Coulomb Blockade and Digital Single-Electron Devices

Tunneling of single electrons has been thoroughly studied both theoretically and experimentally during last ten years. By the present time the basic physics is well understood, and creation of useful single-electron devices becomes the important issue. Single-electron tunneling seems to be the most promising candidate to be used in the future integrated digital circuits with the typical size scale of few nanometers and below, i.e. in the molecular electronics. In the review we first briefly discuss the physics of single-electron tunneling and the operation of the single-electron transistor. After that, we concentrate on the hypothetical ultradense digital single-electron circuits and discuss the different proposed families of them. The last part of the review considers the issues of the discrete energy spectrum and the finite tunnel barrier height which are important for the molecular-size single-electron devices.Comment: Review paper, to be published in "Molecular Electronics", ed. by J. Jortner and M. A. Ratner (Blackwell, Oxford). 49 pages, RevTex, 15 figure

신축성 있고 착용 가능한 탄소 나노튜브 기반 전자 기술

학위논문 (박사) -- 서울대학교 대학원 : 공과대학 협동과정 바이오엔지니어링전공, 2020. 8. 김대형.Networks of carbon nanotubes (CNTs) are a promising candidate for use as a basic building block for next-generation soft electronics, owing to their superior mechanical and electrical properties, chemical stability, and low production cost. In particular, the CNTs, which are produced as a mixture of metallic and semiconducting CNTs via chemical vapor deposition, can be sorted according to their electronic types, which makes them useful for specific purposes: semiconducting CNTs can be employed as channel materials in transistor-based applications and metallic CNTs as electrodes. However, the development of CNT-based electronics for soft applications is still at its infant stage, mainly limited by the lack of solid technologies for developing high-performance deformable devices whose electrical performances are comparable to those fabricated using conventional inorganic materials. In this regard, soft CNT electronics with high mechanical stability and electrical performances have been pursued. First, wearable nonvolatile memory modules and logic gates were fabricated by employing networks of semiconducting CNTs as the channel materials, with strain-tolerant device designs for high mechanical stability. The fabricated devices exhibited low operation voltages, high device-to-device uniformity, on/off ratios, and on-current density, while maintaining its performance during ~30% stretching after being mounted on the human skin. In addition, various functional logic gates verified the fidelity of the reported technology, and successful fabrication of non-volatile memory modules with wearable features has been reported for the first time at the time of publication. Second, the networks of semiconducting CNTs were used to fabricate signal amplifiers with a high gain of ~80, which were then used to amplify electrocardiogram (ECG) signals measured using a wearable sensor. At the same time, color-tunable organic light-emitting diodes (CTOLEDs) were developed based on ultra-thin charge blocking layer that controlled the flow of excitons during different voltage regimes. Together, they were integrated to construct a health monitoring platform whereby real-time ECG signals could be detected while simultaneously notifying its user of the ECG status via color changes of the wearable CTOLEDs. Third, intrinsically stretchable CNT transistors were developed, which was enabled by the developments of thickness controllable, vacuum-deposited stretchable dielectric layer and vacuum-deposited metal thin films. Previous works employed strain-tolerant device designs which are based on the use of filamentary serpentine-shaped interconnections, which severely sacrifice the device density. The developed stretchable dielectric, compatible with the current vacuum-based microfabrication technology, exhibited excellent insulating properties even for nanometer-range thicknesses, thereby enabling significant electrical performance improvements such as low operation voltage and high device uniformity/reproducibility, which has not been realized in the most advanced intrinsically stretchable transistors of today.탄소 나노튜브는 뛰어난 전기적, 화학적, 그리고 기계적 특성을 갖고 있어 차세대 유연 전자소자의 핵심 소재 중 하나로 각광을 받고 있으나, 아직까지 이를 이용한 실용적인 유연 전자소자의 개발은 실현되지 않고 있다. 이는 탄소 나노튜브의 전기적 특성대로 완벽히 분류해 낼 수 있는 기술, 탄소 나노튜브를 소자의 원하는 위치에 정확히 원하는 양만큼 네트워크 형태 혹은 정렬된 형태로 증착하는 기술, 그리고 유연 전자소자를 구성하는 다른 물질들의 개발 기술의 부재 때문이다. 지난 10여년간 해당 기술들은 광범위하게 연구되어지고 있으나, 탄소 나노튜브를 활용한 우수한 유연 전자소자 개발을 위한 핵심 기술들의 발전은 아직 초기 단계에 있다. 따라서 이 논문을 통해 탄소 나노튜브를 유연 전자소자에 적용시킬 수 있는 새로운 기술을 소개하고자 한다. 첫번째로 탄소 나노튜브와 유연 전자소자의 소자 디자인을 이용하여 피부위에 증착 가능한 비휘발성 메모리 소자를 제작하였고, 해당 기술을 이용하여 피부위에서 안전하게 동작할 수 있는 다양한 기초 회로들을 구현하였다. 탄소 나노튜브 기반 메모리 전자 소자 및 회로는 다양한 외부 응력이 가해져도 안정적으로 동작을 하였고, 개발된 기술을 통해 보다 실용적인 탄소 나노튜브 기반 유연 전자 소자의 제작 조건을 확립할 수 있었다. 두번째로 위에 개발된 기술을 바탕으로, 보다 복잡한 탄소 나노튜브 기반 유연 회로 및 구동전압에 따라 발광색이 변환하는 색변환 소자를 제작하여 해당 소자들이 피부위에 부착되어 잘 작동되도록 구현하였다. 그리고 이 두 가지 웨어러블 전자소자를 통합하여 실시간으로 심전도를 측정하여 탄소 나노튜브 기반 전자소자를 통해 해당 신호를 증폭시키고, 신호의 상태를 색변환 소자로 나타낼 수 있는 심전도 모니터 시스템을 구현하였다. 세번째로 진공 증착이 가능한 유연 절연체를 개발하여, 기존의 유연 전자소자들이 가지고 있던 극명한 한계를 극복하였다 (높은 구동 전압, 낮은 집적도, 대면적 소자 선능 균일도 등). 기존의 액상 기반 증착을 위주로 한 유연 전자 소자들은 무기물질 기반 전자소자 대비 극심한 성능 저하를 보여주었는데, 이를 해결하기 위해 새로운 절연물질을 개발하고 탄소 나노튜브 기반 유연 전자소자에 적용하여 그 가능성을 보여주었다.Chapter 1. Introduction 1 1.1 Discovery of CNTs and their benefits for soft electronic applications 1 1.2 Electrical sorting of CNTs 5 1.3 Deposition methods of solution-processed semiconducting CNTs 7 1.4 Conclusion 23 1.5 References 24 Chapter 2. Stretchable Carbon Nanotube Charge-Trap Floating-Gate Memory and Logic Devices for Wearable Electronics 32 2.1 Introduction 32 2.2 Experimental section 34 2.3 Results and discussion 36 2.4 Conclusion 62 2.5 References 63 Chapter 3. Wearable Electrocardiogram Monitor Using Carbon Nanotube Electronics and Color-Tunable Organic Light-Emitting Diodes 67 3.1 Introduction 67 3.2 Experimental section 70 3.3 Results and discussion 73 3.4 Conclusion 97 3.5 References 98 Chapter 4. Medium-Scale Electronic Skin Based on Carbon Nanotube Transistors with Vacuum-Deposited Stretchable Dielectric Film 102 4.1 Introduction 102 4.2 Experimental section 106 4.3 Result and discussion 111 4.4 Conclusion 135 4.5 References 136Docto

