Design and Fabrication of Electrostatically Actuated Serpentine-Hinged Nickel-Phosphorous Micromirror Devices

A process for micromachining of micro-mirror devices from silicon-on-insulator wafers was proposed and implemented. Test methods and force applicators for these devices were developed. Following successful fabrication of these devices, a novel process for fabrication of devices out of the plane of the silicon wafer was proposed, so that the devices could be actuated electrostatically. In particular, the process makes use of thick photoresist layers as a sacrificial mold into which an amorphous nickel-phosphorous alloy may be deposited. Ideal design of the electrostatically actuated micro-mirrors was investigated, and a final design was selected and modeled using FEA software, which found that serpentine-hinged devices require approximately 33% of the actuation force of their straight-beamed counterparts. An aqueous electroless plating solution composed of nickel acetate, sodium hypophosphite, citric acid, ammonium acetate, and Triton X-100 in was developed for use with the process, and bath operating parameters of 85°C and 4.5 pH were determined. However, this electroless solution failed to deposit in the presence of the photoresist. Several mechanisms proposed for deposition failure included leaching of organic solvents from the photoresist, oxidation of the nickel-titanium seed layer on which the deposition was intended to occur, and nonlinear diffusion of dissolved oxygen in the solution

DEVELOPMENT OF MICRO-SCALE HIGH ASPECT RATIO PATTERNED FEATURES WITH ELECTROLESS NICKEL PLATING

This thesis describes a novel method designed to pattern high aspect ratio metallic microscale features using a modified photolithography and electroless nickel plating process. This method utilizes modified photolithography techniques to create a polymer mold that is used to control the location of metal deposition on substrate during electroless nickel plating. In order to generate high aspect ratio mold features, a multiple spin-step process was developed to deposit thick layers of SU-8 photoresist, and inclined lithography was also used to generate tapered sidewalls that could help aid mold removal after plating. Results from electroplating experiments were evaluated using a Zygo interferometer and cast PDMS mold cross-sections to determine plating thickness and uniformity

VIRUS ENABLED 3D NANO-ARRAY ELECTRODES FOR INTEGRATED LI/NA-ION MICROBATTERIES

Multilayers of functional materials (carbon/electrode/nickel) were hierarchically architectured over tobacco mosaic virus (TMV) templates that were genetically modified to self-assemble in a vertical manner on current-collectors for battery applications. The spaces formed between individual rods effectively accommodated the volume expansion and contraction of electrodes during charge/discharge, while surface carbon coating engineered over these nanorods further enhance the electronic conductivity. The microbattery based on self aligned nanoforests with precise arrangement of various auxiliary material layers including a central nanometric metal core as direct electronic pathway to current collector, can deliver high energy density and stable cycling stability. C/LiFePO4/Ni/TMV nanoforest cathodes for Li-ion batteries and C/Sn/Ni/TMV nanoforest anodes for Na-ion batteries were assembled using physical sputtering deposition. Both 3D nanoforest electrodes show exceptional cycling stability and rate capability

Flip chip packaging of digital silicon photonics MEMS Switch for cloud computing and data centre

We report on the flip chip packaging of Micro-Electro-Mechanical System (MEMS)-based digital silicon photonic switching device and the characterization results of 12 × 12 switching ports. The challenges in packaging N2 electrical and 2N optical interconnections are addressed with single-layer electrical redistribution lines of 25 µm line width and space on aluminum nitride interposer and 13° polished 64-channel lidless fiber array (FA) with a pitch of 127 µm. 50 µm diameter solder spheres are laser-jetted onto the electrical bond pads surrounded by suspended MEMS actuators on the device before fluxless flip-chip bonding. A lidless FA is finally coupled near-vertically onto the device gratings using a 6-degree-of-freedom (6-DOF) alignment system. Fiber-to-grating coupler loss of 4.25 dB/facet, 10–11 bit error rate (BER) through the longest optical path, and 0.4 µs switch reconfiguration time have been demonstrated using 10 Gb/s Ethernet data stream

A review and comparative study of release coatings for optimised abhesion in resin transfer moulding applications

