Um amplificador de transimpedância de ganho variável para aplicação em osciladores baseados em MEMS

Orientador: José Alexandre DinizDissertação (mestrado) - Universidade Estadual de Campinas, Faculdade de Engenharia Elétrica e de ComputaçãoResumo: Um amplificador de transimpedância (TIA) de ganho variável é apresentado. Implementado em tecnologia 0,18 'mi'm, o projeto relatado possui a finalidade de prover um amplificador de sustentação para osciladores baseados em ressonadores do tipo MEMS (Micro-Electro-Mechanical System). Entre outros, as peculiaridades de projeto envolvem um desafiante compromisso entre Ganho, Largura de Banda, Ruído e Consumo de potência. Sendo assim, o amplificador foi implementado através do cascateamento de quatro estágios de ganho similares, lançando-se mão de realimentação do tipo shunt-shunt para diminuir as impedâncias de entrada e saída. Através do emprego de um estágio de ganho variável, uma alta faixa dinâmica de ganho é alcançada (53 dB), com um ganho máximo de transimpedância de 118 dB'ômega'...Observação: O resumo, na íntegra, poderá ser visualizado no texto completo da tese digitalAbstract: A variable gain Transimpedance Amplifier (TIA) is presented. Realized in 0.18 'mi'm technology, this amplifier was conceived with the purpose of providing oscillation sustaining for Micro-Electro-Mechanical System (MEMS) based oscillators. Facing a quite challenging trade-off between Gain, Bandwidth, Noise and Power consumption, the TIA was implemented through the cascade of four similar gain stages, with the application of shunt-shunt feedback to lower both input and output resistances. With the employment of a variable-gain stage, this TIA presents a large gain tunability of 53 dB, with a also large maximum transimpedance gain of 118 dB'omega'...Note: The complete abstract is available with the full electronic documentMestradoEletrônica, Microeletrônica e OptoeletrônicaMestre em Engenharia Elétric

Fully Monolithic CMOS Nickel Micromechanical Resonator Oscillator for Wireless Communications.

A nickel surface-micromachining technology offering various electrode-to-resonator gap materials is presented that is particularly suitable for high-Q, low impedance MEMS-based vibrating resonators. The low temperature of this nickel fabrication technology makes it amenable to post-processing over finished foundry CMOS wafers, even those using advanced low-k, low temperature dielectrics around metallization to decrease inter-connect capacitance. Such a MEMS-last process technology is used in this work to dem-onstrate a fully monolithic MEMS-based oscillator comprised of a nickel disk resonator array surface-micromachined over foundry CMOS. To achieve resonator motional resistances below 5.8 k with adequate quality factor, a mechanically-coupled array of resonators is used that actually realizes a multi-pole fil-ter structure, from which a single mode can be selected and other modes can be sup-pressed by proper electrode phasing. To attain higher frequencies, a nickel wine-glass mode disk resonator with a nitride capacitive transducer gaps was demonstrated at fre-quencies approaching 60 MHz with Q’s as high as 54,507, which is the highest to date for any micro-scale metal resonator in the VHF range. To boost frequencies to the UHF range, vibrating nickel micromechanical spoke-supported ring resonators were demon-strated at 425.7 MHz with Q’s as high as 2,467. These devices employed an anchor iso-lating spoke-supported ring geometry along with notched support attachments between the ring structure and supporting beams to achieve the highest reported vibrating fre-quency to date for any micro-scale metal resonator. Finally, a fully monolithic oscillator was achieved using MEMS-last integration to fabricate a resonator array of nine nickel flexural-mode disks over foundry CMOS cir-cuitry. The oscillator demonstrated a measured phase noise of -95 dBc/Hz at a 10 kHz offset from its 10.92-MHz carrier frequency, which is adequate for some low-end timing applications. This, together with its low power consumption of 350 μW, and the potential for full integration of integrated circuits and MEMS devices onto a single chip, makes the fully monolithic CMOS nickel micromechanical disk-array resonator oscillator presented here a reasonable on-chip replacement for quartz crystal reference oscillators in low-end applications.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/58524/1/wlhuang_1.pd