Improving the Readout of Semiconducting Qubits

Semiconducting qubits are a promising platform for quantum computers. In particular, silicon spin qubits have made a number of advancements recently including long coherence times, high-fidelity single-qubit gates, two-qubit gates, and high-fidelity readout. However, all operations likely require improvement in fidelity and speed, if possible, to realize a quantum computer. Readout fidelity and speed, in general, are limited by circuit challenges centered on extracting low signal from a device in a dilution refrigerator connected to room temperature amplifiers by long coaxial cables with relatively high capacitance. Readout fidelity specifically is limited by the time it takes to reliably distinguish qubit states relative to the characteristic decay time of the excited state, T1. This dissertation explores the use of heterojunction bipolar transistor (HBT) circuits to amplify the readout signal of silicon spin qubits at cryogenic temperatures. The cryogenic amplification approach has numerous advantages including low implementation overhead, low power relative to the available cooling power, and high signal gain at the mixing chamber stage leading to around a factor of ten speedup in readout time for a similar signal-to-noise ratio. The faster readout time generally increases fidelity, since it is much faster than the T1 time. Two HBT amplification circuits have been designed and characterized. One design is a low-power, base-current biased configuration with non-linear gain (CB-HBT), and the second is a linear-gain, AC-coupled configuration (AC-HBT). They can operate at powers of 1 and 10 μW, respectfully, and not significantly heat electrons. The noise spectral density referred to the input for both circuits is around 15 to 30 fA/√Hz, which is low compared to previous cases such as the dual-stage, AC-coupled HEMT circuit at ~ 70 fA/√Hz. Both circuits achieve charge sensitivity between 300 and 400 μe/√Hz, which approaches the best alternatives (e.g., RF-SET at ~ 140 μe/√Hz) but with much less implementation overhead. For the single-shot latched charge readout performed, both circuits achieve high-fidelity readout in times \u3c 10 μs with bit error rates \u3c 10-3, which is a great improvement over previous work at \u3e 70 μs. The readout speed-up in principle also reduces the production of errors due to excited state relaxation by a factor of ~ 10. All of these results are possible with relatively simple, low-power transistor circuits which can be mounted close to the qubit device at the mixing chamber stage of the dilution refrigerator

