Power Management Techniques for Data Centers: A Survey

With growing use of internet and exponential growth in amount of data to be stored and processed (known as 'big data'), the size of data centers has greatly increased. This, however, has resulted in significant increase in the power consumption of the data centers. For this reason, managing power consumption of data centers has become essential. In this paper, we highlight the need of achieving energy efficiency in data centers and survey several recent architectural techniques designed for power management of data centers. We also present a classification of these techniques based on their characteristics. This paper aims to provide insights into the techniques for improving energy efficiency of data centers and encourage the designers to invent novel solutions for managing the large power dissipation of data centers.Comment: Keywords: Data Centers, Power Management, Low-power Design, Energy Efficiency, Green Computing, DVFS, Server Consolidatio

A Reuse-based framework for the design of analog and mixed-signal ICs

Despite the spectacular breakthroughs of the semiconductor industry, the ability to design integrated circuits (ICs) under stringent time-to-market (TTM) requirements is lagging behind integration capacity, so far keeping pace with still valid Moore's Law. The resulting gap is threatening with slowing down such a phenomenal growth. The design community believes that it is only by means of powerful CAD tools and design methodologies -and, possibly, a design paradigm shift-that this design gap can be bridged. In this sense, reuse-based design is seen as a promising solution, and concepts such as IP Block, Virtual Component, and Design Reuse have become commonplace thanks to the significant advances in the digital arena. Unfortunately, the very nature of analog and mixed-signal (AMS) design has hindered a similar level of consensus and development. This paper presents a framework for the reuse-based design of AMS circuits. The framework is founded on three key elements: (1) a CAD-supported hierarchical design flow that facilitates the incorporation of AMS reusable blocks, reduces the overall design time, and expedites the management of increasing AMS design complexity; (2) a complete, clear definition of the AMS reusable block, structured into three separate facets or views: the behavioral, structural, and layout facets, the two first for top-down electrical synthesis and bottom-up verification, the latter used during bottom-up physical synthesis; (3) the design for reusability set of tools, methods, and guidelines that, relying on intensive parameterization as well as on design knowledge capture and encapsulation, allows to produce fully reusable AMS blocks. A case study and a functional silicon prototype demonstrate the validity of the paper's proposals.Ministerio de Educación y Ciencia TEC2004-0175

Practical Techniques for Improving Performance and Evaluating Security on Circuit Designs

As the modern semiconductor technology approaches to nanometer era, integrated circuits (ICs) are facing more and more challenges in meeting performance demand and security. With the expansion of markets in mobile and consumer electronics, the increasing demands require much faster delivery of reliable and secure IC products. In order to improve the performance and evaluate the security of emerging circuits, we present three practical techniques on approximate computing, split manufacturing and analog layout automation. Approximate computing is a promising approach for low-power IC design. Although a few accuracy-configurable adder (ACA) designs have been developed in the past, these designs tend to incur large area overheads as they rely on either redundant computing or complicated carry prediction. We investigate a simple ACA design that contains no redundancy or error detection/correction circuitry and uses very simple carry prediction. The simulation results show that our design dominates the latest previous work on accuracy-delay-power tradeoff while using 39% less area. One variant of this design provides finer-grained and larger tunability than that of the previous works. Moreover, we propose a delay-adaptive self-configuration technique to further improve the accuracy-delay-power tradeoff. Split manufacturing prevents attacks from an untrusted foundry. The untrusted foundry has front-end-of-line (FEOL) layout and the original circuit netlist and attempts to identify critical components on the layout for Trojan insertion. Although defense methods for this scenario have been developed, the corresponding attack technique is not well explored. Hence, the defense methods are mostly evaluated with the k-security metric without actual attacks. We develop a new attack technique based on structural pattern matching. Experimental comparison with existing attack shows that the new attack technique achieves about the same success rate with much faster speed for cases without the k-security defense, and has a much better success rate at the same runtime for cases with the k-security defense. The results offer an alternative and practical interpretation for k-security in split manufacturing. Analog layout automation is still far behind its digital counterpart. We develop the layout automation framework for analog/mixed-signal ICs. A hierarchical layout synthesis flow which works in bottom-up manner is presented. To ensure the qualified layouts for better circuit performance, we use the constraint-driven placement and routing methodology which employs the expert knowledge via design constraints. The constraint-driven placement uses simulated annealing process to find the optimal solution. The packing represented by sequence pairs and constraint graphs can simultaneously handle different kinds of placement constraints. The constraint-driven routing consists of two stages, integer linear programming (ILP) based global routing and sequential detailed routing. The experiment results demonstrate that our flow can handle complicated hierarchical designs with multiple design constraints. Furthermore, the placement performance can be further improved by using mixed-size block placement which works on large blocks in priority

