Analytical modeling of switching energy of silicon carbide Schottky diodes as functions of dIDS/dt and temperature

SiC Schottky Barrier diodes (SiC SBD) are known to oscillate/ring in the output terminal when used as free-wheeling diodes in voltage-source converters. This ringing is due to RLC resonance among the diode capacitance, parasitic resistance, and circuit stray inductance. In this paper, a model has been developed for calculating the switching energy of SiC diodes as a function of the switching rate (dIDS/dt of the commutating SiC MOSFET) and temperature. It is shown that the damping of the oscillations increases with decreasing temperature and decreasing dIDS/dt. This in turn determines the switching energy of the diode, which initially decreases with decreasing dIDS/dt and subsequently increases with decreasing dIDS/dt thereby indicating an optimal dIDS/dt for minimum switching energy. The total switching energy of the diode can be subdivided into three phases namely the current switching phase, the voltage switching phase, and the ringing phase. Although the switching energy in the current switching phase decreases with increasing switching rate, the switching energy of the voltage and ringing phase increases with the switching rate. The model developed characterizes the dependence of diode's switching energy on temperature and dIDS/dt, hence, can be used to predict the behavior of the SiC SBD

The impact of temperature and switching rate on the dynamic characteristics of silicon carbide schottky barrier diodes and MOSFETs

Silicon carbide Schottky barrier diodes (SiC-SBDs) are prone to electromagnetic oscillations in the output characteristics. The oscillation frequency, peak voltage overshoot, and damping are shown to depend on the ambient temperature and the metal-oxide- semiconductor field-effect transistor (MOSFET) switching rate (dIDS/dt). In this paper, it is shown experimentally and theoretically that dIDS/dt increases with temperature for a given gate resistance during MOSFET turn-on and reduces with increasing temperature during turn-off. As a result, the oscillation frequency and peak voltage overshoot of the SiC-SBD increases with temperature during diode turn-off. This temperature dependence of the diode ringing reduces at higher dIDS/dt and increases at lower dIDS/dt. It is also shown that the rate of change of dIDS/dt with temperature (d2IDS/dtdT) is strongly dependent on RG and using fundamental device physics equations, this behavior is predictable. The dependence of the switching energy on dIDS/dt and temperature in 1.2-kV SiC-SBDs is measured over a wide temperature range (-75 °C to 200 °C). The diode switching energy analysis shows that the losses at low dIDS/dt are dominated by the transient duration and losses at high dIDS/dt are dominated by electromagnetic oscillations. The model developed and results obtained are important for predicting electromagnetic interference, reliability, and losses in SiC MOSFET/SBDs

Analysis of performance of SiC bipolar semiconductor devices for grid-level converters

