Fault modelling and accelerated simulation of integrated circuits manufacturing defects under process variation

As silicon manufacturing process scales to and beyond the 65-nm node, process variation can no longer be ignored. The impact of process variation on integrated circuit performance and power has received significant research input. Variation-aware test, on the other hand, is a relatively new research area that is currently receiving attention worldwide.Research has shown that test without considering process variation may lead to loss of test quality. Fault modelling and simulation serve as a backbone of manufacturing test. This thesis is concerned with developing efficient fault modelling techniques and simulation methodologies that take into account the effect of process variation on manufacturing defects with particular emphasis on resistive bridges and resistive opens.The first contribution of this thesis addresses the problem of long computation time required to generate logic fault of resistive bridges under process variation by developing a fast and accurate modelling technique to model logic fault behaviour of resistive bridges.The new technique is implemented by employing two efficient voltage calculation algorithms to calculate the logic threshold voltage of driven gates and critical resistance of a fault-site to enable the computation of bridge logic faults without using SPICE. Simulation results show that the technique is fast (on average 53 times faster) and accurate (worst case is 2.64% error) when compared with HSPICE. The second contribution analyses the complexity of delay fault simulation of resistive bridges to reduce the computation time of delay fault when considering process variation. An accelerated delay fault simulation methodology of resistive bridges is developed by employing a three-step strategy to speed up the calculation of transient gate output voltage which is needed to accurately compute delay faults. Simulation results show that the methodology is on average 17.4 times faster, with 5.2% error in accuracy, when compared with HSPICE. The final contribution presents an accelerated simulation methodology of resistive opens to address the problem of long simulation time of delay fault when considering process variation. The methodology is implemented by using two efficient algorithms to accelerate the computation of transient gate output voltage and timing critical resistance of an open fault-site. Simulation results show that the methodology is on average up to 52 times faster than HSPICE, with 4.2% error in accuracy

Fault simulation and test generation for small delay faults

Delay faults are an increasingly important test challenge. Traditional delay fault models are incomplete in that they model only a subset of delay defect behaviors. To solve this problem, a more realistic delay fault model has been developed which models delay faults caused by the combination of spot defects and parametric process variation. According to the new model, a realistic delay fault coverage metric has been developed. Traditional path delay fault coverage metrics result in unrealistically low fault coverage, and the real test quality is not reflected. The new metric uses a statistical approach and the simulation based fault coverage is consistent with silicon data. Fast simulation algorithms are also included in this dissertation. The new metric suggests that testing the K longest paths per gate (KLPG) has high detection probability for small delay faults under process variation. In this dissertation, a novel automatic test pattern generation (ATPG) methodology to find the K longest testable paths through each gate for both combinational and sequential circuits is presented. Many techniques are used to reduce search space and CPU time significantly. Experimental results show that this methodology is efficient and able to handle circuits with an exponential number of paths, such as ISCAS85 benchmark circuit c6288. The ATPG methodology has been implemented on industrial designs. Speed binning has been done on many devices and silicon data has shown significant benefit of the KLPG test, compared to several traditional delay test approaches