Thermal-Aware Networked Many-Core Systems

Advancements in IC processing technology has led to the innovation and growth happening in the consumer electronics sector and the evolution of the IT infrastructure supporting this exponential growth. One of the most difficult obstacles to this growth is the removal of large amount of heatgenerated by the processing and communicating nodes on the system. The scaling down of technology and the increase in power density is posing a direct and consequential effect on the rise in temperature. This has resulted in the increase in cooling budgets, and affects both the life-time reliability and performance of the system. Hence, reducing on-chip temperatures has become a major design concern for modern microprocessors. This dissertation addresses the thermal challenges at different levels for both 2D planer and 3D stacked systems. It proposes a self-timed thermal monitoring strategy based on the liberal use of on-chip thermal sensors. This makes use of noise variation tolerant and leakage current based thermal sensing for monitoring purposes. In order to study thermal management issues from early design stages, accurate thermal modeling and analysis at design time is essential. In this regard, spatial temperature profile of the global Cu nanowire for on-chip interconnects has been analyzed. It presents a 3D thermal model of a multicore system in order to investigate the effects of hotspots and the placement of silicon die layers, on the thermal performance of a modern ip-chip package. For a 3D stacked system, the primary design goal is to maximise the performance within the given power and thermal envelopes. Hence, a thermally efficient routing strategy for 3D NoC-Bus hybrid architectures has been proposed to mitigate on-chip temperatures by herding most of the switching activity to the die which is closer to heat sink. Finally, an exploration of various thermal-aware placement approaches for both the 2D and 3D stacked systems has been presented. Various thermal models have been developed and thermal control metrics have been extracted. An efficient thermal-aware application mapping algorithm for a 2D NoC has been presented. It has been shown that the proposed mapping algorithm reduces the effective area reeling under high temperatures when compared to the state of the art.Siirretty Doriast

A novel deep submicron bulk planar sizing strategy for low energy subthreshold standard cell libraries

Engineering andPhysical Science ResearchCouncil (EPSRC) and Arm Ltd for providing funding in the form of grants and studentshipsThis work investigates bulk planar deep submicron semiconductor physics in an attempt to improve standard cell libraries aimed at operation in the subthreshold regime and in Ultra Wide Dynamic Voltage Scaling schemes. The current state of research in the field is examined, with particular emphasis on how subthreshold physical effects degrade robustness, variability and performance. How prevalent these physical effects are in a commercial 65nm library is then investigated by extensive modeling of a BSIM4.5 compact model. Three distinct sizing strategies emerge, cells of each strategy are laid out and post-layout parasitically extracted models simulated to determine the advantages/disadvantages of each. Full custom ring oscillators are designed and manufactured. Measured results reveal a close correlation with the simulated results, with frequency improvements of up to 2.75X/2.43X obs erved for RVT/LVT devices respectively. The experiment provides the first silicon evidence of the improvement capability of the Inverse Narrow Width Effect over a wide supply voltage range, as well as a mechanism of additional temperature stability in the subthreshold regime. A novel sizing strategy is proposed and pursued to determine whether it is able to produce a superior complex circuit design using a commercial digital synthesis flow. Two 128 bit AES cores are synthesized from the novel sizing strategy and compared against a third AES core synthesized from a state-of-the-art subthreshold standard cell library used by ARM. Results show improvements in energy-per-cycle of up to 27.3% and frequency improvements of up to 10.25X. The novel subthreshold sizing strategy proves superior over a temperature range of 0 °C to 85 °C with a nominal (20 °C) improvement in energy-per-cycle of 24% and frequency improvement of 8.65X. A comparison to prior art is then performed. Valid cases are presented where the proposed sizing strategy would be a candidate to produce superior subthreshold circuits

