Evaluation of temperature-performance trade-offs in wireless network-on-chip architectures

Continued scaling of device geometries according to Moore\u27s Law is enabling complete end-user systems on a single chip. Massive multicore processors are enablers for many information and communication technology (ICT) innovations spanning various domains, including healthcare, defense, and entertainment. In the design of high-performance massive multicore chips, power and heat are dominant constraints. Temperature hotspots witnessed in multicore systems exacerbate the problem of reliability in deep submicron technologies. Hence, there is a great need to explore holistic power and thermal optimization and management strategies for the massive multicore chips. High power consumption not only raises chip temperature and cooling cost, but also decreases chip reliability and performance. Thus, addressing thermal concerns at different stages of the design and operation is critical to the success of future generation systems. The performance of a multicore chip is also influenced by its overall communication infrastructure, which is predominantly a Network-on-Chip (NoC). The existing method of implementing a NoC with planar metal interconnects is deficient due to high latency, significant power consumption, and temperature hotspots arising out of long, multi-hop wireline links used in data exchange. On-chip wireless networks are envisioned as an enabling technology to design low power and high bandwidth massive multicore architectures. However, optimizing wireless NoCs for best performance does not necessarily guarantee a thermally optimal interconnection architecture. The wireless links being highly efficient attract very high traffic densities which in turn results in temperature hotspots. Therefore, while the wireless links result in better performance and energy-efficiency, they can also cause temperature hotspots and undermine the reliability of the system. Consequently, the location and utilization of the wireless links is an important factor in thermal optimization of high performance wireless Networks-on-Chip. Architectural innovation in conjunction with suitable power and thermal management strategies is the key for designing high performance yet energy-efficient massive multicore chips. This work contributes to exploration of various the design methodologies for establishing wireless NoC architectures that achieve the best trade-offs between temperature, performance and energy-efficiency. It further demonstrates that incorporating Dynamic Thermal Management (DTM) on a multicore chip designed with such temperature and performance optimized Wireless Network-on-Chip architectures improves thermal profile while simultaneously providing lower latency and reduced network energy dissipation compared to its conventional counterparts

Resource and thermal management in 3D-stacked multi-/many-core systems

Continuous semiconductor technology scaling and the rapid increase in computational needs have stimulated the emergence of multi-/many-core processors. While up to hundreds of cores can be placed on a single chip, the performance capacity of the cores cannot be fully exploited due to high latencies of interconnects and memory, high power consumption, and low manufacturing yield in traditional (2D) chips. 3D stacking is an emerging technology that aims to overcome these limitations of 2D designs by stacking processor dies over each other and using through-silicon-vias (TSVs) for on-chip communication, and thus, provides a large amount of on-chip resources and shortens communication latency. These benefits, however, are limited by challenges in high power densities and temperatures. 3D stacking also enables integrating heterogeneous technologies into a single chip. One example of heterogeneous integration is building many-core systems with silicon-photonic network-on-chip (PNoC), which reduces on-chip communication latency significantly and provides higher bandwidth compared to electrical links. However, silicon-photonic links are vulnerable to on-chip thermal and process variations. These variations can be countered by actively tuning the temperatures of optical devices through micro-heaters, but at the cost of substantial power overhead. This thesis claims that unearthing the energy efficiency potential of 3D-stacked systems requires intelligent and application-aware resource management. Specifically, the thesis improves energy efficiency of 3D-stacked systems via three major components of computing systems: cache, memory, and on-chip communication. We analyze characteristics of workloads in computation, memory usage, and communication, and present techniques that leverage these characteristics for energy-efficient computing. This thesis introduces 3D cache resource pooling, a cache design that allows for flexible heterogeneity in cache configuration across a 3D-stacked system and improves cache utilization and system energy efficiency. We also demonstrate the impact of resource pooling on a real prototype 3D system with scratchpad memory. At the main memory level, we claim that utilizing heterogeneous memory modules and memory object level management significantly helps with energy efficiency. This thesis proposes a memory management scheme at a finer granularity: memory object level, and a page allocation policy to leverage the heterogeneity of available memory modules and cater to the diverse memory requirements of workloads. On the on-chip communication side, we introduce an approach to limit the power overhead of PNoC in (3D) many-core systems through cross-layer thermal management. Our proposed thermally-aware workload allocation policies coupled with an adaptive thermal tuning policy minimize the required thermal tuning power for PNoC, and in this way, help broader integration of PNoC. The thesis also introduces techniques in placement and floorplanning of optical devices to reduce optical loss and, thus, laser source power consumption.2018-03-09T00:00:00

