Extracting Product Performance by Embedding Sensors in SFF Prototypes

SFF has been instrumental in improving the design process by providing designers with prototypes that assist them in the communication of design information and design visualization prior to creating fully functional prototypes. Embedding sensors at key locations within an SFF part to extract further data and monitor parameters at critical locations not accessible to ordinary sensors can help immensely in building functional SFF parts. However, this approach requires data acquisition of information such as temperature and strain values from interiors of products. In this work, the authors propose new techniques for embedding thermal sensors and strain gauges into fully dense DuraForm™ during Selective Laser Sintering (SLS) process. The embedded sensors have been used to measure temperatures and strains. They provide higher sensitivity, good accuracy, and high temperature capacity.Mechanical Engineerin

A Proposal for a Three Detector Short-Baseline Neutrino Oscillation Program in the Fermilab Booster Neutrino Beam

A Short-Baseline Neutrino (SBN) physics program of three LAr-TPC detectors located along the Booster Neutrino Beam (BNB) at Fermilab is presented. This new SBN Program will deliver a rich and compelling physics opportunity, including the ability to resolve a class of experimental anomalies in neutrino physics and to perform the most sensitive search to date for sterile neutrinos at the eV mass-scale through both appearance and disappearance oscillation channels. Using data sets of 6.6e20 protons on target (P.O.T.) in the LAr1-ND and ICARUS T600 detectors plus 13.2e20 P.O.T. in the MicroBooNE detector, we estimate that a search for muon neutrino to electron neutrino appearance can be performed with ~5 sigma sensitivity for the LSND allowed (99% C.L.) parameter region. In this proposal for the SBN Program, we describe the physics analysis, the conceptual design of the LAr1-ND detector, the design and refurbishment of the T600 detector, the necessary infrastructure required to execute the program, and a possible reconfiguration of the BNB target and horn system to improve its performance for oscillation searches.Comment: 209 pages, 129 figure

The Quantum Socket: Three-Dimensional Wiring for Extensible Quantum Computing

Quantum computing architectures are on the verge of scalability, a key requirement for the implementation of a universal quantum computer. The next stage in this quest is the realization of quantum error correction codes, which will mitigate the impact of faulty quantum information on a quantum computer. Architectures with ten or more quantum bits (qubits) have been realized using trapped ions and superconducting circuits. While these implementations are potentially scalable, true scalability will require systems engineering to combine quantum and classical hardware. One technology demanding imminent efforts is the realization of a suitable wiring method for the control and measurement of a large number of qubits. In this work, we introduce an interconnect solution for solid-state qubits: The quantum socket. The quantum socket fully exploits the third dimension to connect classical electronics to qubits with higher density and better performance than two-dimensional methods based on wire bonding. The quantum socket is based on spring-mounted micro wires the three-dimensional wires that push directly on a micro-fabricated chip, making electrical contact. A small wire cross section (~1 mmm), nearly non-magnetic components, and functionality at low temperatures make the quantum socket ideal to operate solid-state qubits. The wires have a coaxial geometry and operate over a frequency range from DC to 8 GHz, with a contact resistance of ~150 mohm, an impedance mismatch of ~10 ohm, and minimal crosstalk. As a proof of principle, we fabricated and used a quantum socket to measure superconducting resonators at a temperature of ~10 mK.Comment: Main: 31 pages, 19 figs., 8 tables, 8 apps.; suppl.: 4 pages, 5 figs. (HiRes figs. and movies on request). Submitte

Development of a Fourier Transform-Based Time-of-Flight Electron Spectrometer with Ultra-High Resolution

This project, funded by the Major Research Instrumentation program, will develop a time-of-flight electron velocity analyzer using advanced modulation and Fourier deconvolution techniques with a throughput advantage on the order of 1000 over existing instruments. The new spectrometer will operate with ultra-high resolution in the energy range 1-1000 electron volts. It will be useful for the investigation of surface properties under ultra-high vacuum and a variety of other scientific and commercial applications. The device utilizes secondary chopping of the electron beam in the nanosecond or sub-nanosecond time regime, and state-of-the-art Fourier transform-based digital signal recovery methods. Additionally, there is potential for several orders of magnitude more throughput by using array detectors. Other substantial performance advantages arise when it is used with synchrotron sources. The ultimate result will be a new generation of spectrometers allowing a wide range of new applications, both applied and fundamental, to research, research training, and analytical work. This sophisticated instrumentation is of wide applicability to vibrational electron energy loss spectroscopy, e.g. high resolution electron energy loss spectroscopy (HREELS), higher energy spectroscopies (X-ray photoelectron (XPS), Auger electron (AES), and ultraviolet photoemission (UPS) spectroscopy), and gas phase ion (mass) spectrometry and gas phase photoemission. The new device allows a number of new experiments and analytical techniques. By reducing acquisition time from hours to seconds, surface reactions can be followed on a much faster time-scale, for example during thermal processing. The several orders of magnitude improvement in throughput has a dramatic affect on the sensitivity to low intensity processes, such as trace analysis in analytical surface chemistry applications, non-dipolar scattering in HREELS and inelastic diffraction. Broader applications include practical surface analysis of soft and rough materials, e.g. HREELS of polymers, as well as greatly improved analytical capabilities in more standard types of measurements, such as XPS. Development requires optimizing the design of charged particle beam chopping devices. The new instrument requires the adaptation of deconvolution software for optimum performance. In collaboration with several experienced private sector software companies, sophisticated numerical algorithms for signal recovery will be implemented. Development of the spectrometer includes extensive participation by faculty and students, involving both experimental and theoretical work. A new time-of-flight electron spectrometer, developed with funding from the Major Research Instrumentation program, will be useful for the investigation of surface properties under ultra-high vacuum and a variety of other scientific and commercial applications. The scientific and engineering infrastructure at the University of Maine will be strengthened not only by the research enabled by this new instrument, but also by the education and career development of participants in the project, since students as well as faculty will be involved

