Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

Active timing margin management to improve microprocessor power efficiency

Improving power/performance efficiency is critical for today’s micro- processors. From edge devices to datacenters, lower power or higher performance always produces better systems, measured by lower cost of ownership or longer battery time. This thesis studies improving microprocessor power/performance efficiency by optimizing the pipeline timing margin. In particular, this thesis focuses on improving the efficacy of Active Timing Margin, a young technology that dynamically adjusts the margin. Active timing margin trims down the pipeline timing margin with a control loop that adjusts voltage and frequency based on real-time chip environment monitoring. The key insight of this thesis is that in order to maximize active timing margin’s efficiency enhancement benefits, synergistic management from processor architecture design and system software scheduling are needed. To that end, this thesis covers the major consumers of pipeline timing margin, including temperature, voltage, and process variation. For temperature variation, the thesis proposes a table-lookup based active timing margin mechanism, and an associated temperature management scheme to minimize power consumption. For voltage variation, the thesis characterizes the limiting factors of adaptive clocking’s power saving and proposes application scheduling to maximize total system power reduction. For process variation, the thesis proposes core-level adaptive clocking reconfiguration to automatically expose inter-core variation and discusses workload scheduling and throttling management to control critical application performance. The author believes the optimization presented in this thesis can potentially benefit a variety of processor architectures as the conclusions are based on the solid measurement on state-of-the-art processors, and the research objective, active timing margin, already has wide applicability in the latest microprocessors by the time this thesis is written.Electrical and Computer Engineerin

Network-on-Chip

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems

Exploration and Design of Power-Efficient Networked Many-Core Systems

Multiprocessing is a promising solution to meet the requirements of near future applications. To get full benefit from parallel processing, a manycore system needs efficient, on-chip communication architecture. Networkon- Chip (NoC) is a general purpose communication concept that offers highthroughput, reduced power consumption, and keeps complexity in check by a regular composition of basic building blocks. This thesis presents power efficient communication approaches for networked many-core systems. We address a range of issues being important for designing power-efficient manycore systems at two different levels: the network-level and the router-level. From the network-level point of view, exploiting state-of-the-art concepts such as Globally Asynchronous Locally Synchronous (GALS), Voltage/ Frequency Island (VFI), and 3D Networks-on-Chip approaches may be a solution to the excessive power consumption demanded by today’s and future many-core systems. To this end, a low-cost 3D NoC architecture, based on high-speed GALS-based vertical channels, is proposed to mitigate high peak temperatures, power densities, and area footprints of vertical interconnects in 3D ICs. To further exploit the beneficial feature of a negligible inter-layer distance of 3D ICs, we propose a novel hybridization scheme for inter-layer communication. In addition, an efficient adaptive routing algorithm is presented which enables congestion-aware and reliable communication for the hybridized NoC architecture. An integrated monitoring and management platform on top of this architecture is also developed in order to implement more scalable power optimization techniques. From the router-level perspective, four design styles for implementing power-efficient reconfigurable interfaces in VFI-based NoC systems are proposed. To enhance the utilization of virtual channel buffers and to manage their power consumption, a partial virtual channel sharing method for NoC routers is devised and implemented. Extensive experiments with synthetic and real benchmarks show significant power savings and mitigated hotspots with similar performance compared to latest NoC architectures. The thesis concludes that careful codesigned elements from different network levels enable considerable power savings for many-core systems.Siirretty Doriast

Dynamic voltage and frequency scaling with multi-clock distribution systems on SPARC core

The current implementation of dynamic voltage and frequency scaling (DVS and DFS) in microprocessors is based on a single clock domain per core. In architectures that adopt Instruction Level Parallelism (ILP), multiple execution units may exist and operate concurrently. Performing DVS and DFS on such cores may result in low utilization and power efficiency. In this thesis, a methodology that implements DVFS with multi Clock distribution Systems (DCS) is applied on a processor core to achieve higher throughput and better power efficiency. DCS replaces the core single clock distribution tree with multi-clock domain systems which, along with dynamic voltage and frequency scaling, creates multiple clock-voltage domains. DCS implements a self-timed interface between the different domains to maintain functionality and ensure data integrity. DCS was implemented on a SPARC core of UltraSPARC T1 architecture, and synthesized targeting TSMC 120nm process technology. Two clock domains were used on SPARC core. The maximum achieved speedup relative to original core was 1.6X. The power consumed by DCS was 0.173mW compared to the core total power of ~ 10W