Performance and power optimizations in chip multiprocessors for throughput-aware computation

The so-called "power (or power density) wall" has caused core frequency (and single-thread performance) to slow down, giving rise to the era of multi-core/multi-thread processors. For example, the IBM POWER4 processor, released in 2001, incorporated two single-thread cores into the same chip. In 2010, IBM released the POWER7 processor with eight 4-thread cores in the same chip, for a total capacity of 32 execution contexts. The ever increasing number of cores and threads gives rise to new opportunities and challenges for software and hardware architects. At software level, applications can benefit from the abundant number of execution contexts to boost throughput. But this challenges programmers to create highly-parallel applications and operating systems capable of scheduling them correctly. At hardware level, the increasing core and thread count puts pressure on the memory interface, because memory bandwidth grows at a slower pace ---phenomenon known as the "bandwidth (or memory) wall". In addition to memory bandwidth issues, chip power consumption rises due to manufacturers' difficulty to lower operating voltages sufficiently every processor generation. This thesis presents innovations to improve bandwidth and power consumption in chip multiprocessors (CMPs) for throughput-aware computation: a bandwidth-optimized last-level cache (LLC), a bandwidth-optimized vector register file, and a power/performance-aware thread placement heuristic. In contrast to state-of-the-art LLC designs, our organization avoids data replication and, hence, does not require keeping data coherent. Instead, the address space is statically distributed all over the LLC (in a fine-grained interleaving fashion). The absence of data replication increases the cache effective capacity, which results in better hit rates and higher bandwidth compared to a coherent LLC. We use double buffering to hide the extra access latency due to the lack of data replication. The proposed vector register file is composed of thousands of registers and organized as an aggregation of banks. We leverage such organization to attach small special-function "local computation elements" (LCEs) to each bank. This approach ---referred to as the "processor-in-regfile" (PIR) strategy--- overcomes the limited number of register file ports. Because each LCE is a SIMD computation element and all of them can proceed concurrently, the PIR strategy constitutes a highly-parallel super-wide-SIMD device (ideal for throughput-aware computation). Finally, we present a heuristic to reduce chip power consumption by dynamically placing software (application) threads across hardware (physical) threads. The heuristic gathers chip-level power and performance information at runtime to infer characteristics of the applications being executed. For example, if an application's threads share data, the heuristic may decide to place them in fewer cores to favor inter-thread data sharing and communication. In such case, the number of active cores decreases, which is a good opportunity to switch off the unused cores to save power. It is increasingly harder to find bulletproof (micro-)architectural solutions for the bandwidth and power scalability limitations in CMPs. Consequently, we think that architects should attack those problems from different flanks simultaneously, with complementary innovations. This thesis contributes with a battery of solutions to alleviate those problems in the context of throughput-aware computation: 1) proposing a bandwidth-optimized LLC; 2) proposing a bandwidth-optimized register file organization; and 3) proposing a simple technique to improve power-performance efficiency.El excesivo consumo de potencia de los procesadores actuales ha desacelerado el incremento en la frecuencia operativa de los mismos para dar lugar a la era de los procesadores con múltiples núcleos y múltiples hilos de ejecución. Por ejemplo, el procesador POWER7 de IBM, lanzado al mercado en 2010, incorpora ocho núcleos en el mismo chip, con cuatro hilos de ejecución por núcleo. Esto da lugar a nuevas oportunidades y desafíos para los arquitectos de software y hardware. A nivel de software, las aplicaciones pueden beneficiarse del abundante número de núcleos e hilos de ejecución para aumentar el rendimiento. Pero esto obliga a los programadores a crear aplicaciones altamente paralelas y sistemas operativos capaces de planificar correctamente la ejecución de las mismas. A nivel de hardware, el creciente número de núcleos e hilos de ejecución ejerce presión sobre la interfaz de memoria, ya