Scaling Distributed Cache Hierarchies through Computation and Data Co-Scheduling

Cache hierarchies are increasingly non-uniform, so for systems to scale efficiently, data must be close to the threads that use it. Moreover, cache capacity is limited and contended among threads, introducing complex capacity/latency tradeoffs. Prior NUCA schemes have focused on managing data to reduce access latency, but have ignored thread placement; and applying prior NUMA thread placement schemes to NUCA is inefficient, as capacity, not bandwidth, is the main constraint. We present CDCS, a technique to jointly place threads and data in multicores with distributed shared caches. We develop novel monitoring hardware that enables fine-grained space allocation on large caches, and data movement support to allow frequent full-chip reconfigurations. On a 64-core system, CDCS outperforms an S-NUCA LLC by 46% on average (up to 76%) in weighted speedup and saves 36% of system energy. CDCS also outperforms state-of-the-art NUCA schemes under different thread scheduling policies.National Science Foundation (U.S.) (Grant CCF-1318384)Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science (Jacobs Presidential Fellowship)United States. Defense Advanced Research Projects Agency (PERFECT Contract HR0011-13-2-0005

Software-Defined Cloud Computing: Architectural Elements and Open Challenges

The variety of existing cloud services creates a challenge for service providers to enforce reasonable Software Level Agreements (SLA) stating the Quality of Service (QoS) and penalties in case QoS is not achieved. To avoid such penalties at the same time that the infrastructure operates with minimum energy and resource wastage, constant monitoring and adaptation of the infrastructure is needed. We refer to Software-Defined Cloud Computing, or simply Software-Defined Clouds (SDC), as an approach for automating the process of optimal cloud configuration by extending virtualization concept to all resources in a data center. An SDC enables easy reconfiguration and adaptation of physical resources in a cloud infrastructure, to better accommodate the demand on QoS through a software that can describe and manage various aspects comprising the cloud environment. In this paper, we present an architecture for SDCs on data centers with emphasis on mobile cloud applications. We present an evaluation, showcasing the potential of SDC in two use cases-QoS-aware bandwidth allocation and bandwidth-aware, energy-efficient VM placement-and discuss the research challenges and opportunities in this emerging area.Comment: Keynote Paper, 3rd International Conference on Advances in Computing, Communications and Informatics (ICACCI 2014), September 24-27, 2014, Delhi, Indi

Energy consumption in networks on chip : efficiency and scaling

Computer architecture design is in a new era where performance is increased by replicating processing cores on a chip rather than making CPUs larger and faster. This design strategy is motivated by the superior energy efficiency of the multi-core architecture compared to the traditional monolithic CPU. If the trend continues as expected, the number of cores on a chip is predicted to grow exponentially over time as the density of transistors on a die increases. A major challenge to the efficiency of multi-core chips is the energy used for communication among cores over a Network on Chip (NoC). As the number of cores increases, this energy also increases, imposing serious constraints on design and performance of both applications and architectures. Therefore, understanding the impact of different design choices on NoC power and energy consumption is crucial to the success of the multi- and many-core designs. This dissertation proposes methods for modeling and optimizing energy consumption in multi- and many-core chips, with special focus on the energy used for communication on the NoC. We present a number of tools and models to optimize energy consumption and model its scaling behavior as the number of cores increases. We use synthetic traffic patterns and full system simulations to test and validate our methods. Finally, we take a step back and look at the evolution of computer hardware in the last 40 years and, using a scaling theory from biology, present a predictive theory for power-performance scaling in microprocessor systems

ARMD Workshop on Materials and Methods for Rapid Manufacturing for Commercial and Urban Aviation

This report documents the goals, organization and outcomes of the NASA Aeronautics Research Mission Directorates (ARMD) Materials and Methods for Rapid Manufacturing for Commercial and Urban Aviation Workshop. The workshop began with a series of plenary presentations by leaders in the field of structures and materials, followed by concurrent symposia focused on forecasting the future of various technologies related to rapid manufacturing of metallic materials and polymeric matrix composites, referred to herein as composites. Shortly after the workshop, questionnaires were sent to key workshop participants from the aerospace industry with requests to rank the importance of a series of potential investment areas identified during the workshop. Outcomes from the workshop and subsequent questionnaires are being used as guidance for NASA investments in this important technology area

Coarse-grained reconfigurable array architectures

Coarse-Grained Reconfigurable Array (CGRA) architectures accelerate the same inner loops that benefit from the high ILP support in VLIW architectures. By executing non-loop code on other cores, however, CGRAs can focus on such loops to execute them more efficiently. This chapter discusses the basic principles of CGRAs, and the wide range of design options available to a CGRA designer, covering a large number of existing CGRA designs. The impact of different options on flexibility, performance, and power-efficiency is discussed, as well as the need for compiler support. The ADRES CGRA design template is studied in more detail as a use case to illustrate the need for design space exploration, for compiler support and for the manual fine-tuning of source code