A mixed-signal early vision chip with embedded image and programming memories and digital I/O

From a system level perspective, this paper presents a 128 × 128 flexible and reconfigurable Focal-Plane Analog Programmable Array Processor, which has been designed as a single chip in a 0.35μm standard digital 1P-5M CMOS technology. The core processing array has been designed to achieve high-speed of operation and large-enough accuracy (∼ 7bit) with low power consumption. The chip includes on-chip program memory to allow for the execution of complex, sequential and/or bifurcation flow image processing algorithms. It also includes the structures and circuits needed to guarantee its embedding into conventional digital hosting systems: external data interchange and control are completely digital. The chip contains close to four million transistors, 90% of them working in analog mode. The chip features up to 330GOPs (Giga Operations per second), and uses the power supply (180GOP/Joule) and the silicon area (3.8 GOPS/mm2) efficiently, as it is able to maintain VGA processing throughputs of 100Frames/s with about 15 basic image processing tasks on each frame

Neuro-fuzzy chip to handle complex tasks with analog performance

This paper presents a mixed-signal neuro-fuzzy controller chip which, in terms of power consumption, input–output delay, and precision, performs as a fully analog implementation. However, it has much larger complexity than its purely analog counterparts. This combination of performance and complexity is achieved through the use of a mixed-signal architecture consisting of a programmable analog core of reduced complexity, and a strategy, and the associated mixed-signal circuitry, to cover the whole input space through the dynamic programming of this core. Since errors and delays are proportional to the reduced number of fuzzy rules included in the analog core, they are much smaller than in the case where the whole rule set is implemented by analog circuitry. Also, the area and the power consumption of the new architecture are smaller than those of its purely analog counterparts simply because most rules are implemented through programming. The Paper presents a set of building blocks associated to this architecture, and gives results for an exemplary prototype. This prototype, called multiplexing fuzzy controller (MFCON), has been realized in a CMOS 0.7 um standard technology. It has two inputs, implements 64 rules, and features 500 ns of input to output delay with 16-mW of power consumption. Results from the chip in a control application with a dc motor are also provided

Neuro-fuzzy chip to handle complex tasks with analog performance

This Paper presents a mixed-signal neuro-fuzzy controller chip which, in terms of power consumption, input-output delay and precision performs as a fully analog implementation. However, it has much larger complexity than its purely analog counterparts. This combination of performance and complexity is achieved through the use of a mixed-signal architecture consisting of a programmable analog core of reduced complexity, and a strategy, and the associated mixed-signal circuitry, to cover the whole input space through the dynamic programming of this core [1]. Since errors and delays are proportional to the reduced number of fuzzy rules included in the analog core, they are much smaller than in the case where the whole rule set is implemented by analog circuitry. Also, the area and the power consumption of the new architecture are smaller than those of its purely analog counterparts simply because most rules are implemented through programming. The Paper presents a set of building blocks associated to this architecture, and gives results for an exemplary prototype. This prototype, called MFCON, has been realized in a CMOS 0.7μm standard technology. It has two inputs, implements 64 rules and features 500ns of input to output delay with 16mW of power consumption. Results from the chip in a control application with a DC motor are also provided

Design and debugging of multi-step analog to digital converters

With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process

System Identification, Diagnosis, and Built-In Self-Test of High Switching Frequency DC-DC Converters

abstract: Complex electronic systems include multiple power domains and drastically varying dynamic power consumption patterns, requiring the use of multiple power conversion and regulation units. High frequency switching converters have been gaining prominence in the DC-DC converter market due to smaller solution size (higher power density) and higher efficiency. As the filter components become smaller in value and size, they are unfortunately also subject to higher process variations and worse degradation profiles jeopardizing stable operation of the power supply. This dissertation presents techniques to track changes in the dynamic loop characteristics of the DC-DC converters without disturbing the normal mode of operation. A digital pseudo-noise (PN) based stimulus is used to excite the DC-DC system at various circuit nodes to calculate the corresponding closed-loop impulse response. The test signal energy is spread over a wide bandwidth and the signal analysis is achieved by correlating the PN input sequence with the disturbed output generated, thereby accumulating the desired behavior over time. A mixed-signal cross-correlation circuit is used to derive on-chip impulse responses, with smaller memory and lower computational requirement in comparison to a digital correlator approach. Model reference based parametric and non-parametric techniques are discussed to analyze the impulse response results in both time and frequency domain. The proposed techniques can extract open-loop phase margin and closed-loop unity-gain frequency within 5.2% and 4.1% error, respectively, for the load current range of 30-200mA. Converter parameters such as natural frequency (ω_n ), quality factor (Q), and center frequency (ω_c ) can be estimated within 3.6%, 4.7%, and 3.8% error respectively, over load inductance of 4.7-10.3µH, and filter capacitance of 200-400nF. A 5-MHz switching frequency, 5-8.125V input voltage range, voltage-mode controlled DC-DC buck converter is designed for the proposed built-in self-test (BIST) analysis. The converter output voltage range is 3.3-5V and the supported maximum load current is 450mA. The peak efficiency of the converter is 87.93%. The proposed converter is fabricated on a 0.6µm 6-layer-metal Silicon-On-Insulator (SOI) technology with a die area of 9mm^2 . The area impact due to the system identification blocks including related I/O structures is 3.8% and they consume 530µA quiescent current during operation.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201

ACE16K: The Third Generation of Mixed-Signal SIMD-CNN ACE Chips Toward VSoCs

Today, with 0.18-μm technologies mature and stable enough for mixed-signal design with a large variety of CMOS compatible optical sensors available and with 0.09-μm technologies knocking at the door of designers, we can face the design of integrated systems, instead of just integrated circuits. In fact, significant progress has been made in the last few years toward the realization of vision systems on chips (VSoCs). Such VSoCs are eventually targeted to integrate within a semiconductor substrate the functions of optical sensing, image processing in space and time, high-level processing, and the control of actuators. The consecutive generations of ACE chips define a roadmap toward flexible VSoCs. These chips consist of arrays of mixed-signal processing elements (PEs) which operate in accordance with single instruction multiple data (SIMD) computing architectures and exhibit the functional features of CNN Universal Machines. They have been conceived to cover the early stages of the visual processing path in a fully-parallel manner, and hence more efficiently than DSP-based systems. Across the different generations, different improvements and modifications have been made looking to converge with the newest discoveries of neurobiologists regarding the behavior of natural retinas. This paper presents considerations pertaining to the design of a member of the third generation of ACE chips, namely to the so-called ACE16k chip. This chip, designed in a 0.35-μm standard CMOS technology, contains about 3.75 million transistors and exhibits peak computing figures of 330 GOPS, 3.6 GOPS/mm2 and 82.5 GOPS/W. Each PE in the array contains a reconfigurable computing kernel capable of calculating linear convolutions on 3×3 neighborhoods in less than 1.5 μs, imagewise Boolean combinations in less than 200 ns, imagewise arithmetic operations in about 5 μs, and CNN-like temporal evolutions with a time constant of about 0.5 μs. Unfortunately, the many ideas underlying the design of this chip cannot be covered in a single paper; hence, this paper is focused on, first, placing the ACE16k in the ACE chip roadmap and, then, discussing the most significant modifications of ACE16K versus its predecessors in the family.LOCUST IST2001—38 097VISTA TIC2003—09 817 - C02—01Office of Naval Research N000 140 210 88