Monolithic Integration Piezoelectric Resonators on CMOS for Radio-Frequency and Sensing Applications

Software cognitive radios and Internet of Things (IoT) are recent interest areas that need low loss and low power consumption hardware. More specifically, the area of software cognitive radios requires that hardware be frequency agile and highly selective. Meanwhile, IoT relies on multiple low power sensor networks. By combining Complementary Metal Oxide Semiconductors (CMOS) technology with piezoelectric Micro-Electro-Mechanical Systems (MEMS), we can fabricate Systems-on-Chip (SoC) that can be used as filters or references (oscillators) and highly selective sensors. In this work we developed a die-level compatible process for the monolithic integration of Bulk Acoustic Resonators (BAWs) on CMOS for low power, reduced area and high-quality passives for radio frequency applications. Using CMOS as a fabrication substrate some stringent requirements were added to maintain the dies and the technology’s integrity. A few of these limitations were the need for a low thermal budget fabrication process, die handling and electro-static discharge (ESD) protection. The devices were first fabricated on glass for modeling extraction that was later used for the design of the integrated circuits (IC). Three integrated circuits were designed as substrates for the integration using IBM’s 180nm and TSMC’s 65nm technology. A monolithic BAW oscillator with a resonance frequency of 1.8GHz was demonstrated with an FOM ~186dBc/Hz, comparable to other academia work. Using the developed process, a membrane BAW structure (FBAR) was integrated as well. Using a susceptor coating and zinc oxide’s (ZnO) high temperature coefficient of frequency (TCF) the device was studied as an alternative uncooled infrared sensor. Finally, a reprogrammable IC and an RF PCB were designed for volatile organic compound (VOC) testing using self-assembled monolayers (SAMs) as the absorber layer

