A Holistic Approach to Functional Safety for Networked Cyber-Physical Systems

Functional safety is a significant concern in today's networked cyber-physical systems such as connected machines, autonomous vehicles, and intelligent environments. Simulation is a well-known methodology for the assessment of functional safety. Simulation models of networked cyber-physical systems are very heterogeneous relying on digital hardware, analog hardware, and network domains. Current functional safety assessment is mainly focused on digital hardware failures while minor attention is devoted to analog hardware and not at all to the interconnecting network. In this work we believe that in networked cyber-physical systems, the dependability must be verified not only for the nodes in isolation but also by taking into account their interaction through the communication channel. For this reason, this work proposes a holistic methodology for simulation-based safety assessment in which safety mechanisms are tested in a simulation environment reproducing the high-level behavior of digital hardware, analog hardware, and network communication. The methodology relies on three main automatic processes: 1) abstraction of analog models to transform them into system-level descriptions, 2) synthesis of network infrastructures to combine multiple cyber-physical systems, and 3) multi-domain fault injection in digital, analog, and network. Ultimately, the flow produces a homogeneous optimized description written in C++ for fast and reliable simulation which can have many applications. The focus of this thesis is performing extensive fault simulation and evaluating different functional safety metrics, \eg, fault and diagnostic coverage of all the safety mechanisms

Modeling Cyber-Physical Production Systems with SystemC-AMS

The heterogeneous nature of SystemC-AMS makes it a perfect candidate solution to support Cyber-Physical Production Systems (CPPSs), i.e., systems that are characterized by a tight interaction of the cyber part with the surrounding physical world and with manufacturing production processes. Nonetheless, the support for the modeling of physical and mechanical dynamics typical of production machinery goes far beyond the initial application scenario of SystemC-AMS, thus limiting its effectiveness and adoption in the production and manufacturing context. This paper starts with an analysis of the current adoption of SystemC-AMS to highlight the open points that still limit its effectiveness, with the goal of pinpointing current issues and to propose solutions that could improve its effectiveness, and make SystemC-AMS an essential resource also in the new Industry 4.0 scenario

High-Speed Performance, Power and Thermal Co-simulation For SoC Design

This dissertation presents a multi-faceted effort at developing standard System Design Language based tools that allow designers to the model power and thermal behavior of SoCs, including heterogeneous SoCs that include non-digital components. The research contributions made in this dissertation include: • SystemC-based power/performance co-simulation for the Intel XScale microprocessor. We performed detailed characterization of the power dissipation patterns of a variety of system components and used these results to build detailed power models, including a highly accurate, validated instruction-level power model of the XScale processor. We also proposed a scalable, efficient and validated methodology for incorporating fast, accurate power modeling capabilities into system description languages such as SystemC. This was validated against physical measurements of hardware power dissipation. • Modeling the behavior of non-digital SoC components within standard System Design Languages. We presented an approach for modeling the functionality, performance, power, and thermal behavior of a complex class of non-digital components — MEMS microhotplate-based gas sensors — within a SystemC design framework. The components modeled include both digital components (such as microprocessors, busses and memory) and MEMS devices comprising a gas sensor SoC. The first SystemC models of a MEMS-based SoC and the first SystemC models of MEMS thermal behavior were described. Techniques for significantly improving simulation speed were proposed, and their impact quantified. • Vertically Integrated Execution-Driven Power, Performance and Thermal Co-Simulation For SoCs. We adapted the above techniques and used numerical methods to model the system of differential equations that governs on-chip thermal diffusion. This allows a single high-speed simulation to span performance, power and thermal modeling of a design. It also allows feedback behaviors, such as the impact of temperature on power dissipation or performance, to be modeled seamlessly. We validated the thermal equation-solving engine on test layouts against detailed low-level tools, and illustrated the power of such a strategy by demonstrating a series of studies that designers can perform using such tools. We also assessed how simulation and accuracy are impacted by spatial and temporal resolution used for thermal modeling

Platform-based design, test and fast verification flow for mixed-signal systems on chip

