop a 3 micron CMOS test chip for the Combined Release and Radiation Effects Satellite (CRRES). This chip contains both analog and digital circuits. The development employed all the elements required to obtain custom circuits from silicon foundries, including circuit design, foundry interfacing, circuit test, and circuit qualification
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ENABLING IOT AUTHENTICATION, PRIVACY AND SECURITY VIA BLOCKCHAIN
Although low-power and Internet-connected gadgets and sensors are increasingly integrated into our lives, the optimal design of these systems remains an issue. In particular, authentication, privacy, security, and performance are critical success factors. Furthermore, with emerging research areas such as autonomous cars, advanced manufacturing, smart cities, and building, usage of the Internet of Things (IoT) devices is expected to skyrocket. A single compromised node can be turned into a malicious one that brings down whole systems or causes disasters in safety-critical applications. This dissertation addresses the critical problems of (i) device management, (ii) data management, and (iii) service management in IoT systems. In particular, we propose an integrated platform solution for IoT device authentication, data privacy, and service security via blockchain-based smart contracts. We ensure IoT device authentication by blockchain-based IC traceability system, from its fabrication to its end-of-life, allowing both the supplier and a potential customer to verify an IC’s provenance. Results show that our proposed consortium blockchain framework implementation in Hyperledger Fabric for IC traceability achieves a throughput of 35 transactions per second (tps). To corroborate the blockchain information, we authenticate the IC securely and uniquely with an embedded Physically Unclonable Function (PUF). For reliable Weak PUF-based authentication, our proposed accelerated aging technique reduces the cumulative burn-in cost by ∼ 56%. We also propose a blockchain-based solution to integrate the privacy of data generated from the IoT devices by giving users control of their privacy. The smart contract controlled trust-base ensures that the users have private access to their IoT devices and data. We then propose a remote configuration of IC features via smart contracts, where an IC can be programmed repeatedly and securely. This programmability will enable users to upgrade IC features or rent upgraded IC features for a fixed period after users have purchased the IC. We tailor the hardware to meet the blockchain performance. Our on-die hardware module design enforces the hardware configuration’s secure execution and uses only 2,844 slices in the Xilinx Zedboard Zynq Evaluation board. The blockchain framework facilitates decentralized IoT, where interacting devices are empowered to execute digital contracts autonomously
Santa Clara Magazine, Volume 31 Number 3, Spring 1989
10 - VISION Santa Clara\u27s new president talks about his priorities for the University in the decade ahead.
15 - FAMILY IN CRISIS Is the Silicon Valley family an endangered species?
18 - DUBLIN: CITY OF 1,000 YEARS Today it is a bustling European capital. But progress has come at a price.
22 - GEORGE AND THE SILVER FOX A behind-the-scenes look at President and Mrs. Bush.
27 - WHO SHALL CARE .. . AND HOW? By 2020 every fourth American may be 65 or over.https://scholarcommons.scu.edu/sc_mag/1036/thumbnail.jp
Santa Clara Magazine, Volume 31 Number 3, Spring 1989
10 - VISION Santa Clara\u27s new president talks about his priorities for the University in the decade ahead.
15 - FAMILY IN CRISIS Is the Silicon Valley family an endangered species?
18 - DUBLIN: CITY OF 1,000 YEARS Today it is a bustling European capital. But progress has come at a price.
22 - GEORGE AND THE SILVER FOX A behind-the-scenes look at President and Mrs. Bush.
27 - WHO SHALL CARE .. . AND HOW? By 2020 every fourth American may be 65 or over.https://scholarcommons.scu.edu/sc_mag/1036/thumbnail.jp
E -commerce for the metal removal industry
The popularity of outsourcing fabrication introduces a problem, namely an inevitable loss of data as information is translated from design to fabrication or from one system to another. Unsatisfactory information, delivered to the outsourcing facility, and inefficient communications between design and fabrication certainly cause enormous economic losses from late product delivery or bad product quality. To overcome these data transferring problems and to improve communications between the design and fabrication sides, a design and manufacturing methodology for custom machined parts in E-Commerce is suggested and implemented in this dissertation. This methodology is based on the idea of a Clean Interface like the Mead-Conway approach for VLSI chip fabrication [MEAD81].
Essential design information for fabricating parts properly with NC (Numerical Controlled) milling machines is expressed in machining/manufacturing features, fabrication friendly terminologies, and is represented by a new language called NCML (Numerical Control Markup Language). NCML is based on XML (Extensible Markup Language)---the document-processing standard proposed by the World Wide Web Consortium (W3C). NCML is designed to include the minimum requisite information necessary for the manufacturer to produce the product. The designer defines NCML, which overcomes geographical separation between design and manufacturing, and minimizes unnecessary interactions caused from lack of information.
To prove the possibility of custom machine part fabrication and E-Commerce with NCML, three software systems are implemented. These three systems are FACILE/Design, FACILE/Fabricate, and E-Mill. FACILE is a prototype CAD/CAM system developed to verify NCML feasibility as an Electronic Data Interchange (EDI) format. FACILE/Design is a system based on manufacturing features like holes, contours, and pockets. It can be used to create geometric models, verify the design, and create NCML files. The NCML file is imported by FACILE/Fabricate and turned into G-codes by applying appropriate cutting conditions. Simplified machining simulation and cost estimation tools using NCML inputs are also developed to show some examples of NCML applications that can help design and manufacturing activities. To demonstrate how NCML could be used in a web-based application, an E-Business model called E-Mill has been implemented. E-Mill is a market place for machined parts whose data is encoded in NCML. To make E-Mill a feasible E-Commerce model, two-way communication based on NCML data and the visualization of 3D geometric models in the Virtual Reality Modeling Language (VRML) are equipped with a competitive matchmaking mechanism.
In this dissertation, a whole system based on NCML bridges the gap between design and manufacturing. As a part of the NCML validation process for the new system, the pros and cons of NCML design features are discussed. A system for cost estimation is calibrated and compared to real cutting results for the purpose of validation
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