Lithium niobate RF-MEMS oscillators for IoT, 5G and beyond

This dissertation focuses on the design and implementation of lithium niobate (LiNbO3) radiofrequency microelectromechanical (RF-MEMS) oscillators for internet-of-things (IoT), 5G and beyond. The dissertation focuses on solving two main problems found nowadays in most of the published works: the narrow tuning range and the low operating frequency (sub 3 GHz) acoustic oscillators currently deliver. The work introduced here enables wideband voltage-controlled MEMS oscillators (VCMOs) needed for emerging applications in IoT. Moreover, it enables multi-GHz (above 8 GHz) RF-MEMS oscillators through harnessing over mode resonances for 5G and beyond. LiNbO3 resonators characterized by high-quality factor (Q), high electromechanical coupling (kt2), and high figure-of-merit (FoMRES= Q kt2) are crucial for building the envisioned high-performance oscillators. Those oscillators can be enabled with lower power consumption, wider tuning ranges, and a higher frequency of oscillation when compared to other state-of-the-art (SoA) RF-MEMS oscillators. Tackling the tuning range issue, the first VCMO based on the heterogeneous integration of a high Q LiNbO3 RF-MEMS resonator and complementary metal-oxide semiconductor (CMOS) is demonstrated in this dissertation. A LiNbO3 resonator array with a series resonance of 171.1 MHz, a Q of 410, and a kt2 of 12.7% is adopted, while the TSMC 65 nm RF LP CMOS technology is used to implement the active circuitry with an active area of 220×70 µm2. Frequency tuning of the VCMO is achieved by programming a binary-weighted digital capacitor bank and a varactor that are both connected in series to the resonator. The measured best phase noise performances of the VCMO are -72 and -153 dBc/Hz at 1 kHz and 10 MHz offsets from 178.23 and 175.83 MHz carriers, respectively. The VCMO consumes a direct current (DC) of 60 µA from a 1.2 V supply while realizing a tuning range of 2.4 MHz (~ 1.4% tuning range). Such VCMOs can be applied to enable ultralow-power, low phase noise, and wideband RF synthesis for emerging applications in IoT. Moreover, the first VCMO based on LiNbO3 lateral overtone bulk acoustic resonator (LOBAR) is demonstrated in this dissertation. The LOBAR excites over 30 resonant modes in the range of 100 to 800 MHz with a frequency spacing of 20 MHz. The VCMO consists of a LOBAR in a closed-loop with two amplification stages and a varactor-embedded tunable LC tank. By the bias voltage applied to the varactor, the tank can be tuned to change the closed-loop gain and phase responses of the oscillator so that Barkhausen’s conditions are satisfied for the targeted resonant mode. The tank is designed to allow the proposed VCMO to lock to any of the ten overtones ranging from 300 to 500 MHz. These ten tones are characterized by average Qs of 2100, kt2 of 1.5%, FoMRES of 31.5 enabling low phase noise, and low-power oscillators crucial for IoT. Owing to the high Qs of the LiNbO3 LOBAR, the measured VCMO shows a close-in phase noise of -100 dBc/Hz at 1 kHz offset from a 300 MHz carrier and a noise floor of -153 dBc/Hz while consuming 9 mW. With further optimization, this VCMO can lead to direct RF synthesis for ultra-low-power transceivers in multi-mode IoT nodes. Tackling the multi-GHz operation problem, the first Ku-band RF-MEMS oscillator utilizing a third antisymmetric overtone (A3) in a LiNbO3 resonator is presented in the dissertation. Quarter-wave resonators are used to satisfy Barkhausen’s oscillation conditions for the 3rd overtone while suppressing the fundamental and higher-order resonances. The oscillator achieves measured phase noise of -70 and -111 dBc/Hz at 1 kHz and 100 kHz offsets from a 12.9 GHz carrier while consuming 20 mW of dc power. The oscillator achieves a FoMOSC of 200 dB at 100 kHz offset. The achieved oscillation frequency is the highest reported to date for a MEMS oscillator. In addition, this dissertation introduces the first X-band RF-MEMS oscillator built using CMOS technology. The oscillator consists of an acoustic resonator in a closed loop with cascaded RF tuned amplifiers (TAs) built on TSMC RF GP 65 nm CMOS. The TAs bandpass response, set by on-chip inductors, satisfies Barkhausen's oscillation conditions for A3 only. Two circuit variations are implemented. The first is an 8.6 GHz standalone oscillator with a source-follower buffer for direct 50 Ω-based measurements. The second is an oscillator-divider chain using an on-chip 3-stage divide-by-2 frequency divider for a ~1.1 GHz output. The standalone oscillator achieves measured phase noise of -56, -113, and -135 dBc/Hz at 1 kHz, 100 kHz, and 1 MHz offsets from an 8.6 GHz output while consuming 10.2 mW of dc power. The oscillator also attains a FoMOSC of 201.6 dB at 100 kHz offset, surpassing the SoA electromagnetic (EM) and RF-MEMS based oscillators. The oscillator-divider chain produces a phase noise of -69.4 and -147 dBc/Hz at 1 kHz and 1 MHz offsets from a 1075 MHz output while consuming 12 mW of dc power. Its phase noise performance also surpasses the SoA L-band phase-locked loops (PLLs). The demonstrated performance shows the strong potential of microwave acoustic oscillators for 5G frequency synthesis and beyond. This work will enable low-power 5G transceivers featuring high speed, high sensitivity, and high selectivity in small form factors

Interface Circuits for Microsensor Integrated Systems

ca. 200 words; this text will present the book in all promotional forms (e.g. flyers). Please describe the book in straightforward and consumer-friendly terms. [Recent advances in sensing technologies, especially those for Microsensor Integrated Systems, have led to several new commercial applications. Among these, low voltage and low power circuit architectures have gained growing attention, being suitable for portable long battery life devices. The aim is to improve the performances of actual interface circuits and systems, both in terms of voltage mode and current mode, in order to overcome the potential problems due to technology scaling and different technology integrations. Related problems, especially those concerning parasitics, lead to a severe interface design attention, especially concerning the analog front-end and novel and smart architecture must be explored and tested, both at simulation and prototype level. Moreover, the growing demand for autonomous systems gets even harder the interface design due to the need of energy-aware cost-effective circuit interfaces integrating, where possible, energy harvesting solutions. The objective of this Special Issue is to explore the potential solutions to overcome actual limitations in sensor interface circuits and systems, especially those for low voltage and low power Microsensor Integrated Systems. The present Special Issue aims to present and highlight the advances and the latest novel and emergent results on this topic, showing best practices, implementations and applications. The Guest Editors invite to submit original research contributions dealing with sensor interfacing related to this specific topic. Additionally, application oriented and review papers are encouraged.