This research is providing methodologies to enhance the design phase from architectural space exploration and system study to verification of the whole mixed-signal system. At the beginning of the work, some innovative digital IPs have been designed to develop efficient signal conditioning for sensor systems on-chip that has been included in commercial products. After this phase, the main focus has been addressed to the creation of a re-usable and versatile test of the device after the tape-out which is close to become one of the major cost factor for ICs companies, strongly linking it to model’s test-benches to avoid re-design phases and multi-environment scenarios, producing a very effective approach to a single, fast and reliable multi-level verification environment. All these works generated different publications in scientific literature. The compound scenario concerning the development of sensor systems is presented in Chapter 1, together with an overview of the related market with a particular focus on the latest MEMS and MOEMS technology devices, and their applications in various segments. Chapter 2 introduces the state of the art for sensor interfaces: the generic sensor interface concept (based on sharing the same electronics among similar applications achieving cost saving at the expense of area and performance loss) versus the Platform Based Design methodology, which overcomes the drawbacks of the classic solution by keeping the generality at the highest design layers and customizing the platform for a target sensor achieving optimized performances. An evolution of Platform Based Design achieved by implementation into silicon of the ISIF (Intelligent Sensor InterFace) platform is therefore presented. ISIF is a highly configurable mixed-signal chip which allows designers to perform an effective design space exploration and to evaluate directly on silicon the system performances avoiding the critical and time consuming analysis required by standard platform based approach. In chapter 3 we describe the design of a smart sensor interface for conditioning next generation MOEMS. The adoption of a new, high performance and high integrated technology allow us to integrate not only a versatile platform but also a powerful ARM processor and various IPs providing the possibility to use the platform not only as a conditioning platform but also as a processing unit for the application. In this chapter a description of the various blocks is given, with a particular emphasis on the IP developed in order to grant the highest grade of flexibility with the minimum area occupation. The architectural space evaluation and the application prototyping with ISIF has enabled an effective, rapid and low risk development of a new high performance platform achieving a flexible sensor system for MEMS and MOEMS monitoring and conditioning. The platform has been design to cover very challenging test-benches, like a laser-based projector device. In this way the platform will not only be able to effectively handle the sensor but also all the system that can be built around it, reducing the needed for further electronics and resulting in an efficient test bench for the algorithm developed to drive the system. The high costs in ASIC development are mainly related to re-design phases because of missing complete top-level tests. Analog and digital parts design flows are separately verified. Starting from these considerations, in the last chapter a complete test environment for complex mixed-signal chips is presented. A semi-automatic VHDL-AMS flow to provide totally matching top-level is described and then, an evolution for fast self-checking test development for both model and real chip verification is proposed. By the introduction of a Python interface, the designer can easily perform interactive tests to cover all the features verification (e.g. calibration and trimming) into the design phase and check them all with the same environment on the real chip after the tape-out. This strategy has been tested on a consumer 3D-gyro for consumer application, in collaboration with SensorDynamics AG

Génération de modèles de haut niveau enrichis pour les systèmes hétérogènes et multiphysiques