Utilizing Magnetic Tunnel Junction Devices in Digital Systems

The research described in this dissertation is motivated by the desire to effectively utilize magnetic tunnel junctions (MTJs) in digital systems. We explore two aspects of this: (1) a read circuit useful for global clocking and magnetologic, and (2) hardware virtualization that utilizes the deeply-pipelined nature of magnetologic. In the first aspect, a read circuit is used to sense the state of an MTJ (low or high resistance) and produce a logic output that represents this state. With global clocking, an external magnetic field combined with on-chip MTJs is used as an alternative mechanism for distributing the clock signal across the chip. With magnetologic, logic is evaluated with MTJs that must be sensed by a read circuit and used to drive downstream logic. For these two uses, we develop a resistance-to-voltage (R2V) read circuit to sense MTJ resistance and produce a logic voltage output. We design and fabricate a prototype test chip in the 3 metal 2 poly 0.5 um process for testing the R2V read circuit and experimentally validating its correctness. Using a clocked low/high resistor pair, we show that the read circuit can correctly detect the input resistance and produce the desired square wave output. The read circuit speed is measured to operate correctly up to 48 MHz. The input node is relatively insensitive to node capacitance and can handle up to 10s of pF of capacitance without changing the bandwidth of the circuit. In the second aspect, hardware virtualization is a technique by which deeply-pipelined circuits that have feedback can be utilized. MTJs have the potential to act as state in a magnetologic circuit which may result in a deep pipeline. Streams of computation are then context switched into the hardware logic, allowing them to share hardware resources and more fully utilize the pipeline stages of the logic. While applicable to magnetologic using MTJs, virtualization is also applicable to traditional logic technologies like CMOS. Our investigation targets MTJs, FPGAs, and ASICs. We develop M/D/1 and M/G/1 queueing models of the performance of virtualized hardware with secondary memory using a fixed, hierarchical, round-robin schedule that predict average throughput, latency, and queue occupancy in the system. We develop three C-slow applications and calibrate them to a clock and resource model for FPGA and ASIC technologies. Last, using the M/G/1 model, we predict throughput, latency, and resource usage for MTJ, FPGA, and ASIC technologies. We show three design scenarios illustrating ways in which to use the model

DVFS using clock scheduling for Multicore Systems-on-Chip and Networks-on-Chip

A modern System-on-Chip (SoC) contains processor cores, application-specific process- ing elements, memory, peripherals, all connected with a high-bandwidth and low-latency Network-on-Chip (NoC). The downside of such very high level of integration and con- nectivity is the high power consumption. In CMOS technology this is made of a dynamic and a static component. To reduce the dynamic component, Dynamic voltage and Fre- quency Scaling (DVFS) has been adopted. Although DVFS is very effective chip-wide, the power optimization of complex SoCs calls for a finer grain application of DVFS. Ideally all the main components of an SoC should be provided with a DVFS controller. An SoC with a DVFS controller per component with individual DC-DC converters and PLL/DLL circuits cannot scale in size to hundreds of components, which are in the research agenda. We present an alternative that will permit such scaling. It is possible to achieve results close to an optimum DVFS by hopping between few voltage levels and by an innovative application of clock-gating that we term as clock scheduling. We obtain an effective clock frequency by periodically killing some clock cycles of a master clock. We can apply voltage scaling for some of the periodic clock schedules which yield effective clock 1/2, 1/3, . . . By dithering between few voltages we obtain results close to an ideal DVFS system in simple pipelined circuits and in a complex example, a NoC’s switch. Again in the context of a NoC, we show how clock scheduling and voltage scaling can be automatically determined by means of a proportional-integral loop controller that keeps track of the network load. We describe in detail its implementation and all the circuit-level issues that we found. For a single switch, result shows an advantage of up to 2X over simple frequency scaling without voltage scaling. By providing each NoC’s switch with our simple DVFS controller, power saving at network level can be significantly more than what a a global DVFS controller can get. In a realistic scenario represented by network traces generated by video applications (MPEG, PIP, MWD, VoPD), we obtain an average power saving of 33%. To reduce static power, the Power-Gating (PG) technique is used and consists in switching- off power supply of unused blocks via pMOS headers or nMOS footers in series with such blocks. Even though research has been done in this field, the application of PG to NoCs has not been fully investigated. We show that it is possible to apply PG to the input buffers of a NoC switch. Their leakage power contributes about 40-50% of total NoC power, hence reducing such contribution is worthwhile. We partitioned buffers in banks and apply PG only to inactive banks. With our technique, it is possible to save about 40% in leakage power, without impact on performance

Advanced photonic and electronic systems WILGA 2018

WILGA annual symposium on advanced photonic and electronic systems has been organized by young scientist for young scientists since two decades. It traditionally gathers around 400 young researchers and their tutors. Ph.D students and graduates present their recent achievements during well attended oral sessions. Wilga is a very good digest of Ph.D. works carried out at technical universities in electronics and photonics, as well as information sciences throughout Poland and some neighboring countries. Publishing patronage over Wilga keep Elektronika technical journal by SEP, IJET and Proceedings of SPIE. The latter world editorial series publishes annually more than 200 papers from Wilga. Wilga 2018 was the XLII edition of this meeting. The following topical tracks were distinguished: photonics, electronics, information technologies and system research. The article is a digest of some chosen works presented during Wilga 2018 symposium. WILGA 2017 works were published in Proc. SPIE vol.10445. WILGA 2018 works were published in Proc. SPIE vol.10808