In this study, a number of abhesion promoting coatings were considered in terms of their physicochemical and release properties. The techniques used to further this study include; FEGSEM, AFM, profilometry, AFM, XPS, AES, SSIMS, FTIR and contact angle analysis for coating physical and chemical characterisation along with PF-AFM and other adhesion and mechanical tests to determine surface release properties. These coatings were applied to metal substrates and were based upon silicone, fluoropolymer or metal-PTFE composite chemistry, all being potentially useful as release films for resin transfer moulding (RTM) applications. The semi-permanent Frekote B15/710 NC mould release coating system, which is based on PDMS, proved extremely effective in terms of release against a cured epoxide applied under pressure. Although fluoroalkylsilane coatings offer a number of technological advantages for release applications they generally produce very thin coatings which conform any existing surface topography and adhesion through mechanical interlocking occurs. The commercial PTFE-based coatings were found to provide poor release properties due to the presence of surface microcracks which allowed epoxide penetration when cured under elevated pressure and temperature. Electroless Ni/PTFE composite coatings comprise hard nickel-phosphorus matrix containing a very fine dispersion of PTFE particles. The matrix proved sufficiently robust for industrial applications and the low friction and surface energy provided by the embedded PTFE combined with macroscopic scale surface roughness provided efficient mould release

Metallisation and structuring of low temperature Co-fired ceramic for micro and millimetre wave applications

The recent developments in Low Temperature Co-fired Ceramic (LTCC) as a substrate material enable it to be used in the micro and millimetre wave range providing low dissipation factors at high frequencies, good dielectric properties and a high degree of integration for further miniaturised devices. The most common metallisation method used in LTCC technology is screen printing with high cost noble metals such as silver and gold that are compatible with the high sintering temperatures (8500C). However, these techniques require high capital cost and maintenance cost. As the commercial world requires convenient and low cost process technologies for mass production, alternative metallisation methods should be considered. As a result, electroless copper plating of fired LTCC was mainly investigated in this research. The main goals of this project were to carry out electroless plating of fired LTCC with sufficient adhesion and to extend the process to metallise closed LTCC channel structures to manufacture Substrate Integrated Waveguide (SIW) components. The objectives were focused on electroless copper deposition on fired LTCC with improved adhesion. Electroless deposits on the Sn/Pd activated LTCC surface showed poor adhesion without any surface pre-treatments. Hence, chemical etching of fired LTCC was carried out using concentrated NaOH solution. NaOH pre-treatment of LTCC led to the formation of flake like structures on the LTCC surface. A number of surface and chemical analysis techniques and weight measurements were used to investigate the mechanism of the modification of the LTCC surface. The results showed that the flake like structures were dispersed in the LTCC material and a material model for the LTCC structure was proposed. SEM EDX elemental mapping showed that the flake like structure consisted of aluminium, calcium, boron and oxygen. Further experiments showed that both the concentration of NaOH and the immersion time affect the surface morphology and the roughness of fired LTCC. The measured Ra values were 0.6 m for untreated LTCC and 1.1 m for the LTCC sample treated with 4M NaOH for 270 minutes. Adhesion tests including peel test and scratch test were carried out to examine the adhesion strength of the deposited copper and both tests indicated that the NaOH pre-treatment led to an improvement, with the best results achieved for samples treated with 4M NaOH. A second aspect of the research focused on the selective metallisation of fired LTCC. Excimer laser machining was used to pattern a resist film laminated on the LTCC surface. This process also roughened the substrate and created channels that were characterised with respect to the laser operating parameters. After patterning the resist layer, samples were activated using Sn/Pd catalyst solution followed by the electroless copper deposition. Electroless copper was selectively deposited only on the patterned LTCC surface. Laser parameters clearly affected the copper plating rate. Even with a similar number of shots per area, the tracks machined with higher repetition rate showed relatively more machining depth as well as good plating conditions with low resistance values. The process was further implemented to realize a complete working circuit on fired LTCC. Passive components including a capacitor and an inductor were also fabricated on LTCC using the mask projection technique of the excimer laser system. This was successful for many designs, but when the separation between conductor lines dropped below 18 m, electroless copper started to deposit on the areas between them. Finally, a method to deposit copper films on the internal walls of closed channel structures was developed. The method was first demonstrated by flowing electroless copper solutions through silane treated glass capillaries. A thin layer (approx. 60 nm) of electroless copper was deposited only on the internal walls of the glass capillaries. The flow rate of the electroless copper solution had to be maintained at a low level as the copper deposits tended to wash away with higher flow rates. The structures were tested for transmission losses and showed low (<10dB) transmission losses in the terahertz region of the electromagnetic spectrum. The process was further applied to deposit electroless copper on the internal walls of the LTCC closed channel structures to manufacture a LTCC Substrate Integrated Waveguide (SIW)

