6 research outputs found

    Interconnect Planning for Physical Design of 3D Integrated Circuits

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    Vertical stacking—based on modern manufacturing and integration technologies—of multiple 2D chips enables three-dimensional integrated circuits (3D ICs). This exploitation of the third dimension is generally accepted for aiming at higher packing densities, heterogeneous integration, shorter interconnects, reduced power consumption, increased data bandwidth, and realizing highly-parallel systems in one device. However, the commercial acceptance of 3D ICs is currently behind its expectations, mainly due to challenges regarding manufacturing and integration technologies as well as design automation. This work addresses three selected, practically relevant design challenges: (i) increasing the constrained reusability of proven, reliable 2D intellectual property blocks, (ii) planning different types of (comparatively large) through-silicon vias with focus on their impact on design quality, as well as (iii) structural planning of massively-parallel, 3D-IC-specific interconnect structures during 3D floorplanning. A key concept of this work is to account for interconnect structures and their properties during early design phases in order to support effective and high-quality 3D-IC-design flows. To tackle the above listed challenges, modular design-flow extensions and methodologies have been developed. Experimental investigations reveal the effectiveness and efficiency of the proposed techniques, and provide findings on 3D integration with particular focus on interconnect structures. We suggest consideration of these findings when formulating guidelines for successful 3D-IC design automation.:1 Introduction 1.1 The 3D Integration Approach for Electronic Circuits 1.2 Technologies for 3D Integrated Circuits 1.3 Design Approaches for 3D Integrated Circuits 2 State of the Art in Design Automation for 3D Integrated Circuits 2.1 Thermal Management 2.2 Partitioning and Floorplanning 2.3 Placement and Routing 2.4 Power and Clock Delivery 2.5 Design Challenges 3 Research Objectives 4 Planning Through-Silicon Via Islands for Block-Level Design Reuse 4.1 Problems for Design Reuse in 3D Integrated Circuits 4.2 Connecting Blocks Using Through-Silicon Via Islands 4.2.1 Problem Formulation and Methodology Overview 4.2.2 Net Clustering 4.2.3 Insertion of Through-Silicon Via Islands 4.2.4 Deadspace Insertion and Redistribution 4.3 Experimental Investigation 4.3.1 Wirelength Estimation 4.3.2 Configuration 4.3.3 Results and Discussion 4.4 Summary and Conclusions 5 Planning Through-Silicon Vias for Design Optimization 5.1 Deadspace Requirements for Optimized Planning of Through-Silicon Vias 5.2 Multiobjective Design Optimization of 3D Integrated Circuits 5.2.1 Methodology Overview and Configuration 5.2.2 Techniques for Deadspace Optimization 5.2.3 Design-Quality Analysis 5.2.4 Planning Different Types of Through-Silicon Vias 5.3 Experimental Investigation 5.3.1 Configuration 5.3.2 Results and Discussion 5.4 Summary and Conclusions 6 3D Floorplanning for Structural Planning of Massive Interconnects 6.1 Block Alignment for Interconnects Planning in 3D Integrated Circuits 6.2 Corner Block List Extended for Block Alignment 6.2.1 Alignment Encoding 6.2.2 Layout Generation: Block Placement and Alignment 6.3 3D Floorplanning Methodology 6.3.1 Optimization Criteria and Phases and Related Cost Models 6.3.2 Fast Thermal Analysis 6.3.3 Layout Operations 6.3.4 Adaptive Optimization Schedule 6.4 Experimental Investigation 6.4.1 Configuration 6.4.2 Results and Discussion 6.5 Summary and Conclusions 7 Research Summary, Conclusions, and Outlook Dissertation Theses Notation Glossary BibliographyDreidimensional integrierte Schaltkreise (3D-ICs) beruhen auf neuartigen Herstellungs- und Integrationstechnologien, wobei