Layout level design for testability strategy applied to a CMOS cell library

The layout level design for testability (LLDFT) rules used here allow to avoid some hard to detect faults or even undetectable faults on a cell library by modifying the cell layout without changing their behavior and achieving a good level of reliability. These rules avoid some open faults or reduce their appearance probability. The main purpose has been to apply that set of LLDFT rules on the cells of the library designed at the Centre Nacional de Microelectronica (CNM) in order to obtain a highly testable cell library. The authors summarize the main results (area overhead and performance degradation) of the application of the LLDFT rules on the cell

Testability enhancement of a basic set of CMOS cells

Testing should be evaluated as the ability of the test patterns to cover realistic faults, and high quality IC products demand high quality testing. We use a test strategy based on physical design for testability (to discover both open and short faults, which are difficult or even impossible to detect). Consequentially, layout level design for testability (LLDFT) rules have been developed, which prevent the faults, or at least reduce the chance of their appearing. The main purpose of this work is to apply a practical set of LLDFT rules to the library cells designed by the Centre Nacional de Microelectrònica (CNM) and obtain a highly testable cell library. The main results of the application of the LLDFT rules (area overheads and performance degradation) are summarized and the results are significant since IC design is highly repetitive; a small effort to improve cell layout can bring about great improvement in design

Delay test for diagnosis of power switches

Power switches are used as part of power-gating technique to reduce leakage power of a design. To the best of our knowledge, this is the first work in open-literature to show a systematic diagnosis method for accurately diagnosingpower switches. The proposed diagnosis method utilizes recently proposed DFT solution for efficient testing of power switches in the presence of PVT variation. It divides power switches into segments such that any faulty power switch is detectable thereby achieving high diagnosis accuracy. The proposed diagnosis method has been validated through SPICE simulation using a number of ISCAS benchmarks synthesized with a 90-nm gate library. Simulation results show that when considering the influence of process variation, the worst case loss of accuracy is less than 4.5%; and the worst case loss of accuracy is less than 12% when considering VT (Voltage and Temperature) variations

Product assurance technology for custom LSI/VLSI electronics

The technology for obtaining custom integrated circuits from CMOS-bulk silicon foundries using a universal set of layout rules is presented. The technical efforts were guided by the requirement to develop a 3 micron CMOS test chip for the Combined Release and Radiation Effects Satellite (CRRES). This chip contains both analog and digital circuits. The development employed all the elements required to obtain custom circuits from silicon foundries, including circuit design, foundry interfacing, circuit test, and circuit qualification

Performance Evaluation of FMOSSIM, a Concurrent Switch-Level Fault Simulator

This paper presents measurements obtained while performing fault simulations of MOS circuits modeled at the switch level. In this model the transistor structure of the circuit is represented explicitly as a network of charge storage nodes connected by bidirectional transistor switches. Since the logic model of the simulator closely matches the actual structure of MOS circuits, such faults as stuck-open and closed transistors as well as short and open-circuited wires can be simulated. By using concurrent simulation techniques, we obtain a performance level comparable to fault simulators using logic gate models. Our measurements indicate that fault simulation times grow as the product of the circuit size and number of patterns, assuming the number of faults to be simulated is proportional to the circuit size. However, fault simulation times depend strongly on the rate at which the test patterns detect the faults

On the production testing of analog and digital circuits

This thesis focuses on the production testing of Analog and Digital circuits. First, it addresses the issue of finding a high coverage minimum test set for the second generation current conveyor as this was not tackled before. The circuit under test is used in active capacitance multipliers, V-I scalar circuits, Biquadratic filters and many other applications. This circuit is often used to implement voltage followers, current followers and voltage to current converters. Five faults are assumed per transistor. It is shown that, to obtain 100% fault coverage, the CCII has to be operated in voltage to current converter mode. Only two test values are required to obtain this fault coverage. Additionally, the thesis focuses on the production testing of Memristor Ratioed Logic (MRL) gates because this was not studied before. MRL is a family that uses memristors along with CMOS inverters to design logic gates. Two-input NAND and NOR gates are investigated using the stuck at fault model for the memristors and the five-fault model for the transistors. It is shown that in order to obtain full coverage for the MRL NAND and NOR gates, two solutions are proposed. The first is the usage of scaled input voltages to prevent the output from falling in the undefined region. The second proposed solution is changing the switching threshold VM of the CMOS inverter. In addition, it is shown that test speed and order should be taken into consideration. It is proven that three ordered test vectors are needed for full coverage in MRL NAND and NOR gates, which is different from the 100% coverage test set in the conventional NAND and NOR CMOS designs

