Effect of electric load and dual atmosphere on the properties of an alkali containing diopside-based glass sealant for solid oxide cells

© 2019 Elsevier B.V. All rights reserved.A new alkali-containing diopside based glass-ceramic sealant for solid oxide cells was synthesized, characterized and tested. The composition was designed to match the coefficient of thermal expansion (CTE) of Crofer22APU interconnect. The sealant has a glass transition temperature of 600°C, a crystallization peak temperature of 850°C and a maximum shrinkage temperature of 700°C, thus suggesting effective densification prior to crystallization. The CTE of the glass-ceramic is 11.5 10-6 K-1, a value which is compatible with the CTE for Crofer22APU stainless steel. Crofer22APU/glass-ceramic/Crofer22APU joined samples were tested in simulated real-life operating conditions at 800°C in dual atmosphere under an applied voltage, monitoring the electrical resistivity. The effect of two different applied voltages (0.7V and 1.3V) was evaluated. A voltage of 1.3V led to a rapid decrease in the electrical resistivity during the test;such a drop was due to the formation of Cr2O3 “bridges” that connected the two Crofer22APU plates separated by the sealant. There was no decrease in the resistivity when a voltage of 0.7V was applied. Instead,resistivity value remained stable at around 105 Ω cm for the 100h test duration. The degradation mechanisms, due to both the alkali content and the applied voltage, are investigated and discussed.Peer reviewe

Effect of operating temperature on direct recycling aluminium chips (AA6061) in hot press forging process

A method of solid-state recycling aluminum alloy using hot press forging process was studied as well as the possibility of the recycled chip to be used as secondary resources. This paper presents the results of recycled AA6061 aluminium alloy chip using different operating temperature for hot press forging process. Mechanical properties and microstructure of the recycled specimens and as-received (reference) specimen were investigated. The recycled specimens exhibit a good potential in the strength properties. The result for yield strength (YS) and ultimate tensile strength (UTS) at the minimum temperature 430˚C is 25.8 MPa and 27.13 MPa. For the maximum operating temperature 520˚C YS and UTS are 107.0MPa and 117.53 MPa. Analysis for different operating temperatures shows that the higher temperatures giving better result on mechanical properties and finer microstructure. The strength of recycled specimen increases due to the grain refinement strengthening whereas particle dispersion strengthening has minor effects. In this study, the recycled AA6061 chip shows the good potential in strengthening as the comparison of using only 17.5% of suggested pressure (70.0/400.0) MPa, the UTS exhibit 35.8% (117.58/327.69) MPa. This shows a remarkable potential of direct recycling by using hot press forging process

Usage of Network Simulators in Machine-Learning-Assisted 5G/6G Networks

Without any doubt, Machine Learning (ML) will be an important driver of future communications due to its foreseen performance when applied to complex problems. However, the application of ML to networking systems raises concerns among network operators and other stakeholders, especially regarding trustworthiness and reliability. In this paper, we devise the role of network simulators for bridging the gap between ML and communications systems. In particular, we present an architectural integration of simulators in ML-aware networks for training, testing, and validating ML models before being applied to the operative network. Moreover, we provide insights on the main challenges resulting from this integration, and then give hints discussing how they can be overcome. Finally, we illustrate the integration of network simulators into ML-assisted communications through a proof-of-concept testbed implementation of a residential Wi-Fi network