vor allem “klassische” 2D-ICs vertikal zu einem neuartigen 3D-System gestapelt werden. Dieser Ansatz zur Erschließung der dritten Dimension im Schaltkreisentwurf ist nach Expertenmeinung dazu geeignet, höhere Integrationsdichten zu erreichen, heterogene Integration zu realisieren, kürzere Verdrahtungswege zu ermöglichen, Leistungsaufnahmen zu reduzieren, Datenübertragungsraten zu erhöhen, sowie hoch-parallele Systeme in einer Baugruppe umzusetzen. Aufgrund von technologischen und entwurfsmethodischen Schwierigkeiten bleibt jedoch bisher die kommerzielle Anwendung von 3D-ICs deutlich hinter den Erwartungen zurück. In dieser Arbeit werden drei ausgewählte, praktisch relevante Problemstellungen der Entwurfsautomatisierung von 3D-ICs bearbeitet: (i) die Verbesserung der (eingeschränkten) Wiederverwendbarkeit von zuverlässigen 2D-Intellectual-Property-Blöcken, (ii) die komplexe Planung von verschiedenartigen, verhältnismäßig großen Through-Silicion Vias unter Beachtung ihres Einflusses auf die Entwurfsqualität, und (iii) die strukturelle Einbindung von massiv-parallelen, 3D-IC-spezifischen Verbindungsstrukturen während der Floorplanning-Phase. Das Ziel dieser Arbeit besteht darin, Verbindungsstrukturen mit deren wesentlichen Eigenschaften bereits in den frühen Phasen des Entwurfsprozesses zu berücksichtigen. Dies begünstigt einen qualitativ hochwertigen Entwurf von 3D-ICs. Die in dieser Arbeit vorgestellten modularen Entwurfsprozess-Erweiterungen bzw. -Methodiken dienen zur effizienten Lösung der oben genannten Problemstellungen. Experimentelle Untersuchungen bestätigen die Wirksamkeit sowie die Effektivität der erarbeiten Methoden. Darüber hinaus liefern sie praktische Erkenntnisse bezüglich der Anwendung von 3D-ICs und der Planung deren Verbindungsstrukturen. Diese Erkenntnisse sind zur Ableitung von Richtlinien für den erfolgreichen Entwurf von 3D-ICs dienlich.:1 Introduction 1.1 The 3D Integration Approach for Electronic Circuits 1.2 Technologies for 3D Integrated Circuits 1.3 Design Approaches for 3D Integrated Circuits 2 State of the Art in Design Automation for 3D Integrated Circuits 2.1 Thermal Management 2.2 Partitioning and Floorplanning 2.3 Placement and Routing 2.4 Power and Clock Delivery 2.5 Design Challenges 3 Research Objectives 4 Planning Through-Silicon Via Islands for Block-Level Design Reuse 4.1 Problems for Design Reuse in 3D Integrated Circuits 4.2 Connecting Blocks Using Through-Silicon Via Islands 4.2.1 Problem Formulation and Methodology Overview 4.2.2 Net Clustering 4.2.3 Insertion of Through-Silicon Via Islands 4.2.4 Deadspace Insertion and Redistribution 4.3 Experimental Investigation 4.3.1 Wirelength Estimation 4.3.2 Configuration 4.3.3 Results and Discussion 4.4 Summary and Conclusions 5 Planning Through-Silicon Vias for Design Optimization 5.1 Deadspace Requirements for Optimized Planning of Through-Silicon Vias 5.2 Multiobjective Design Optimization of 3D Integrated Circuits 5.2.1 Methodology Overview and Configuration 5.2.2 Techniques for Deadspace Optimization 5.2.3 Design-Quality Analysis 5.2.4 Planning Different Types of Through-Silicon Vias 5.3 Experimental Investigation 5.3.1 Configuration 5.3.2 Results and Discussion 5.4 Summary and Conclusions 6 3D Floorplanning for Structural Planning of Massive Interconnects 6.1 Block Alignment for Interconnects Planning in 3D Integrated Circuits 6.2 Corner Block List Extended for Block Alignment 6.2.1 Alignment Encoding 6.2.2 Layout Generation: Block Placement and Alignment 6.3 3D Floorplanning Methodology 6.3.1 Optimization Criteria and Phases and Related Cost Models 6.3.2 Fast Thermal Analysis 6.3.3 Layout Operations 6.3.4 Adaptive Optimization Schedule 6.4 Experimental Investigation 6.4.1 Configuration 6.4.2 Results and Discussion 6.5 Summary and Conclusions 7 Research Summary, Conclusions, and Outlook Dissertation Theses Notation Glossary Bibliograph

