The bolometric focal plane array of the Polarbear CMB experiment

The Polarbear Cosmic Microwave Background (CMB) polarization experiment is currently observing from the Atacama Desert in Northern Chile. It will characterize the expected B-mode polarization due to gravitational lensing of the CMB, and search for the possible B-mode signature of inflationary gravitational waves. Its 250 mK focal plane detector array consists of 1,274 polarization-sensitive antenna-coupled bolometers, each with an associated lithographed band-defining filter. Each detector's planar antenna structure is coupled to the telescope's optical system through a contacting dielectric lenslet, an architecture unique in current CMB experiments. We present the initial characterization of this focal plane

The development of insulated electrocardiogram electrodes

An integrated system was developed, consisting of an insulated electrode and an impedance transformer, which can be used for the acquisition of electrocardiographic data. The electrode consists of a thin layer of dielectric material deposited onto a silicon substrate. The impedance transformer is an operational amplifier used in the unity gain configuration. Both electrode and impedance transformer are contained in a plastic housing identical to that used with the NASA Apollo-type electrode. The lower cut off frequency of the electrode system is between 0.01 and 1.0 Hz, depending on the dielectric used and its thickness. Clinical quality electrocardiograms were obtained with these electrodes

MIDAS: Automated Approach to Design Microwave Integrated Inductors and Transformers on Silicon

The design of modern radiofrequency integrated circuits on silicon operating at microwave and millimeter-waves requires the integration of several spiral inductors and transformers that are not commonly available in the process design-kits of the technologies. In this work we present an auxiliary CAD tool for Microwave Inductor (and transformer) Design Automation on Silicon (MIDAS) that exploits commercial simulators and allows the implementation of an automatic design flow, including three-dimensional layout editing and electromagnetic simulations. In detail, MIDAS allows the designer to derive a preliminary sizing of the inductor (transformer) on the bases of the design entries (specifications). It draws the inductor (transformer) layers for the specific process design kit, including vias and underpasses, with or without patterned ground shield, and launches the electromagnetic simulations, achieving effective design automation with respect to the traditional design flow for RFICs. With the present software suite the complete design time is reduced significantly (typically 1 hour on a PC based on Intel® Pentium® Dual 1.80GHz CPU with 2-GB RAM). Afterwards both the device equivalent circuit and the layout are ready to be imported in the Cadence environment

A Maskless Photolithography Apparatus for the Microfabrication of Electrical Leads

Graphene is a new and exciting, two-dimensional material. Particularly interesting are the electrical features of graphene. The small size of graphene used in this experiment (on the scale of microns) presents the need for small electrical leads. Photolithography can be used to make appropriately sized leads by depositing metal onto substrates in specific patterns. The technique uses light to transfer geometric patterns onto a light sensitive photoresist on the surface of a substrate. We have built a low cost, maskless photolithography apparatus assembled from a computer, a consumer grade projector, and a microscope. With multiple exposures, we can make features ranging from approximately 1 μm to 785 μm. The 1 μm feature size is near the theoretical minimum for the wavelength of blue light used, and will be more than sufficient for contacting the flakes of graphene, which average 50 μm in size

An investigation of the SNS Josephson junction as a three-terminal device

A particular phenomenon of the SNS Josephson junction was investigated; i.e., control by a current entering the normal region and leaving through one of the superconducting regions. The effect of the control current on the junction was found to be dependent upon the ration of the resistances of the two halves of the N layer. A low frequency, lumped, nonlinear model was proposed to describe the electrical characteristics of the device, and a method was developed to plot the dynamic junction resistance as a function of junction current. The effective thermal noise temperature of the sample was determined. Small signal linearized analysis of the device suggests its use as an impedance transformer, although geometric limitations must be overcome. Linear approximation indicates that it is reciprocal and no power gain is possible. It is felt that, with suitable metallurgical and geometrical improvements, the device has promise to become a superconducting transistor

Characterization of High Temperature Optocoupler for Power Electronic Systems

High-temperature devices have been rapidly increas due to the implementation of new technologies like silicon carbide, high-temperature ceramic, and others. Functionality under elevated temperatures can reduce signal integrity reducing the reliability of power electronic systems. This study presents an ongoing research effort to develop a high-temperature package for optocouplers to operate at higher temperature compared with commercial devices. Low temperature co-fired ceramic (LTCC) was used as the substrate. Bare die commercial LED and photodetectors were attached to the substrate and tested for functionality. Preliminary results show enhanced performance at elevated temperatures compared to a commercial optocoupler device

The mechanical properties of thin alumina film deposited by metal-organic chemical vapour deposition

Amorphous alumina films were deposited by metal-organic chemical vapour deposition (MOCVD) on stainless steel, type AISI 304. The MOCVD experiments were performed in nitrogen at low and atmospheric pressures. The effects of deposition temperature, growth rate and film thickness on the mechanical properties have been studied.\ud \ud The experiments were performed with the dynamic ultra-micro-hardness tester, DUH-200, and the scanning scratch tester, SST-101, both developed by Shimadzu. The DUH-200 is associated with crack formation during indentation. This technique involves a qualitative method to study the crack behaviour of the thin alumina films as well as a method to estimate the fracture toughness of the film and the film/substrate interface. The experiments performed with the SST-101 are based on the estimation of the film adhesion to the substrate by determining a critical load; the load where the film starts to spall or to delaminate.\ud \ud The best mechanical properties were obtained using low deposition rates and high deposition temperatures. Therefore, low-pressure MOCVD is recommended in addition to the deposition of alumina films at high temperatures