Laminate dielectric and foil characterization for signal integrity on printed circuit board

Accurate characterization of laminate dielectrics as substrates of printed circuit boards (PCB) over a wide frequency range (from tens megahertz to tens gigahertz) is important from a signal integrity (SI) point of view. Accurate knowledge of dielectric constants (DK) and dissipation factors (DF), or loss tangents, of laminate dielectrics, as well as loss in conductors, as functions of frequency over a wide frequency range, are needed to the designers of high-speed digital electronics. An in situ wideband traveling-wave technique based on measuring S-parameters of the PCB test vehicles with auxiliary through-reflect-line (TRL) calibration patterns has been developed. This technique has been extensively applied to the material characterization of PCBs up to 20 GHz. However, extension of the frequency range of testing PCBs up to 50 GHz requires solving numerous problems, related to a new PCB test vehicle design and improvement of the material parameter extraction algorithms to take into account various subtle effects arising as frequencies increase to 50 GHz. Extending the frequency range in the new 50-GHz test vehicles leads to potentially increasing uncertainties compared to the 20-GHz test vehicles. Different sources of errors and uncertainties for extracting DK and DF values are analyzed for both the present 20-GHz and the new perspective 50-GHz test vehicles. The limitations for the design of test vehicles are also discussed. An alternative technique for measuring dielectric parameters of PCB laminate dielectrics is using split-post dielectric resonator (SPDR). This narrowband technique is applied to measurements of thin dielectric plates at frequencies 10 GHz, 15 GHz, and 20 GHz --Abstract, page iii

Multiphysics modeling and simulation for large-scale integrated circuits

This dissertation is a process of seeking solutions to two important and challenging problems related to the design of modern integrated circuits (ICs): the ever increasing couplings among the multiphysics and the large problem size arising from the escalating complexity of the designs. A multiphysics-based computer-aided design methodology is proposed and realized to address multiple aspects of a design simultaneously, which include electromagnetics, heat transfer, fluid dynamics, and structure mechanics. The multiphysics simulation is based on the finite element method for its unmatched capabilities in handling complicate geometries and material properties. The capability of the multiphysics simulation is demonstrated through its applications in a variety of important problems, including the static and dynamic IR-drop analyses of power distribution networks, the thermal-ware high-frequency characterization of through-silicon-via structures, the full-wave electromagnetic analysis of high-power RF/microwave circuits, the modeling and analysis of three-dimensional ICs with integrated microchannel cooling, the characterization of micro- and nanoscale electrical-mechanical systems, and the modeling of decoupling capacitor derating in the power integrity simulations. To perform the large-scale analysis in a highly efficient manner, a domain decomposition scheme, parallel computing, and an adaptive time-stepping scheme are incorporated into the proposed multiphysics simulation. Significant reduction in computation time is achieved through the two numerical schemes and the parallel computing with multiple processors

The Active CryoCubeSat Technology: Active Thermal Control for Small Satellites

Modern CubeSats and Small Satellites have advanced in capability to tackle science and technology missions that would usually be reserved for more traditional, large satellites. However, this rapid growth in capability is only possible through the fast-to-production, low-cost, and advanced technology approach used by modern small satellite engineers. Advanced technologies in power generation, energy storage, and high-power density electronics have naturally led to a thermal bottleneck, where CubeSats and Small Satellites can generate more power than they can easily reject. The Active CryoCubeSat (ACCS) is an advanced active thermal control technology (ATC) for Small Satellites and CubeSats, which hopes to help solve this thermal problem. The ACCS technology is based on a two-stage design. An integrated miniature cryocooler forms the first stage, and a single-phase mechanically pumped fluid loop heat exchanger the second. The ACCS leverages advanced 3D manufacturing techniques to integrate the ATC directly into the satellite structure, which helps to improve the performance while simultaneously miniaturizing and simplifying the system. The ACCS system can easily be scaled to mission requirements and can control zonal temperature, bulk thermal rejection, and dynamic heat transfer within a satellite structure. The integrated cryocooler supports cryogenic science payloads such as advanced LWIR electro-optical detectors. The ACCS hopes to enable future advanced CubeSat and Small Satellite missions in earth science, heliophysics, and deep space operations. This dissertation will detail the design, development, and testing of the ACCS system technology

Technical accomplishments of the NASA Lewis Research Center, 1989

Topics addressed include: high-temperature composite materials; structural mechanics; fatigue life prediction for composite materials; internal computational fluid mechanics; instrumentation and controls; electronics; stirling engines; aeropropulsion and space propulsion programs, including a study of slush hydrogen; space power for use in the space station, in the Mars rover, and other applications; thermal management; plasma and radiation; cryogenic fluid management in space; microgravity physics; combustion in reduced gravity; test facilities and resources