Statistical static timing analysis considering process variations and crosstalk

Increasing relative semiconductor process variations are making the prediction of realistic worst-case integrated circuit delay or sign-off yield more difficult. As process geometries shrink, intra-die variations have become dominant and it is imperative to model them to obtain accurate timing analysis results. In addition, intra-die process variations are spatially correlated due to pattern dependencies in the manufacturing process. Any statistical static timing analysis (SSTA) tool is incomplete without a model for signal crosstalk, as critical path delays can increase or decrease depending on the switching of capacitively coupled nets. The coupled signal timing in turn depends on the process variations. This work describes an SSTA tool that models signal crosstalk and spatial correlation in intra-die process variations, along with gradients and inter-die variations

WDM/TDM PON bidirectional networks single-fiber/wavelength RSOA-based ONUs layer 1/2 optimization

This Thesis proposes the design and the optimization of a hybrid WDM/TDM PON at the L1 (PHY) and L2 (MAC) layers, in terms of minimum deployment cost and enhanced performance for Greenfield NGPON. The particular case of RSOA-based ONUs and ODN using a single-fibre/single-wavelength is deeply analysed. In this WDM/TDM PON relevant parameters are optimized. Special attention has been given at the main noise impairment in this type of networks: the Rayleigh Backscattering effect, which cannot be prevented. To understand its behaviour and mitigate its effects, a novel mathematical model for the Rayleigh Backscattering in burst mode transmission is presented for the first time, and it has been used to optimize the WDM/TDM RSOA based PON. Also, a cost-effective, simple design SCM WDM/TDM PON with rSOA-based ONU, was optimized and implemented. This prototype was successfully tested showing high performance, robustness, versatility and reliability. So, the system is able to give coverage up to 1280 users at 2.5 Gb/s / 1.25 Gb/s downstream/upstream, over 20 Km, and being compatible with the GPON ITU-T recommendation. This precedent has enabled the SARDANA network to extend the design, architecture and capabilities of a WDM/TDM PON for a long reach metro-access network (100 km). A proposal for an agile Transmission Convergence sub-layer is presented as another relevant contribution of this work. It is based on the optimization of the standards GPON and XG-PON (for compatibility), but applied to a long reach metro-access TDM/WDM PON rSOA-based network with higher client count. Finally, a proposal of physical implementation for the SARDANA layer 2 and possible configurations for SARDANA internetworking, with the metro network and core transport network, are presented

High-Speed and Low-Energy On-Chip Communication Circuits.

Continuous technology scaling sharply reduces transistor delays, while fixed-length global wire delays have increased due to less wiring pitch with higher resistance and coupling capacitance. Due to this ever growing gap, long on-chip interconnects pose well-known latency, bandwidth, and energy challenges to high-performance VLSI systems. Repeaters effectively mitigate wire RC effects but do little to improve their energy costs. Moreover, the increased complexity and high level of integration requires higher wire densities, worsening crosstalk noise and power consumption of conventionally repeated interconnects. Such increasing concerns in global on-chip wires motivate circuits to improve wire performance and energy while reducing the number of repeaters. This work presents circuit techniques and investigation for high-performance and energy-efficient on-chip communication in the aspects of encoding, data compression, self-timed current injection, signal pre-emphasis, low-swing signaling, and technology mapping. The improved bus designs also consider the constraints of robust operation and performance/energy gains across process corners and design space. Measurement results from 5mm links on 65nm and 90nm prototype chips validate 2.5-3X improvement in energy-delay product.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/75800/1/jseo_1.pd