Systems on chip are more and more complex as they now embed not only digital and analog parts, butalso sensors and actuators. SystemC and its extension SystemC AMS allow the high level modeling ofsuch systems. These tools are efficient for feasibility study, architectural exploration and globalverification of heterogeneous and multiphysics systems. At low level of abstraction, the simulationdurations are too important. Moreover, synchronization problems appear when cosimulations areperformed. It is possible to abstract the low level models that are developed by the specialists of thedifferent domains to create high level models that can be simulated faster using SystemC/SystemCAMS. The models of computation and the modeling styles have been studied. A relation is shownbetween the modeling style, the model size and the simulation speed. A method that generatesautomatically the high level model of an analog linear circuit from its low level representation isproposed. Then, it is shown how to include in the high level model some information allowing thepower consumption estimation. After that, the multiphysics systems modeling is studied. Twomethods are discussed: firstly, the one that uses the electrical equivalent circuit, then the one based onthe bond graph approach. It is shown how to generate a bond graph equivalent model from a low levelrepresentation. Finally, the modeling of a wind turbine system is discussed in order to illustrate thedifferent concepts presented in this thesis.Les systèmes sur puce sont de plus en plus complexes : ils intègrent des parties numériques, desparties analogiques et des capteurs ou actionneurs. SystemC et son extension SystemC AMSpermettent aujourd’hui de modéliser à haut niveau d’abstraction de tels systèmes. Ces outilsconstituent de véritables atouts dans une optique d’étude de faisabilité, d’exploration architecturale etde vérification du fonctionnement global des systèmes complexes hétérogènes et multiphysiques. Eneffet, les durées de simulation deviennent trop importantes pour envisager les simulations globales àbas niveau d’abstraction. De plus, les simulations basées sur l’utilisation conjointe de différents outilsprovoquent des problèmes de synchronisation. Les modèles de bas niveau, une fois crées par lesspécialistes des différents domaines peuvent toutefois être abstraits afin de générer des modèles dehaut niveau simulables sous SystemC/SystemC AMS en des temps de simulation réduits. Une analysedes modèles de calcul et des styles de modélisation possibles est d’abord présentée afin d’établir unlien avec les durées de simulation, ceci pour proposer un style de modélisation en fonction du niveaud’abstraction souhaité et de l’ampleur de la simulation à effectuer. Dans le cas des circuits analogiqueslinéaires, une méthode permettant de générer automatiquement des modèles de haut niveaud’abstraction à partir de modèles de bas niveau a été proposée. Afin d’évaluer très tôt dans le flot deconception la consommation d’un système, un moyen d’enrichir les modèles de haut niveaupréalablement générés est présenté. L’attention a ensuite été portée sur la modélisation à haut niveaudes systèmes multiphysiques. Deux méthodes y sont discutées : la méthode consistant à utiliser lecircuit équivalent électrique puis la méthode basée sur les bond graphs. En particulier, nous proposonsune méthode permettant de générer un modèle équivalent au bond graph à partir d’un modèle de basniveau. Enfin, la modélisation d’un système éolien est étudiée afin d’illustrer les différents conceptsprésentés dans cette thèse

Methoden und Beschreibungssprachen zur Modellierung und Verifikation vonSchaltungen und Systemen: MBMV 2015 - Tagungsband, Chemnitz, 03. - 04. März 2015

Der Workshop Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen (MBMV 2015) findet nun schon zum 18. mal statt. Ausrichter sind in diesem Jahr die Professur Schaltkreis- und Systementwurf der Technischen Universität Chemnitz und das Steinbeis-Forschungszentrum Systementwurf und Test. Der Workshop hat es sich zum Ziel gesetzt, neueste Trends, Ergebnisse und aktuelle Probleme auf dem Gebiet der Methoden zur Modellierung und Verifikation sowie der Beschreibungssprachen digitaler, analoger und Mixed-Signal-Schaltungen zu diskutieren. Er soll somit ein Forum zum Ideenaustausch sein. Weiterhin bietet der Workshop eine Plattform für den Austausch zwischen Forschung und Industrie sowie zur Pflege bestehender und zur Knüpfung neuer Kontakte. Jungen Wissenschaftlern erlaubt er, ihre Ideen und Ansätze einem breiten Publikum aus Wissenschaft und Wirtschaft zu präsentieren und im Rahmen der Veranstaltung auch fundiert zu diskutieren. Sein langjähriges Bestehen hat ihn zu einer festen Größe in vielen Veranstaltungskalendern gemacht. Traditionell sind auch die Treffen der ITGFachgruppen an den Workshop angegliedert. In diesem Jahr nutzen zwei im Rahmen der InnoProfile-Transfer-Initiative durch das Bundesministerium für Bildung und Forschung geförderte Projekte den Workshop, um in zwei eigenen Tracks ihre Forschungsergebnisse einem breiten Publikum zu präsentieren. Vertreter der Projekte Generische Plattform für Systemzuverlässigkeit und Verifikation (GPZV) und GINKO - Generische Infrastruktur zur nahtlosen energetischen Kopplung von Elektrofahrzeugen stellen Teile ihrer gegenwärtigen Arbeiten vor. Dies bereichert denWorkshop durch zusätzliche Themenschwerpunkte und bietet eine wertvolle Ergänzung zu den Beiträgen der Autoren. [... aus dem Vorwort