Recent commercialization of SiC bipolar devices, including SiC BJT, SiC MPS diode and SiC PiN diodes have enabled potential candidates to replace their SiC unipolar counterparts. However, the prospects of 4H-SiC power bipolar devices still need further investigation. This thesis compares the static and dynamic performance and reliability for the commercial SiC bipolar devices including SiC BJT, SiC MPS diode and SiC PiN diode and their similarly rated Silicon counterparts mainly by means of experimental measurements.Through comprehensive double-pulse measurements, the turn-on and turn-off transition in Silicon BJT is seen to be much slower than that of the SiC BJT while the transient time will increase with temperature and decreases with collector currents. The common-emitter current gain (β) of SiC BJT is also found to be much higher than its Silicon counterpart. Significant turn-off delay is observed in single Si BJT which becomes worse when in parallel connection as it aggravates the current mismatch across the two devices, while this delay is almost non-existent in SiC devices. The current collapse seen in single SiC BJT is mitigated by parallel connection. These are dependant on temperature and base resistance, especially in the case of Silicon BJT. The static performance of power Silicon and SiC BJT has also been evaluated. It has been found that the higher base-emitter junction voltage of SiC BJTs enables quasi-saturation mode of operation with low on-resistance, which is also the case for Silicon BJTs only at high base currents. In terms of DC gain measured under steady state operation, the observed negative temperature coefficient (NTC) of β in SiC BJTs and the positive coefficient (PTC) in Silicon BJTs can make the β of SiC BJT lower than that in Silicon at high temperatures. It has been found that parallel connection promotes both the on-state conductivity and current gain in Silicon BJTs and conductivity in SiC BJTs.The characterization of power diodes reveals that the superior switching performance of the SiC MPS & JBS diode when compared with the Si PiN diode is due to the absence of the stored charge. This also leads to the larger on-state voltage in both SiC diodes and becomes worse at high currents under high temperatures. Through comprehensive Unclamped Inductive Switching (UIS) measurements, it is seen that the avalanche ruggedness of SiC MPS & JBS diodes outperform that of the closely rated Silicon PiN diode taking advantage of the wide-bandgap properties of SiC. Higher critical avalanche energy and thus better avalanche ruggedness can also be observed in SiC JBS diode compared with the SiC MPS diode. SiC MPS diodes can compete with Si PiN diodes in terms of the surge current limits, while the SiC JBS diode failed under a lower electrothermal stress. This is observed by the dramatic increase in its reverse leakage current at lower voltages.The 15 kV SiC PiN diodes feature smaller device dimensions, less reverse recovery charge and less on-resistance when compared to the 15 kV Silicon PiN diodes. Nevertheless, when evaluating its long-term reliability by using the aggravated power cycling configuration, the high junction temperature together with the dislocation defects in the SiC PiN diode accelerate its degradation. Such degradations are not observed in Silicon PiN diodes for the same junction temperature and high-temperature stress periods

Silicon carbide power devices

Abstract unavailable please refer to PD

Silicon Carbide Technology

Silicon carbide based semiconductor electronic devices and circuits are presently being developed for use in high-temperature, high-power, and high-radiation conditions under which conventional semiconductors cannot adequately perform. Silicon carbide's ability to function under such extreme conditions is expected to enable significant improvements to a far-ranging variety of applications and systems. These range from greatly improved high-voltage switching for energy savings in public electric power distribution and electric motor drives to more powerful microwave electronics for radar and communications to sensors and controls for cleaner-burning more fuel-efficient jet aircraft and automobile engines. In the particular area of power devices, theoretical appraisals have indicated that SiC power MOSFET's and diode rectifiers would operate over higher voltage and temperature ranges, have superior switching characteristics, and yet have die sizes nearly 20 times smaller than correspondingly rated silicon-based devices [8]. However, these tremendous theoretical advantages have yet to be widely realized in commercially available SiC devices, primarily owing to the fact that SiC's relatively immature crystal growth and device fabrication technologies are not yet sufficiently developed to the degree required for reliable incorporation into most electronic systems. This chapter briefly surveys the SiC semiconductor electronics technology. In particular, the differences (both good and bad) between SiC electronics technology and the well-known silicon VLSI technology are highlighted. Projected performance benefits of SiC electronics are highlighted for several large-scale applications. Key crystal growth and device-fabrication issues that presently limit the performance and capability of high-temperature and high-power SiC electronics are identified

A Low Temperature Co-fired Ceramic (LTCC) Interposer Based Three-Dimensional Stacked Wire Bondless Power Module

The objective of this dissertation research is to develop a low temperature co-fired ceramic (LTCC) interposer-based module-level 3-D wire bondless stacked power module. As part of the dissertation work, the 3-D wire bondless stack is designed, simulated, fabricated and characterized. The 3-D wire bondless stack is realized with two stand-alone power modules in a half-bridge configuration. Each stand-alone power module consists of two 1200 V 25 A silicon insulated-gate bipolar transistor (IGBT) devices in parallel and two 1200 V 20 A Schottky barrier diodes (SBD) in an antiparallel configuration. A novel interconnection scheme with conductive clamps and a spring loaded LTCC interposer is introduced to establish electrical connection between the stand-alone power modules to connect them in series to realize a half-bridge stack. Process development to fabricate the LTCC based 3-D stack is performed. In traditional power modules, wire bonds are used as a top side interconnections that introduce additional parasitic inductance in the current conduction path and prone to failure mechanism under high thermomechanical stresses. The loop inductance of the proposed 3-D half-bridge module exhibits 71% lower parasitic inductance compared to a wire bonded module. The 3-D stack exhibits better switching performance compared to the wire bonded counterpart. The measurement results for the 3-D stack shows 30% decrease in current overshoot at turn-on and 43% voltage overshoot at turn-off compared to the wire bonded module. Through measurements, it has been shown that the conducted noise reduces by 20 dB in the frequency range 20-30 MHz for the 3-D stack compared to the wire bonded counterpart. A simulation methodology using co-simulation techniques using ANSYS EM software tools is developed to predict EMI of a power module. Hardware verification of the proposed simulation methodology is performed to validate the co-simulation technique. The correlation coefficient between the measurement and simulation is found to be 0.73. It is shown that 53% of the variability in the simulation can be explained by the simulated result. Moreover, the simulated and measured amplitudes of the EMI spectrum closely match with each other with some variations due to round-off errors due to the FFT conversion

