Probabilistic Balancing of Fault Coverage and Test Cost in Combined Built-In Self-Test/Automated Test Equipment Testing Environment

As design and test complexities of SoCs ever intensify, the balanced utilization of combined built-in self-test (BIST) and automated test equipment (ATE) testing becomes desirable to meet the required minimum-fault-coverage while maintaining an acceptable cost overhead. The cost associated with combined BIST/ATE testing of such systems mainly consists of 1) the cost induced by the BIST area overhead and 2) the cost induced by the overall testing time. In general, BIST is significantly faster than ATE, while it can provide only limited fault-coverage, and driving higher fault-coverage from BIST means additional area cost overhead. On the other hand, higher fault-coverage can be easily achieved from ATE, but excessive use of ATE results in additional test time. This paper proposes a novel probabilistic method to balance the fault-coverage and the test overhead costs in a combined BIST/ATE test environment. The proposed technique is then applied to two BIST/ATE test scenarios to find the optimal fault-coverage/cost combinations

Cost-Driven Optimization of Fault Coverage in Combined Built-In Self-Test/Automated Test Equipment Testing

As the design and fabrication complexities for the instrumentation-on-silicon systems intensify, optimization of combined Built-In Self-Test (BIST) and Automated Test Equipment (ATE) testing becomes more desirable to meet the required fault-coverage while maintaining acceptable cost overhead. The cost associated with combined BIST/ATE testing of such systems mainly consists of the following; (1) the cost induced by the BIST area overhead and (2) the cost induced by the overall testing time. In general, BIST has faster testing speed than ATE, while it can provide only limited fault-coverage and driving higher fault-coverage from BIST means additional area cost overhead. On the other hand, higher fault-coverage can be usually achieved from ATE, but excessive use of ATE results in additional test time cost. Fault-coverage of BIST and ATE plays a significant role since it can affect the area overhead in BIST and test time in BIST/ATE. This paper is to propose a novel numerical method to find an optimized fault-coverage implemented in BIST and ATE so that a minimum cost can be achieved. The proposed method. then, is applied to two parallel combined BIST/ATE testing schemes to assure its technical validity

Design-for-delay-testability techniques for high-speed digital circuits

The importance of delay faults is enhanced by the ever increasing clock rates and decreasing geometry sizes of nowadays' circuits. This thesis focuses on the development of Design-for-Delay-Testability (DfDT) techniques for high-speed circuits and embedded cores. The rising costs of IC testing and in particular the costs of Automatic Test Equipment are major concerns for the semiconductor industry. To reverse the trend of rising testing costs, DfDT is\ud getting more and more important

FPGA ARCHITECTURE AND VERIFICATION OF BUILT IN SELF-TEST (BIST) FOR 32-BIT ADDER/SUBTRACTER USING DE0-NANO FPGA AND ANALOG DISCOVERY 2 HARDWARE

The integrated circuit (IC) is an integral part of everyday modern technology, and its application is very attractive to hardware and software design engineers because of its versatility, integration, power consumption, cost, and board area reduction. IC is available in various types such as Field Programming Gate Array (FPGA), Application Specific Integrated Circuit (ASIC), System on Chip (SoC) architecture, Digital Signal Processing (DSP), microcontrollers (μC), and many more. With technology demand focused on faster, low power consumption, efficient IC application, design engineers are facing tremendous challenges in developing and testing integrated circuits that guaranty functionality, high fault coverage, and reliability as the transistor technology is shrinking to the point where manufacturing defects of ICs are affecting yield which associates with the increased cost of the part. The competitive IC market is pressuring manufactures of ICs to develop and market IC in a relatively quick turnaround which in return requires design and verification engineers to develop an integrated self-test structure that would ensure fault-free and the quality product is delivered on the market. 70-80% of IC design is spent on verification and testing to ensure high quality and reliability for the enduser. To test complex and sophisticated IC designs, the verification engineers must produce laborious and costly test fixtures which affect the cost of the part on the competitive market. To avoid increasing the part cost due to yield and test time to the end-user and to keep up with the competitive market many IC design engineers are deviating from complex external test fixture approach and are focusing on integrating Built-in Self-Test (BIST) or Design for Test (DFT) techniques onto IC’s which would reduce time to market but still guarantee high coverage for the product. Understanding the BIST, the architecture, as well as the application of IC, must be understood before developing IC. The architecture of FPGA is elaborated in this paper followed by several BIST techniques and applications of those BIST relative to FPGA, SoC, analog to digital (ADC), or digital to analog converters (DAC) that are integrated on IC. Paper is concluded with verification of BIST for the 32-bit adder/subtracter designed in Quartus II software using the Analog Discovery 2 module as stimulus and DE0-NANO FPGA board for verification