Source-synchronous I/O Links using Adaptive Interface Training for High Bandwidth Applications

Mobility is the key to the global business which requires people to be always connected to a central server. With the exponential increase in smart phones, tablets, laptops, mobile traffic will soon reach in the range of Exabytes per month by 2018. Applications like video streaming, on-demand-video, online gaming, social media applications will further increase the traffic load. Future application scenarios, such as Smart Cities, Industry 4.0, Machine-to-Machine (M2M) communications bring the concepts of Internet of Things (IoT) which requires high-speed low power communication infrastructures. Scientific applications, such as space exploration, oil exploration also require computing speed in the range of Exaflops/s by 2018 which means TB/s bandwidth at each memory node. To achieve such bandwidth, Input/Output (I/O) link speed between two devices needs to be increased to GB/s. The data at high speed between devices can be transferred serially using complex Clock-Data-Recovery (CDR) I/O links or parallely using simple source-synchronous I/O links. Even though CDR is more efficient than the source-synchronous method for single I/O link, but to achieve TB/s bandwidth from a single device, additional I/O links will be required and the source-synchronous method will be more advantageous in terms of area and power requirements as additional I/O links do not require extra hardware resources. At high speed, there are several non-idealities (Supply noise, crosstalk, Inter- Symbol-Interference (ISI), etc.) which create unwanted skew problem among parallel source-synchronous I/O links. To solve these problems, adaptive trainings are used in time domain to synchronize parallel source-synchronous I/O links irrespective of these non-idealities. In this thesis, two novel adaptive training architectures for source-synchronous I/O links are discussed which require significantly less silicon area and power in comparison to state-of-the-art architectures. First novel adaptive architecture is based on the unit delay concept to synchronize two parallel clocks by adjusting the phase of one clock in only one direction. Second novel adaptive architecture concept consists of Phase Interpolator (PI)-based Phase Locked Loop (PLL) which can adjust the phase in both direction and achieve faster synchronization at the expense of added complexity. With an increase in parallel I/O links, clock skew which is generated by the improper clock tree, also affects the timing margin. Incorrect duty cycle further reduces the timing margin mainly in Double Data Rate (DDR) systems which are generally used to increase the bandwidth of a high-speed communication system. To solve clock skew and duty cycle problems, a novel clock tree buffering algorithm and a novel duty cycle corrector are described which further reduce the power consumption of a source-synchronous system

Embedded System Design

A unique feature of this open access textbook is to provide a comprehensive introduction to the fundamental knowledge in embedded systems, with applications in cyber-physical systems and the Internet of things. It starts with an introduction to the field and a survey of specification models and languages for embedded and cyber-physical systems. It provides a brief overview of hardware devices used for such systems and presents the essentials of system software for embedded systems, including real-time operating systems. The author also discusses evaluation and validation techniques for embedded systems and provides an overview of techniques for mapping applications to execution platforms, including multi-core platforms. Embedded systems have to operate under tight constraints and, hence, the book also contains a selected set of optimization techniques, including software optimization techniques. The book closes with a brief survey on testing. This fourth edition has been updated and revised to reflect new trends and technologies, such as the importance of cyber-physical systems (CPS) and the Internet of things (IoT), the evolution of single-core processors to multi-core processors, and the increased importance of energy efficiency and thermal issues

Embedded System Design

A unique feature of this open access textbook is to provide a comprehensive introduction to the fundamental knowledge in embedded systems, with applications in cyber-physical systems and the Internet of things. It starts with an introduction to the field and a survey of specification models and languages for embedded and cyber-physical systems. It provides a brief overview of hardware devices used for such systems and presents the essentials of system software for embedded systems, including real-time operating systems. The author also discusses evaluation and validation techniques for embedded systems and provides an overview of techniques for mapping applications to execution platforms, including multi-core platforms. Embedded systems have to operate under tight constraints and, hence, the book also contains a selected set of optimization techniques, including software optimization techniques. The book closes with a brief survey on testing. This fourth edition has been updated and revised to reflect new trends and technologies, such as the importance of cyber-physical systems (CPS) and the Internet of things (IoT), the evolution of single-core processors to multi-core processors, and the increased importance of energy efficiency and thermal issues