Modelling and Test Generation for Crosstalk Faults in DSM Chips

In the era of deep submicron technology (DSM), many System-on-Chip (SoC) applications require the components to be operating at high clock speeds. With the shrinking feature size and ever increasing clock frequencies, the DSM technology has led to a well-known problem of Signal Integrity (SI) more especially in the connecting layout design. The increasing aspect ratios of metal wires and also the ratio of coupling capacitance over substrate capacitance result in electrical coupling of interconnects which leads to crosstalk problems. In this thesis, first the work carried out to model the crosstalk behaviour between aggressor and victim by considering the distributed RLGC parameters of interconnect and the coupling capacitance and mutual conductance between the two nets is presented. The proposed model also considers the RC linear models of the CMOS drivers and receivers. The behaviour of crosstalk in case of under etching problem has been studied and modelled by distributing and approximating the defect behaviour throughout the nets. Next, the proposed model has also been extended to model the behaviour of crosstalk in case of one victim is influenced by several aggressors by considering all aggressors have similar effect (worst-case) on victim. In all the above cases simulation experiments were also carried out and compared with well-known circuit simulation tool PSPICE. It has been proved that the generated crosstalk model is faster and the results generated are within 10% of error margin compared to latter simulation tool. Because of the accuracy and speed of the proposed model, the model is very useful for both SoC designers and test engineers to analyse the crosstalk behaviour. Each manufactured device needs to be tested thoroughly to ensure the functionality before its delivery. The test pattern generation for crosstalk faults is also necessary to test the corresponding crosstalk faults. In this thesis, the well-known PODEM algorithm for stuck-at faults is extended to generate the test patterns for crosstalk faults between single aggressor and single victim. To apply modified PODEM for crosstalk faults, the transition behaviour has been divided into two logic parts as before transition and after transition. After finding individually required test patterns for before transition and after transition, the generated logic vectors are appended to create transition test patterns for crosstalk faults. The developed algorithm is also applied for a few ISCAS 85 benchmark circuits and the fault coverage is found excellent in most circuits. With the incorporation of proposed algorithm into the ATPG tools, the efficiency of testing will be improved by generating the test patterns for crosstalk faults besides for the conventional stuck-at faults. In generating test patterns for crosstalk faults on single victim due to multiple aggressors, the modified PODEM algorithm is found to be more time consuming. The search capability of Genetic Algorithms in finding the required combination of several input factors for any optimized problem fascinated to apply GA for generating test patterns as generating the test pattern is also similar to finding the required vector out of several input transitions. Initially the GA is applied for generating test patterns for stuck-at faults and compared the results with PODEM algorithm. As the fault coverage is almost similar to the deterministic algorithm PODEM, the GA developed for stuck-at faults is extended to find test patterns for crosstalk faults between single aggressor and single victim. The elitist GA is also applied for a few ISCAS 85 benchmark circuits. Later the algorithm is extended to generate test patterns for worst-case crosstalk faults. It has been proved that elitist GA developed in this thesis is also very useful in generating test patterns for crosstalk faults especially for multiple aggressor and single victim crosstalk faults

Product assurance technology for custom LSI/VLSI electronics

The technology for obtaining custom integrated circuits from CMOS-bulk silicon foundries using a universal set of layout rules is presented. The technical efforts were guided by the requirement to develop a 3 micron CMOS test chip for the Combined Release and Radiation Effects Satellite (CRRES). This chip contains both analog and digital circuits. The development employed all the elements required to obtain custom circuits from silicon foundries, including circuit design, foundry interfacing, circuit test, and circuit qualification

Fault simulation for structural testing of analogue integrated circuits

In this thesis the ANTICS analogue fault simulation software is described which provides a statistical approach to fault simulation for accurate analogue IC test evaluation. The traditional figure of fault coverage is replaced by the average probability of fault detection. This is later refined by considering the probability of fault occurrence to generate a more realistic, weighted test metric. Two techniques to reduce the fault simulation time are described, both of which show large reductions in simulation time with little loss of accuracy. The final section of the thesis presents an accurate comparison of three test techniques and an evaluation of dynamic supply current monitoring. An increase in fault detection for dynamic supply current monitoring is obtained by removing the DC component of the supply current prior to measurement

Optimizing Test Pattern Generation Using Top-Off ATPG Methodology for Stuck–AT, Transition and Small Delay Defect Faults