que el ancho de banda de memoria crece a un ritmo más lento. Además de los problemas de ancho de banda de memoria, el consumo de energía del chip se eleva debido a la dificultad de los fabricantes para reducir suficientemente los voltajes de operación entre generaciones de procesadores. Esta tesis presenta innovaciones para mejorar el ancho de banda y consumo de energía en procesadores multinúcleo en el ámbito de la computación orientada a rendimiento ("throughput-aware computation"): una memoria caché de último nivel ("last-level cache" o LLC) optimizada para ancho de banda, un banco de registros vectorial optimizado para ancho de banda, y una heurística para planificar la ejecución de aplicaciones paralelas orientada a mejorar la eficiencia del consumo de potencia y desempeño. En contraste con los diseños de LLC de última generación, nuestra organización evita la duplicación de datos y, por tanto, no requiere de técnicas de coherencia. El espacio de direcciones de memoria se distribuye estáticamente en la LLC con un entrelazado de grano fino. La ausencia de replicación de datos aumenta la capacidad efectiva de la memoria caché, lo que se traduce en mejores tasas de acierto y mayor ancho de banda en comparación con una LLC coherente. Utilizamos la técnica de "doble buffering" para ocultar la latencia adicional necesaria para acceder a datos remotos. El banco de registros vectorial propuesto se compone de miles de registros y se organiza como una agregación de bancos. Incorporamos a cada banco una pequeña unidad de cómputo de propósito especial ("local computation element" o LCE). Este enfoque ---que llamamos "computación en banco de registros"--- permite superar el número limitado de puertos en el banco de registros. Debido a que cada LCE es una unidad de cómputo con soporte SIMD ("single instruction, multiple data") y todas ellas pueden proceder de forma concurrente, la estrategia de "computación en banco de registros" constituye un dispositivo SIMD altamente paralelo. Por último, presentamos una heurística para planificar la ejecución de aplicaciones paralelas orientada a reducir el consumo de energía del chip, colocando dinámicamente los hilos de ejecución a nivel de software entre los hilos de ejecución a nivel de hardware. La heurística obtiene, en tiempo de ejecución, información de consumo de potencia y desempeño del chip para inferir las características de las aplicaciones. Por ejemplo, si los hilos de ejecución a nivel de software comparten datos significativamente, la heurística puede decidir colocarlos en un menor número de núcleos para favorecer el intercambio de datos entre ellos. En tal caso, los núcleos no utilizados se pueden apagar para ahorrar energía. Cada vez es más difícil encontrar soluciones de arquitectura "a prueba de balas" para resolver las limitaciones de escalabilidad de los procesadores actuales. En consecuencia, creemos que los arquitectos deben atacar dichos problemas desde diferentes flancos simultáneamente, con innovaciones complementarias

Progresses in analytical design of distribution grids and energy storage

none4noIn the last years, a change in the power generation paradigm has been promoted by the increasing use of renewable energy sources combined with the need to reduce CO2 emissions. Small and distributed power generators are preferred to the classical centralized and sizeable ones. Accordingly, this fact led to a new way to think and design distributions grids. One of the challenges is to handle bidirectional power flow at the distribution substations transformer from and to the national transportation grid. The aim of this paper is to review and analyze the different mathematical methods to design the architecture of a distribution grid and the state of the art of the technologies used to produce and eventually store or convert, in different energy carriers, electricity produced by renewable energy sources, coping with the aleatory of these sources.openColangelo G.; Spirto G.; Milanese M.; de Risi A.Colangelo, G.; Spirto, G.; Milanese, M.; de Risi, A

Dependable Embedded Systems

This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems

Degradation in FPGAs: Monitoring, Modeling and Mitigation

This dissertation targets the transistor aging degradation as well as the associated thermal challenges in FPGAs (since there is an exponential relation between aging and chip temperature). The main objectives are to perform experimentation, analysis and device-level model abstraction for modeling the degradation in FPGAs, then to monitor the FPGA to keep track of aging rates and ultimately to propose an aging-aware FPGA design flow to mitigate the aging