Remotely interrogated MEMS pressure sensor

This thesis considers the design and implementation of passive wireless microwave readable pressure sensors on a single chip. Two novel-all passive devices are considered for wireless pressure operation. The first device consists of a tuned circuit operating at 10 GHz fabricated on SiO2 membrane, supported on a silicon wafer. A pressure difference across the membrane causes it to deflect so that a passive resonant circuit detunes. The circuit is remotely interrogated to read off the sensor data. The chip area is 20 mm2 and the membrane area is 2mm2 with thickness of 4 µm. Two on chip passive resonant circuits were investigated: a meandered dipole and a zigzag antenna. Both have a physical length of 4.25 mm. the sensors show a shift in their resonant frequency in response to changing pressure of 10.28-10.27 GHz for the meandered dipole, and 9.61-9.58 GHz for the zigzag antenna. The sensitivities of the meandered dipole and zigzag sensors are 12.5 kHz and 16 kHz mbar, respectively. The second device is a pressure sensor on CMOS chip. The sensing element is capacitor array covering an area of 2 mm2 on a membrane. This sensor is coupled with a dipole antenna operating at 8.77 GHz. The post processing of the CMOS chip is carried out only in three steps, and the sensor on its own shows a sensitivity of 0.47fF/mbar and wireless sensitivity of 27 kHz/mbar. The MIM capacitors on membrane can be used to detune the resonant frequency of an antenna

Design and Implementation of Silicon-Based MEMS Resonators for Application in Ultra Stable High Frequency Oscillators

The focus of this work is to design and implement resonators for ultra-stable high-frequency ( \u3e 100MHz) silicon-based MEMS oscillators. Specifically, two novel types of resonators are introduced that push the performance of silicon-based MEMS resonators to new limits. Thin film Piezoelectric-on-Silicon (TPoS) resonators have been shown to be suitable for oscillator applications due to their combined high quality factor, coupling efficiency, power handling and doping-dependent temperature-frequency behavior. This thesis is an attempt to utilize the TPoS platform and optimize it for extremely stable high-frequency oscillator applications. To achieve the said objective, two main research venues are explored. Firstly, quality factor is systematically studied and anisotropy of single crystalline silicon (SCS) is exploited to enable high-quality factor side-supported radial-mode (aka breathing mode) TPoS disc resonators through minimization of anchor-loss. It is then experimentally demonstrated that in TPoS disc resonators with tethers aligned to [100], unloaded quality factor improves from ~450 for the second harmonic mode at 43 MHz to ~11,500 for the eighth harmonic mode at 196 MHz. Secondly, thickness quasi-Lamé modes are studied and demonstrated in TPoS resonators for the first time. It is shown that thickness quasi-Lamé modes (TQLM) could be efficiently excited in silicon with very high quality factor (Q). A quality factor of 23.2 k is measured in vacuum at 185 MHz for a fundamental TQLM-TPoS resonators designed within a circular acoustic isolation frame. Quality factor of 12.6 k and 6 k are also measured for the second- and third- harmonic TQLM TPoS resonators at 366 MHz and 555 MHz respectively. Turn-over temperatures between 40 °C to 125 °C are also designed and measured for TQLM TPoS resonators fabricated on degenerately N-doped silicon substrates. The reported extremely high quality factor, very low motional resistance, and tunable turn-over temperatures \u3e 80 °C make these resonators a great candidate for ultra-stable oven-controlled high-frequency MEMS oscillators