DIGITALLY ASSISTED TECHNIQUES FOR NYQUIST RATE ANALOG-to-DIGITAL CONVERTERS

With the advance of technology and rapid growth of digital systems, low power high speed analog-to-digital converters with great accuracy are in demand. To achieve high effective number of bits Analog-to-Digital Converter(ADC) calibration as a time consuming process is a potential bottleneck for designs. This dissertation presentsa fully digital background calibration algorithm for a 7-bit redundant flash ADC using split structure and look-up table based correction. Redundant comparators are used in the flash ADC design of this work in order to tolerate large offset voltages while minimizing signal input capacitance. The split ADC structure helps by eliminating the unknown input signal from the calibration path. The flash ADC has been designed in 180nm IBM CMOS technology and fabricated through MOSIS. This work was supported by Analog Devices, Wilmington,MA. While much research on ADC design has concentrated on increasing resolution and sample rate, there are many applications (e.g. biomedical devices and sensor networks) that do not require high performance but do require low power energy efficient ADCs. This dissertation also explores on design of a low quiescent current 100kSps Successive Approximation (SAR) ADC that has been used as an error detection ADC for an automotive application in 350nm CD (CMOS-DMOS) technology. This work was supported by ON Semiconductor Corp, East Greenwich,RI

MEMS Technology for Biomedical Imaging Applications

Biomedical imaging is the key technique and process to create informative images of the human body or other organic structures for clinical purposes or medical science. Micro-electro-mechanical systems (MEMS) technology has demonstrated enormous potential in biomedical imaging applications due to its outstanding advantages of, for instance, miniaturization, high speed, higher resolution, and convenience of batch fabrication. There are many advancements and breakthroughs developing in the academic community, and there are a few challenges raised accordingly upon the designs, structures, fabrication, integration, and applications of MEMS for all kinds of biomedical imaging. This Special Issue aims to collate and showcase research papers, short commutations, perspectives, and insightful review articles from esteemed colleagues that demonstrate: (1) original works on the topic of MEMS components or devices based on various kinds of mechanisms for biomedical imaging; and (2) new developments and potentials of applying MEMS technology of any kind in biomedical imaging. The objective of this special session is to provide insightful information regarding the technological advancements for the researchers in the community

Photonic crystal interfaces: a design-driven approach

Photonic Crystal structures have been heralded as a disruptive technology for the miniaturization of opto-electronic devices, offering as they do the possibility of guiding and manipulating light in sub-micron scale waveguides. Applications of photonic crystal guiding - the ability to send light around sharp bends or compactly split signals into two or more channels have attracted a great deal of attention. Other effects of this waveguiding mechanism have become apparent, and attracted much interest - the novel dispersion surfaces of photonic crystal structures allow the possibility of “slow light” in a dielectric medium, which as well as the possibility of compact optical delay lines may allow enhanced light-matter interaction, and hence miniaturisation of active optical devices. I also consider a third, more traditional type of photonic crystal, in the form of a grating for surface coupling. In this thesis, I address many of the aspects of passive photonic crystals, from the underlying theory through applied device modelling, fabrication concerns and experimental results and analysis. Further, for the devices studied, I consider both the relative merits of the photonic crystal approach and of my work compared to that of others in the field. Thus, the complete spectrum of photonic crystal devices is covered. With regard to specific results, the highlights of the work contained in this thesis are as follows: Realisation of surface grating couplers in a novel material system demonstrating some of the highest reported fibre coupling efficiencies. Development of a short “injecting” taper for coupling into photonic crystal devices. Optimisation and experimental validation of photonic crystal routing elements (Y-splitter and bend). Exploration of interfaces and coupling for “slow light” photonic crystals

NASA Tech Briefs Index, 1977, volume 2, numbers 1-4

Announcements of new technology derived from the research and development activities of NASA are presented. Abstracts, and indexes for subject, personal author, originating center, and Tech Brief number are presented for 1977