Analysis of the 1st and 3rd Quadrant Transients of Symmetrical and Asymmetrical Double-Trench SiC Power MOSFETs

In this paper, performance at 1 st and 3 rd quadrant operation of Silicon and Silicon Carbide (SiC) symmetrical and asymmetrical double-trench, superjunction and planar power MOSFETs is analysed through a wide range of experimental measurements using compact modeling. The devices are evaluated on a high voltage clamped inductive switching test rig and switched at a range of switching rates at elevated junction temperatures. It is shown, experimentally, that in the 1 st quadrant, CoolSiC (SiC asymmetrical double-trench) MOSFET and SiC symmetrical double-trench MOSFET demonstrate more stable temperature coefficients. Silicon Superjunction MOSFETs exhibits the lowest turn-off switching rates due to the large input capacitance. The evaluated SiC Planar MOSFET also performs sub-optimally at turn-on switching due to its higher input capacitance and shows more temperature sensitivity due to its lower threshold voltage. In the 3 rd quadrant, the relatively larger reverse recovery charge of Silicon Superjunction MOSFET negatively impacts the turn-OFF transients compared with the SiC MOSFETs. It is also seen that among the SiC MOSFETs, the two double-trench MOSFET structures outperform the selected SiC planar MOSFET in terms of reverse recovery

Multi-objective optimization of power electronic converters

L'abstract è presente nell'allegato / the abstract is in the attachmen

Design and Assessment of a Grid Connected Industrial Full-SiC Converter for 690 V Grids