SoC Test: Trends and Recent Standards

The well-known approaching test cost crisis, where semiconductor test costs begin to approach or exceed manufacturing costs has led test engineers to apply new solutions to the problem of testing System-On-Chip (SoC) designs containing multiple IP (Intellectual Property) cores. While it is not yet possible to apply generic test architectures to an IP core within a SoC, the emergence of a number of similar approaches, and the release of new industry standards, such as IEEE 1500 and IEEE 1450.6, may begin to change this situation. This paper looks at these standards and at some techniques currently used by SoC test engineers. An extensive reference list is included, reflecting the purpose of this publication as a review paper

Reduced Galloping Column Algorithm For Memory Testing

Memory testing is significantly important nowadays especially in SOC’s design, due to their rapid growth in the memory density and design complexity in smaller chip area and low power design. Thus, test time in memory testing is a key challenge to accelerate time to market, high yield and low test cost in high volume manufacturing. Test time reduction in memory testing is important in industry, as test cost is directly related to validation time of each product on the tester. There are lots of memory algorithms used for memory testing, including the galloping column algorithm (GalCol). The GalCol algorithm test is important to detect unique coupling and transition faults. However, the existing GalCol algorithm takes huge test time due to its test complexity. To overcome the test time issue in industry, reduced GalCol algorithms with solid data background are proposed. The reduced GalCol algoritms have similar test behavior as original GalCol algorithm with major difference in the number of galloping of the target cells. The galloping of target cells are reduced to first and last 8, 16 and 32 of cells of every base cell. This project is progressed in two stages, which are the software development using INTEL software and Synopsys tool and test implementation on INTEL production flow. These algorithm are verified on 15 units of 64KB L2 SRAM memory. In this project, test time reduction and consistent pass fail test results are achieved in the reduced GalCol algorithm tests. The GalCol X8 algorithm obtains the highest test time reduction of about 79.5% at 600MHz and 75.7% at 1.6GHz with consistent pass or fail test results comparable to original GalCol algorithm in the HVM test flow

Scalable algorithms for software based self test using formal methods

textTransistor scaling has kept up with Moore's law with a doubling of the number of transistors on a chip. More logic on a chip means more opportunities for manufacturing defects to slip in. This, in turn, has made processor testing after manufacturing a significant challenge. At-speed functional testing, being completely non-intrusive, has been seen as the ideal way of testing chips. However for processor testing, generating instruction level tests for covering all faults is a challenge given the issue of scalability. Data-path faults are relatively easier to control and observe compared to control-path faults. In this research we present a novel method to generate instruction level tests for hard to detect control-path faults in a processor. We initially map the gate level stuck-at fault to the Register Transfer Level (RTL) and build an equivalent faulty RTL model. The fault activation and propagation constraints are captured using Control and Data Flow Graphs of the RTL as a Liner Temporal Logic (LTL) property. This LTL property is then negated and given to a Bounded Model Checker based on a Bit-Vector Satisfiability Module Theories (SMT) solver. From the counter-example to the property we can extract a sequence of instructions that activates the gate level fault and propagates the fault effect to one of the observable points in the design. Other than the user supplying instruction constraints, this approach is completely automatic and does not require any manual intervention. Not all the design behaviors are required to generate a test for a fault. We use this insight to scale our previous methodology further. Underapproximations are design abstractions that only capture a subset of the original design behaviors. The use of RTL for test generation affords us two types of under-approximations: bit-width reduction and operator approximation. These are abstractions that perform reductions based on semantics of the RTL design. We also explore structural reductions of the RTL, called path based search, where we search through error propagation paths incrementally. This approach increases the size of the test generation problem step by step. In this way the SMT solver searches through the state space piecewise rather than doing the entire search at once. Experimental results show that our methods are robust and scalable for generating functional tests for hard to detect faults.Electrical and Computer Engineerin

Design of High-Speed Multiplier with Optimised Builtinself-Test

Current trend in Integrated Circuits (IC) implementation such as System-on-Chip has contributed significant advantages in electronic product features such as high circuit performance with high number of functions, small physical area and high reliability. Since the development of System-on-Chip, which is based on integrating subsystems supplied by various Intellectual Properties (IP) Block vendors, the required design time is shorter when compared to that of full-custom IC implementation. However, testing each internal subsystems using the common scan-path method where test data are generated and analyzed externally is considered too time consuming when the number of subsystems is high. Therefore, by including Built-In-Self-Test (BIST) facility into each subsystem is considered a good solution. Commonly, BIST structure is based on random test data generation from a Linear Feedback Shift Register (LFSR) due to its simple, small and economical circuit structure. Since t he number of subsystems in an IC chip is going to be increased from time to time, improvement on the BIST approach is required to provide shorter testing time while keeping the good features of LFSR. For this reason, development of test pattern for BIST based on combination of LFSR and deterministic approach could provide one of the solutions to reduce the testing time. In this research, the possibility of combining LFSR features and deterministic test pattern was carried out. A parallel high-speed multiplier considered as one of the demanding subsystems was chosen to verify the proposed BIST performance. Results show that the testing time (with 100% fault coverage) was reduced significantly when compared to the testing time taken for the BIST that was totally based on random test data generation. One of the reasons for this achievement is only one basic cell of the multiplier is required to determine the test pattern by considering the data flow from one cell to another. Identical test data can then be applied to both multiplier inputs simultaneously. This is the significant finding of the research. Further works based on the finding are also identified