    Fixed-outline bus-driven floorplanning.

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    Jiang, Yan.Thesis (M.Phil.)--Chinese University of Hong Kong, 2011.Includes bibliographical references (p. 87-92).Abstracts in English and Chinese.Abstract --- p.iAcknowledgement --- p.ivChapter 1 --- Introduction --- p.1Chapter 1.1 --- Physical Design --- p.2Chapter 1.2 --- Floorplanning --- p.6Chapter 1.2.1 --- Floorplanning Objectives --- p.7Chapter 1.2.2 --- Common Approaches --- p.8Chapter 1.3 --- Motivations and Contributions --- p.14Chapter 1.4 --- Organization of the Thesis --- p.15Chapter 2 --- Literature Review on BDF --- p.17Chapter 2.1 --- Zero-Bend BDF --- p.17Chapter 2.1.1 --- BDF Using the Sequence-Pair Representation --- p.17Chapter 2.1.2 --- Using B*-Tree and Fast SA --- p.20Chapter 2.2 --- Two-Bend BDF --- p.22Chapter 2.3 --- TCG-Based Multi-Bend BDF --- p.25Chapter 2.3.1 --- Placement Constraints for Bus --- p.26Chapter 2.3.2 --- Bus Ordering --- p.28Chapter 2.4 --- Bus-Pin-Aware BDF --- p.30Chapter 2.5 --- Summary --- p.33Chapter 3 --- Fixed-Outline BDF --- p.35Chapter 3.1 --- Introduction --- p.35Chapter 3.2 --- Problem Formulation --- p.36Chapter 3.3 --- The Overview of Our Approach --- p.36Chapter 3.4 --- Partitioning --- p.37Chapter 3.4.1. --- The Overview of Partitioning --- p.38Chapter 3.4.2 --- Building a Hypergraph G --- p.39Chapter 3.5 --- Floorplaiining with Bus Routing --- p.43Chapter 3.5.1 --- Find Bus Routes --- p.43Chapter 3.5.2 --- Realization of Bus Routes --- p.48Chapter 3.5.3 --- Details of the Annealing Process --- p.50Chapter 3.6 --- Handle Fixed-Outline Constraints --- p.52Chapter 3.7 --- Bus Layout --- p.52Chapter 3.8 --- Experimental Results --- p.56Chapter 3.9 --- Summary --- p.61Chapter 4 --- Fixed-Outline BDF with L-shape bus --- p.63Chapter 4.1 --- Introduction --- p.63Chapter 4.2 --- Problem Formulation --- p.64Chapter 4.3 --- Our Approach --- p.65Chapter 4.3.1 --- Bus Routability Checking --- p.67Chapter 4.3.2 --- Details of the Annealing Process --- p.79Chapter 4.4 --- Experimental Results --- p.79Chapter 4.5 --- Summary --- p.82Chapter 5 --- Conclusion --- p.85Bibliography --- p.9

    Transitive closure graph based multi-bend bus driven floorplanning

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    Ma, Tilen.Thesis (M.Phil.)--Chinese University of Hong Kong, 2007.Includes bibliographical references (leaves 98-100).Abstracts in English and Chinese.Abstract --- p.iChapter 0.1 --- Abstract --- p.iAcknowledgement --- p.ivChapter 1 --- Introduction --- p.1Chapter 1.1 --- Physical Design Cycle --- p.2Chapter 1.2 --- Floorplanning --- p.6Chapter 1.2.1 --- Floorplanning Objectives --- p.7Chapter 1.2.2 --- Common Approaches --- p.8Chapter 1.3 --- Motivations and Contributions --- p.11Chapter 1.4 --- Organization of the Thesis --- p.13Chapter 2 --- Literature Review on Placement Constraints in Floorplanning --- p.15Chapter 2.1 --- Introduction --- p.15Chapter 2.2 --- Algorithms for Abutment Constraint --- p.16Chapter 2.3 --- Algorithms for Alignment Constraint --- p.18Chapter 2.4 --- Algorithms for Boundary Constraint --- p.20Chapter 2.5 --- Unified Approach for Placement Constraints --- p.23Chapter 2.5.1 --- Representation of Placement Constraints --- p.23Chapter 2.5.2 --- Handling Relative Placement Constraints --- p.24Chapter 2.5.3 --- Examples for Handling Placement Constraints --- p.25Chapter 3 --- Literature Review on Bus-Driven Floorplanning --- p.28Chapter 3.1 --- Introduction --- p.28Chapter 3.2 --- Previous Work --- p.28Chapter 3.2.1 --- Zero-Bend Bus-Driven Floorplanning [3] --- p.28Chapter 3.2.2 --- Two-Bend Bus-Driven Floorplanning [1] --- p.32Chapter 4 --- Placement Constraints for Multi-Bend Bus in TCGs --- p.38Chapter 4.1 --- Introduction --- p.38Chapter 4.2 --- Transitive Closure Graph [6] --- p.39Chapter 4.3 --- Placement Constraints for Zero-Bend Bus --- p.41Chapter 4.4 --- Placement Constraints for Multi-Bend Bus --- p.44Chapter 4.5 --- Placement Constraints for Bus Ordering --- p.45Chapter 4.5.1 --- Natural Bus Ordering in TCGs --- p.45Chapter 4.5.2 --- Explicit Bus Ordering in TCGs --- p.46Chapter 5 --- TCG-Based Bus-Driven Floorplanning --- p.48Chapter 5.1 --- Motivation --- p.48Chapter 5.2 --- Problem Formulation --- p.49Chapter 5.3 --- Methodology --- p.50Chapter 5.3.1 --- Construction of Reduced Graphs --- p.51Chapter 5.3.2 --- Construction of Common Graph --- p.52Chapter 5.3.3 --- Spanning Tree for Bus Assignment --- p.53Chapter 5.3.4 --- Formation of Bus Components --- p.55Chapter 5.3.5 --- Bus Feasibility Check --- p.56Chapter 5.3.6 --- Overlap Removal --- p.57Chapter 5.3.7 --- Floorplan Realization --- p.58Chapter 5.3.8 --- Simulated Annealing --- p.58Chapter 5.3.9 --- Soft Module Adjustment --- p.60Chapter 5.4 --- Experimental Results --- p.60Chapter 5.5 --- Summary --- p.65Chapter 6 --- Conclusion --- p.67Chapter A --- Appendix --- p.69Chapter A.1 --- Well-Known Algorithms --- p.69Chapter A.1.1 --- Kruskal's Algorithm --- p.69Chapter A.1.2 --- Bellman-Ford Algorithm --- p.69Chapter A.2 --- Figures of Resulting Floorplans --- p.71Chapter A.2.1 --- Data Set One --- p.71Chapter A.2.2 --- Data Set Two --- p.80Chapter A.2.3 --- Data Set Three --- p.85Chapter A.2.4 --- Data Set Four --- p.92Bibliography --- p.9

