8 research outputs found

    A bandwidth enhanced multilayer electromagnetic bandgap structure to reduce the simultaneous switching noise

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    A bandwidth enhanced multilayer Electromagnetic Band Gap (EBG) structure to reduce the simultaneous switching noise (SSN) in high frequency operating circuits, which useful for the satellite communication application, is presented in this paper. A proposed stack structure is mathematically analyzed by the dispersion method and transmission matrix method. Simulation results show good mitigation of SSN in scattering parameters and signal integrity in terms of eye diagrams. We have also checked for power integrity analysis using self-impedance. The proposed structure gives a good SSN suppression at -30 dB from 817 MHz to 26.32 GHz, around 25.50 GHz bandwidth and also reduces the cavity mode resonance within the stopband range. The proposed multilayer structure is compared with planar EBG plane and reference board. It is also compared with published results

    Electromagnetic Interference Reduction using Electromagnetic Bandgap Structures in Packages, Enclosures, Cavities, and Antennas

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    Electromagnetic interference (EMI) is a source of noise problems in electronic devices. The EMI is attributed to coupling between sources of radiation and components placed in the same media such as package or chassis. This coupling can be either through conducting currents or through radiation. The radiation of electromagnetic (EM) fields is supported by surface currents. Thus, minimizing these surface currents is considered a major and critical step to suppress EMI. In this work, we present novel strategies to confine surface currents in different applications including packages, enclosures, cavities, and antennas. The efficiency of present methods of EM noise suppression is limited due to different drawbacks. For example, the traditional use of lossy materials and absorbers suffers from considerable disadvantages including mechanical and thermal reliability leading to limited life time, cost, volume, and weight. In this work, we consider the use of Electromagnetic Band Gap (EBG) structures. These structures are suitable for suppressing surface currents within a frequency band denoted as the bandgap. Their design is straight forward, they are inexpensive to implement, and they do not suffer from the limitations of the previous methods. A new method of EM noise suppression in enclosures and cavity-backed antennas using mushroom-type EBG structures is introduced. The effectiveness of the EBG as an EMI suppresser is demonstrated using numerical simulations and experimental measurements. To allow integration of EBGs in printed circuit boards and packages, novel miniaturized simple planar EBG structures based on use of high-k dielectric material (r > 100) are proposed. The design consists of meander lines and patches. The inductive meander lines serve to provide current continuity bridges between the capacitive patches. The high-k dielectric material increases the effective capacitive load substantially in comparison to commonly used material with much lower dielectric constant. Meander lines can increase the effective inductive load which pushes down the lower edge of bandgap, thus resulting in a wider bandgap. Simulation results are included to show that the proposed EBG structures provide very wide bandgap (~10GHz) covering the multiple harmonics of of currently available microprocessors and its harmonics. To speed up the design procedure, a model based on combination of lumped elements and transmission lines is proposed. The derived model predicts accurately the starting edge of bandgap. This result is verified with full-wave analysis. Finally, another novel compact wide band mushroom-type EBG structure using magneto-dielectric materials is designed. Numerical simulations show that the proposed EBG structure provides in-phase reflection bandgap which is several times greater than the one obtained from a conventional EBG operating at the same frequency while its cell size is smaller. This type of EBG structure can be used efficiently as a ground plane for low-profile wideband antennas

    Electromagnetic Interference and Compatibility

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    Recent progress in the fields of Electrical and Electronic Engineering has created new application scenarios and new Electromagnetic Compatibility (EMC) challenges, along with novel tools and methodologies to address them. This volume, which collects the contributions published in the “Electromagnetic Interference and Compatibility” Special Issue of MDPI Electronics, provides a vivid picture of current research trends and new developments in the rapidly evolving, broad area of EMC, including contributions on EMC issues in digital communications, power electronics, and analog integrated circuits and sensors, along with signal and power integrity and electromagnetic interference (EMI) suppression properties of materials

    Optical Communication

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    Optical communication is very much useful in telecommunication systems, data processing and networking. It consists of a transmitter that encodes a message into an optical signal, a channel that carries the signal to its desired destination, and a receiver that reproduces the message from the received optical signal. It presents up to date results on communication systems, along with the explanations of their relevance, from leading researchers in this field. The chapters cover general concepts of optical communication, components, systems, networks, signal processing and MIMO systems. In recent years, optical components and other enhanced signal processing functions are also considered in depth for optical communications systems. The researcher has also concentrated on optical devices, networking, signal processing, and MIMO systems and other enhanced functions for optical communication. This book is targeted at research, development and design engineers from the teams in manufacturing industry, academia and telecommunication industries

    VLSI Design

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    This book provides some recent advances in design nanometer VLSI chips. The selected topics try to present some open problems and challenges with important topics ranging from design tools, new post-silicon devices, GPU-based parallel computing, emerging 3D integration, and antenna design. The book consists of two parts, with chapters such as: VLSI design for multi-sensor smart systems on a chip, Three-dimensional integrated circuits design for thousand-core processors, Parallel symbolic analysis of large analog circuits on GPU platforms, Algorithms for CAD tools VLSI design, A multilevel memetic algorithm for large SAT-encoded problems, etc

    Bibliography of Lewis Research Center technical publications announced in 1993

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    This compilation of abstracts describes and indexes the technical reporting that resulted from the scientific and engineering work performed and managed by the Lewis Research Center in 1993. All the publications were announced in the 1993 issues of STAR (Scientific and Technical Aerospace Reports) and/or IAA (International Aerospace Abstracts). Included are research reports, journal articles, conference presentations, patents and patent applications, and theses
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