Innovative Techniques for Testing and Diagnosing SoCs

We rely upon the continued functioning of many electronic devices for our everyday welfare, usually embedding integrated circuits that are becoming even cheaper and smaller with improved features. Nowadays, microelectronics can integrate a working computer with CPU, memories, and even GPUs on a single die, namely System-On-Chip (SoC). SoCs are also employed on automotive safety-critical applications, but need to be tested thoroughly to comply with reliability standards, in particular the ISO26262 functional safety for road vehicles. The goal of this PhD. thesis is to improve SoC reliability by proposing innovative techniques for testing and diagnosing its internal modules: CPUs, memories, peripherals, and GPUs. The proposed approaches in the sequence appearing in this thesis are described as follows: 1. Embedded Memory Diagnosis: Memories are dense and complex circuits which are susceptible to design and manufacturing errors. Hence, it is important to understand the fault occurrence in the memory array. In practice, the logical and physical array representation differs due to an optimized design which adds enhancements to the device, namely scrambling. This part proposes an accurate memory diagnosis by showing the efforts of a software tool able to analyze test results, unscramble the memory array, map failing syndromes to cell locations, elaborate cumulative analysis, and elaborate a final fault model hypothesis. Several SRAM memory failing syndromes were analyzed as case studies gathered on an industrial automotive 32-bit SoC developed by STMicroelectronics. The tool displayed defects virtually, and results were confirmed by real photos taken from a microscope. 2. Functional Test Pattern Generation: The key for a successful test is the pattern applied to the device. They can be structural or functional; the former usually benefits from embedded test modules targeting manufacturing errors and is only effective before shipping the component to the client. The latter, on the other hand, can be applied during mission minimally impacting on performance but is penalized due to high generation time. However, functional test patterns may benefit for having different goals in functional mission mode. Part III of this PhD thesis proposes three different functional test pattern generation methods for CPU cores embedded in SoCs, targeting different test purposes, described as follows: a. Functional Stress Patterns: Are suitable for optimizing functional stress during I Operational-life Tests and Burn-in Screening for an optimal device reliability characterization b. Functional Power Hungry Patterns: Are suitable for determining functional peak power for strictly limiting the power of structural patterns during manufacturing tests, thus reducing premature device over-kill while delivering high test coverage c. Software-Based Self-Test Patterns: Combines the potentiality of structural patterns with functional ones, allowing its execution periodically during mission. In addition, an external hardware communicating with a devised SBST was proposed. It helps increasing in 3% the fault coverage by testing critical Hardly Functionally Testable Faults not covered by conventional SBST patterns. An automatic functional test pattern generation exploiting an evolutionary algorithm maximizing metrics related to stress, power, and fault coverage was employed in the above-mentioned approaches to quickly generate the desired patterns. The approaches were evaluated on two industrial cases developed by STMicroelectronics; 8051-based and a 32-bit Power Architecture SoCs. Results show that generation time was reduced upto 75% in comparison to older methodologies while increasing significantly the desired metrics. 3. Fault Injection in GPGPU: Fault injection mechanisms in semiconductor devices are suitable for generating structural patterns, testing and activating mitigation techniques, and validating robust hardware and software applications. GPGPUs are known for fast parallel computation used in high performance computing and advanced driver assistance where reliability is the key point. Moreover, GPGPU manufacturers do not provide design description code due to content secrecy. Therefore, commercial fault injectors using the GPGPU model is unfeasible, making radiation tests the only resource available, but are costly. In the last part of this thesis, we propose a software implemented fault injector able to inject bit-flip in memory elements of a real GPGPU. It exploits a software debugger tool and combines the C-CUDA grammar to wisely determine fault spots and apply bit-flip operations in program variables. The goal is to validate robust parallel algorithms by studying fault propagation or activating redundancy mechanisms they possibly embed. The effectiveness of the tool was evaluated on two robust applications: redundant parallel matrix multiplication and floating point Fast Fourier Transform