Silicon Nanodevices

This book is a collection of scientific articles which brings research in Si nanodevices, device processing, and materials. The content is oriented to optoelectronics with a core in electronics and photonics. The issue of current technology developments in the nanodevices towards 3D integration and an emerging of the electronics and photonics as an ultimate goal in nanotechnology in the future is presented. The book contains a few review articles to update the knowledge in Si-based devices and followed by processing of advanced nano-scale transistors. Furthermore, material growth and manufacturing of several types of devices are presented. The subjects are carefully chosen to critically cover the scientific issues for scientists and doctoral students

Approche industrielle aux boîtes quantiques dans des dispositifs de silicium sur isolant complètement déplété pour applications en information quantique

La mise en oeuvre des qubits de spin électronique à base de boîtes quantiques réalisés en utilisant une technologie avancée de métal-oxyde-semiconducteur complémentaire (en anglais: CMOS ou Complementary Metal-Oxide-Semiconductor) fonctionnant à des températures cryogéniques permet d’envisager la fabrication industrielle reproductible et à haut rendement de systèmes de qubits de spin à grande échelle. Le développement d’une architecture de boîtes quantiques à base de silicium fabriquées en utilisant exclusivement des techniques de fabrication industrielle CMOS constitue une étape majeure dans cette direction. Dans cette thèse, le potentiel de la technologie UTBB (en anglais: Ultra-Thin Body and Buried oxide) silicium sur isolant complétement déplété (en anglais: FD-SOI ou Fully Depleted Silicon-On-Insulator) 28 nm de STMicroelectronics (Crolles, France) a été étudié pour la mise en oeuvre de boîtes quantiques bien définies, capables de réaliser des systèmes de qubit de spin. Dans ce contexte, des mesures d’effet Hall ont été réalisées sur des microstructures FD-SOI à 4.2 K afin de déterminer la qualité du noeud technologique pour les applications de boîtes quantiques. De plus, un flot du processus d’intégration, optimisé pour la mise en oeuvre de dispositifs quantiques utilisant exclusivement des méthodes de fonderie de silicium pour la production de masse est présenté, en se concentrant sur la réduction des risques de fabrication et des délais d’exécution globaux. Enfin, deux géométries différentes de dispositifs à boîtes quantiques FD-SOI de 28nm ont été conçues et leurs performances ont été étudiées à 1.4 K. Dans le cadre d’une collaboration entre Nanoacademic Technologies, Institut quantique et STMicroelectronics, un modèle QTCAD (en anglais: Quantum Technology Computer-Aided Design) en 3D a été développé pour la modélisation de dispositifs à boîtes quantiques FD-SOI. Ainsi, en complément de la caractérisation expérimentale des structures de test via des mesures de transport et de spectroscopie de blocage de Coulomb, leur performance est modélisée et analysée à l’aide du logiciel QTCAD. Les résultats présentés ici démontrent les avantages de la technologie FD-SOI par rapport à d’autres approches pour les applications de calcul quantique, ainsi que les limites identifiées du noeud 28 nm dans ce contexte. Ce travail ouvre la voie à la mise en oeuvre des nouvelles générations de dispositifs à boîtes quantiques FD-SOI basées sur des noeuds technologiques inférieurs.Abstract: Electron spin qubits based on quantum dots implemented using advanced Complementary Metal-Oxide-Semiconductor (CMOS) technology functional at cryogenic temperatures promise to enable reproducible high-yield industrial manufacturing of large-scale spin qubit systems. A milestone in this direction is to develop a silicon-based quantum dot structure fabricated using exclusively CMOS industrial manufacturing techniques. In this thesis, the potential of the industry-standard process 28 nm Ultra-Thin Body and Buried oxide (UTBB) Fully Depleted Silicon-On-Insulator (FD-SOI) technology of STMicroelectronics (Crolles, France) was investigated for the implementation of well-defined quantum dots capable to realize spin qubit systems. In this context, Hall effect measurements were performed on FD-SOI microstructures at 4.2 K to determine the quality of the technology node for quantum dot applications. Moreover, an optimized integration process flow for the implementation of quantum devices, using exclusively mass-production silicon-foundry methods is presented, focusing on reducing manufacturing risks and overall turnaround times. Finally, two different geometries of 28 nm FD-SOI quantum dot devices were conceived, and their performance was studied at 1.4 K. In the framework of a collaboration between Nanoacademic Technologies, Institut quantique, and STMicroelectronics, a 3D Quantum Technology Computer-Aided Design (QTCAD) model was developed for FD-SOI quantum dot device modeling. Therefore, along with the experimental characterization of the test structures via transport and Coulomb blockade spectroscopy measurements, their performance is modeled and analyzed using the QTCAD software. The results reported here demonstrate the advantages of the FD-SOI technology over other approaches for quantum computing applications, as well as the identified limitations of the 28 nm node in this context. This work paves the way for the implementation of the next generations of FD-SOI quantum dot devices based on lower technology nodes