Die Bedeutung von Leistungshalbleitern mit großem Bandabstand (Wide Band Gap, WBG) nahm in den letzten drei Jahrzehnten kontinuierlich zu. Diese Bauelemente haben das Potenzial, Silizium (Si) - Bauelemente in bestimmten Anwendungen sowie Leistungs- und Frequenzbereichen zu ersetzen. Siliziumkarbid (SiC)-Leistungshalbleiter sind die gegenwärtig am Weitesten entwickelten WBG-Leistungshalbleiter. Dank besonderer Materialeigenschaften zeichnen sich SiC-Leistungshalbleiter im Vergleich zu Si-Bauelementen durch einen geringeren spezifischen Widerstand, eine höhere Schaltgeschwindigkeit, geringere schaltverluste sowie eine höhere maximale Sperrschichttemperatur aus. Die deutlich erhöhten Herstellungskosten limitieren den Einsatz von SiC-Leistungshalbleitern auf Anwendungen, in denen die Vorteile dieser Bauelemente die höheren Kosten überkompensieren und Systemvorteile ermöglichen. Heute werden SiC-Leistungshalbleiter z.B. in Solarwechselrichtern oder in Elektrofahrzeugen verwendet. Für Stromrichter industrieller elektrischer Antriebe ist die Kosten-Nutzen-Bilanz des Einsatzes von SiC-Leistungshalbleitern gegenwärtig nicht bekannt. Diese Fragestellung motiviert diese Arbeit. Die Auslegung sowie die daraus resultierenden Vor- und Nachteile eines Stromrichters mit SiC-Leistungshalbleitern für elektrische Industrieantriebe ist der Untersuchungsgegenstand dieser Arbeit. Zu diesem Zweck wurde unter Einhaltung industrieller Auslegungskriterien ein 240 kVA SiC-basierter Stromrichterdemonstrator als aktiver Gleichrichter am dreiphasigen 690 V Niederspannungsnetz untersucht. Auf der Basis einer Stromrichterauslegung für SiC- und Si-Leistungshalbleiter wurde ein theoretischer Vergleich von Kosten, Effizienz, Größe und Gewicht durchgeführt. Die Arbeit stellt zunächst den Stand der Technik für SiC-Leistungshalbleiter dar. Anschließend wird ein geeignetes SiC-MOSFET Module für den industriellen Stromrichter ausgewählt und bezüglich des Schaltverhaltens sowie der Parallelschaltung charakterisiert. Der Auslegung des Stromrichterleistungsteils liegen industrielle Anforderungen zu Grunde. Ein realisierter Demonstrator für einen netzseitigen Stromrichter (Active Front End) ist durch eine symmetrische Parallelschaltung von zwei SiC-Modulen, geeignete Ansteuerschaltungen (Gate Drive Units), eine niedrige Streuinduktivität im Kommutierungskreis sowie ein LCL-Filter mit Standard-Kernmaterialien gekennzeichnet. Der Stromrichtervergleich zeigt, dass der betrachtete Stromrichter mit SiC-Leistungshalbleitern im gesamten Betriebsbereich geringere Verluste verursacht als ein vergleichbarer Stromrichter mit Si-Leistungshalbleitern. Der SiC - basierte Stromichter ermöglicht auch eine deutliche Gewichtsreduktion bei ca. 89% der Systemkosten. Somit stellen SiC-Leistungshalbleiter eine attraktive technische Lösung für die untersuchte Anwendung eines aktiven Gleichrichters für industrielle elektrische Antriebe dar.Wide bandgap (WBG) power semiconductors have drawn steadily increasing interest in power electronics in the last three decades. These devices have shown the potential of replacing silicon as the default semiconductor solution for several applications in determined power and frequency ranges. Among them the most mature WBG semiconductor material is silicon carbide (SiC), which presents several characteristics at the crystal level that translate in the potential of presenting lower resistivity, be able to switch faster with lower switching loss, and present both higher characteristics to tolerate and dissipate heat when com pared with silicon. However, the same characteristics that make it great also present a different set of drawbacks to be considered, which aligned with its increased cost make it challenging to assess if its advantages are justified for a particular application. Applications that highly value efficiency and/or power density are the most benefited, and converter solutions featuring the technology have already breached into these application markets. However in other applica tions, the line from which silicon carbide starts making sense in the cost/benefits/drawbacks balance is not clear. This is typically the case of industrial applications, which were the main focus and motivation of this work. Hence, in this work the main goal has been to determine the basic characteristics, advantages and limitations that SiC technology designs for industrial low voltage high power grid connected converters present. To that end, a 690 V, 240 kVA SiC-based grid-tied converter demonstrator following industrial design criteria has been developed. Then, based on this design procedure a theoretical comparison between a 690 V, 190 kVA SiC-based converter against a silicon-based converter designed for the same power output has been performed to compare them regarding cost, efficiency, size and weight. This work also comprises a thorough revision of the state of art of SiC devices, which led to the selection of the switching device. Additionally, a characterization of both single and parallel-connected operation of the semiconductor modules was performed, to determine the module characteristics and its suitability to build the SiC converter demonstrator. Results show that the converter demonstrator operates as designed, proving that is possible with the corresponding precautions to achieve: a low inductive power loop, balanced parallel connection of SiC modules, adequate driving circuits for the parallel-connected modules and an adequate filtering solution in compliance with grid-codes based on standard core materials for the selected switching frequency. Finally, the theoretical comparison between the two designed power converters shows that, attained to the conditions of the comparison, the SiC converter solution presents efficiency gains over the whole operating range, while presenting substantial weight savings at 89% of the costs of the Si-IGBT design, presenting itself as the cost-effective solution for the presented application requirements under the given design constraints