Moving Towards Analog Functional Safety

Over the past century, the exponential growth of the semiconductor industry has led to the creation of tiny and complex integrated circuits, e.g., sensors, actuators, and smart power systems. Innovative techniques are needed to ensure the correct functionality of analog devices that are ubiquitous in every smart system. The standard ISO 26262 related to functional safety in the automotive context specifies that fault injection is necessary to validate all electronic devices. For decades, standardizing fault modeling, injection and simulation mainly focused on digital circuits and disregarding analog ones. An initial attempt is being made with the IEEE P2427 standard draft standard that started to give this field a structured and formal organization. In this context, new fault models, injection, and abstraction methodologies for analog circuits are proposed in this thesis to enhance this application field. The faults proposed by the IEEE P2427 standard draft standard are initially evaluated to understand the associated fault behaviors during the simulation. Moreover, a novel approach is presented for modeling realistic stuck-on/off defects based on oxide defects. These new defects proposed are required because digital stuck-at-fault models where a transistor is frozen in on-state or offstate may not apply well on analog circuits because even a slight variation could create deviations of several magnitudes. Then, for validating the proposed defects models, a novel predictive fault grouping based on faulty AC matrices is applied to group faults with equivalent behaviors. The proposed fault grouping method is computationally cheap because it avoids performing DC or transient simulations with faults injected and limits itself to faulty AC simulations. Using AC simulations results in two different methods that allow grouping faults with the same frequency response are presented. The first method is an AC-based grouping method that exploits the potentialities of the S-parameters ports. While the second is a Circle-based grouping based on the circle-fitting method applied to the extracted AC matrices. Finally, an open-source framework is presented for the fault injection and manipulation perspective. This framework relies on the shared semantics for reading, writing, or manipulating transistor-level designs. The ultimate goal of the framework is: reading an input design written in a specific syntax and then allowing to write the same design in another syntax. As a use case for the proposed framework, a process of analog fault injection is discussed. This activity requires adding, removing, or replacing nodes, components, or even entire sub-circuits. The framework is entirely written in C++, and its APIs are also interfaced with Python. The entire framework is open-source and available on GitHub. The last part of the thesis presents abstraction methodologies that can abstract transistor level models into Verilog-AMS models and Verilog- AMS piecewise and nonlinear models into C++. These abstracted models can be integrated into heterogeneous systems. The purpose of integration is the simulation of heterogeneous components embedded in a Virtual Platforms (VP) needs to be fast and accurate

Testability considerations for implementing an embedded memory subsystem

textThere are a number of testability considerations for VLSI design, but test coverage, test time, accuracy of test patterns and correctness of design information for DFD (Design for debug) are the most important ones in design with embedded memories. The goal of DFT (Design-for-Test) is to achieve zero defects. When it comes to the memory subsystem in SOCs (system on chips), many flavors of memory BIST (built-in self test) are able to get high test coverage in a memory, but often, no proper attention is given to the memory interface logic (shadow logic). Functional testing and BIST are the most prevalent tests for this logic, but functional testing is impractical for complicated SOC designs. As a result, industry has widely used at-speed scan testing to detect delay induced defects. Compared with functional testing, scan-based testing for delay faults reduces overall pattern generation complexity and cost by enhancing both controllability and observability of flip-flops. However, without proper modeling of memory, Xs are generated from memories. Also, when the design has chip compression logic, the number of ATPG patterns is increased significantly due to Xs from memories. In this dissertation, a register based testing method and X prevention logic are presented to tackle these problems. An important design stage for scan based testing with memory subsystems is the step to create a gate level model and verify with this model. The flow needs to provide a robust ATPG netlist model. Most industry standard CAD tools used to analyze fault coverage and generate test vectors require gate level models. However, custom embedded memories are typically designed using a transistor-level flow, there is a need for an abstraction step to generate the gate models, which must be equivalent to the actual design (transistor level). The contribution of the research is a framework to verify that the gate level representation of custom designs is equivalent to the transistor-level design. Compared to basic stuck-at fault testing, the number of patterns for at-speed testing is much larger than for basic stuck-at fault testing. So reducing test and data volume are important. In this desertion, a new scan reordering method is introduced to reduce test data with an optimal routing solution. With in depth understanding of embedded memories and flows developed during the study of custom memory DFT, a custom embedded memory Bit Mapping method using a symbolic simulator is presented in the last chapter to achieve high yield for memories.Electrical and Computer Engineerin