    Bus-driven floorplanning.

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    Law Hoi Ying.Thesis (M.Phil.)--Chinese University of Hong Kong, 2005.Includes bibliographical references (leaves 101-106).Abstracts in English and Chinese.Chapter 1 --- Introduction --- p.1Chapter 1.1 --- VLSI Design Cycle --- p.2Chapter 1.2 --- Physical Design Cycle --- p.6Chapter 1.3 --- Floorplanning --- p.10Chapter 1.3.1 --- Floorplanning Objectives --- p.11Chapter 1.3.2 --- Common Approaches --- p.12Chapter 1.3.3 --- Interconnect-Driven Floorplanning --- p.14Chapter 1.4 --- Motivations and Contributions --- p.15Chapter 1.5 --- Organization of the Thesis --- p.17Chapter 2 --- Literature Review on 2D Floorplan Representations --- p.18Chapter 2.1 --- Types of Floorplans --- p.18Chapter 2.2 --- Floorplan Representations --- p.20Chapter 2.2.1 --- Slicing Floorplan --- p.21Chapter 2.2.2 --- Non-slicing Floorplan --- p.22Chapter 2.2.3 --- Mosaic Floorplan --- p.30Chapter 2.3 --- Summary --- p.35Chapter 3 --- Literature Review on 3D Floorplan Representations --- p.37Chapter 3.1 --- Introduction --- p.37Chapter 3.2 --- Problem Formulation --- p.38Chapter 3.3 --- Previous Work --- p.38Chapter 3.4 --- Summary --- p.42Chapter 4 --- Literature Review on Bus-Driven Floorplanning --- p.44Chapter 4.1 --- Problem Formulation --- p.44Chapter 4.2 --- Previous Work --- p.45Chapter 4.2.1 --- Abutment Constraint --- p.45Chapter 4.2.2 --- Alignment Constraint --- p.49Chapter 4.2.3 --- Bus-Driven Floorplanning --- p.52Chapter 4.3 --- Summary --- p.53Chapter 5 --- Multi-Bend Bus-Driven Floorplanning --- p.55Chapter 5.1 --- Introduction --- p.55Chapter 5.2 --- Problem Formulation --- p.56Chapter 5.3 --- Methodology --- p.57Chapter 5.3.1 --- Shape Validation --- p.58Chapter 5.3.2 --- Bus Ordering --- p.65Chapter 5.3.3 --- Floorplan Realization --- p.72Chapter 5.3.4 --- Simulated Annealing --- p.73Chapter 5.3.5 --- Soft Block Adjustment --- p.75Chapter 5.4 --- Experimental Results --- p.75Chapter 5.5 --- Summary --- p.77Chapter 6 --- Bus-Driven Floorplanning for 3D Chips --- p.80Chapter 6.1 --- Introduction --- p.80Chapter 6.2 --- Problem Formulation --- p.81Chapter 6.3 --- The Representation --- p.82Chapter 6.3.1 --- Overview --- p.82Chapter 6.3.2 --- Review of TCG --- p.83Chapter 6.3.3 --- Layered Transitive Closure Graph (LTCG) --- p.84Chapter 6.3.4 --- Aligning Blocks --- p.85Chapter 6.3.5 --- Solution Perturbation --- p.87Chapter 6.4 --- Simulated Annealing --- p.92Chapter 6.5 --- Soft Block Adjustment --- p.92Chapter 6.6 --- Experimental Results --- p.93Chapter 6.7 --- Summary --- p.94Chapter 6.8 --- Acknowledgement --- p.95Chapter 7 --- Conclusion --- p.99Bibliography --- p.10
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