The ever increasing complexity and size of digital circuits complemented by Deep Sub Micron (DSM) technology trends today pose challenges to the efficient Design For Test (DFT) methodologies. Innovation is required not only in designing the digital circuits, but also in automatic test pattern generation (ATPG) to ensure that the pattern set screens all the targeted faults while still complying with the Automatic Test Equipment (ATE) memory constraints. DSM technology trends push the requirements of ATPG to not only include the conventional static defects but also to include test patterns for dynamic defects. The current industry practices consider test pattern generation for transition faults to screen dynamic defects. It has been observed that just screening for transition faults alone is not sufficient in light of the continuing DSM technology trends. Shrinking technology nodes have pushed DFT engineers to include Small Delay Defect (SDD) test patterns in the production flow. The current industry standard ATPG tools are evolving and SDD ATPG is not the most economical option in terms of both test generation CPU time and pattern volume. New techniques must be explored in order to ensure that a quality test pattern set can be generated which includes patterns for stuck-at, transition and SDD faults, all the while ensuring that the pattern volume remains economical. This thesis explores the use of a “Top-Off” ATPG methodology to generate an optimal test pattern set which can effectively screen the required fault models while containing the pattern volume within a reasonable limit

The Fifth NASA Symposium on VLSI Design

The fifth annual NASA Symposium on VLSI Design had 13 sessions including Radiation Effects, Architectures, Mixed Signal, Design Techniques, Fault Testing, Synthesis, Signal Processing, and other Featured Presentations. The symposium provides insights into developments in VLSI and digital systems which can be used to increase data systems performance. The presentations share insights into next generation advances that will serve as a basis for future VLSI design

Defect-based testing of LTS digital circuits

A Defect-Based Test (DBT) methodology for Superconductor Electronics (SCE) is presented in this thesis, so that commercial production and efficient testing of systems can be implemented in this technology in the future. In the first chapter, the features and prospects for SCE have been presented. The motivation for this research and the outline of the thesis were also described in Chapter 1. It has been shown that high-end applications such as Software-Defined Radio (SDR) and petaflop computers which are extremely difficult to implement in top-of-the-art semiconductor technologies can be realised using SCE. But, a systematic structural test methodology had yet to be developed for SCE and has been addressed in this thesis. A detailed introduction to Rapid Single-Flux Quantum (RSFQ) circuits was presented in Chapter 2. A Josephson Junction (JJ) was described with associated theory behind its operation. The JJ model used in the simulator used in this research work was also presented. RSFQ logic with logic protocols as well as the design and implementation of an example D-type flip-flop (DFF) was also introduced. Finally, advantages and disadvantages of RSFQ circuits have been discussed with focus on the latest developments in the field. Various techniques for testing RSFQ circuits were discussed in Chapter 3. A Process Defect Monitor (PDM) approach was presented for fabrication process analysis. The presented defect-monitor structures were used to gather measurement data, to find the probability of the occurrence of defects in the process which forms the first step for Inductive Fault Analysis (IFA). Results from measurements on these structures were used to create a database for defects. This information can be used as input for performing IFA. "Defect-sprinkling" over a fault-free circuit can be carried out according to the measured defect densities over various layers. After layout extraction and extensive fault simulation, the resulting information will indicate realistic faults. In addition, possible Design-for-Testability (DfT) schemes for monitoring Single-Flux Quantum (SFQ) pulses within an RSFQ circuit has also been discussed in Chapter 3. The requirement for a DfT scheme is inevitable for RSFQ circuits because of their very high frequency of operation and very low operating temperature. It was demonstrated how SFQ pulses can be monitored at an internal node of an SCE circuit, introducing observability using Test-Point Insertion (TPI). Various techniques were discussed for the introduction of DfT and to avoid the delay introduced by the DfT structure if it is required. The available features in the proposed design for customising the detector make it attractive for a detailed DBT of RSFQ circuits. The control of internal nodes has also been illustrated using TPI. The test structures that were designed and implemented to determine the occurrence of defects in the processes can also be used to locate the position for the insertion of the above mentioned DfT structures

A Comprehensive Fault Model for Concurrent Error Detection in MOS Circuits

Naval Electronics Sys. Comm. and Office of Naval Research / N00039-80-C-0556Ope