Uv-liga Compatible Electroformed Nano-structured Materials For Micro Mechanical Systems

UV-LIGA is a microfabrication process realzed by material deposition through microfabricated molds. UV photolithography is conducted to pattern precise thick micro molds using UV light sensitive materials, mostly SU-8, and electroforming is performed to fabricate micro metallic structures defined by the micro molds. Therefore, UV-LIGA is a bottom-up in situ material-addition process. UV-LIGA has received broad attention recently than LIGA a micro molding fabrication process using X-ray to pattern the micro molds. LIGA is an expansive and is limited in access. In comparing to LIGA, the UV-LIGA is a cost effective process, and is widely accessible and safe. Therefore, it has been extensively used for the fabrication of metallic micro-electro-mechanical-systems (MEMS). The motivation of this research was to study micro mechanical systems fabricated with nano-structured metallic materials via UV-LIGA process. Various micro mechanical systems with high-aspect-ratio and thick metallic structures have been developed and are presented in this desertation. A novel micro mechanical valve has been developed with nano-structured nickel realized with UV-LIGA fabrication technique. Robust compact valves are crucial for space applications where payload and rubstaness are critically concerned. Two types of large flow rate robust passive micro check valve arrays have been designed, fabricated and tested for robust hydraulic actuators. The first such micro valve developed employs nanostructured nickel as the valve flap and single-crystal silicon as the substrates to house inlet and outlet channels. The Nano-structured nickel valve flap was fabricated using the UV-LIGA process developed and the microchannels were fabricated by deep reactive etching (DRIE) method. The valves were designed to operate under a high pressure (\u3e10MPa), able to operate at high frequencies (\u3e10kHz) in cooperating with the PZT actuator to produce large flow rates (\u3e10 cc/s). The fabricated microvalves weigh 0.2 gram, after packing with a novel designated valve stopper. The tested results showed that the micro valve was able to operate at up to 14kHz. This is a great difference in comparison to traditional mechanical valves whose operations are limited to 500 Hz or less. The advantages of micro machined valves attribute to the scaling laws. The second type of micro mechanical valves developed is a in situ assembled solid metallic (nickel) valves. Both the valve substrates for inlet and outlet channels and the valve flap, as well as the valve stopper were made by nickel through a UV-LIGA fabrication process developed. Continuous multiple micro molds fabrication and molding processes were performed. Final micro mechanical valves were received after removing the micro molds used to define the strutures. There is no any additional machining process, such as cutting or packaging. The alignment for laminated fabrication was realized under microscope, therefore it is a highly precise in situ fabrication process. Testing results show the valve has a forward flow rate of19 cc/s under a pressure difference of 90 psi. The backward flow rate of 0.023 cc/s, which is negligible (0.13%). Nano-structured nickel has also been used to develop laminated (sandwiched) micro cryogenic heater exchanger with the UV-LIGA process. Even though nickel is apparently not a good thermal conductor at room temperature, it is a good conductor at cryogentic temerpature since its thermal conductivity increases to 1250 W/k·m at 77K. Micro patterned SU-8 molds and electroformed nickel have been developed to realize the sandwiched heat exchanger. The SU-8 mold (200mm x 200mm x50mm) array was successfully removed after completing the nickel electroforming. The second layer of patterned SU-8 layer (200mm x 200mm x50mm, as a thermal insulating layer) was patterned and aligned on the top of the electroformed nickel structure to form the laminated (sandwiched) micro heat exchanger. The fabricated sandwiched structure can withstand cryogenic temperature (77K) without any damages (cracks or delaminations). A study on nanocomposite for micro mechanical systems using UV-LIGA compatible electroforming process has been performed. Single-walled carbon nanotubes (SWNTs) have been proven excellent mechanical properties and thermal conductive properties, such as high strength and elastic modulus, negative coefficient of thermal expansion (CTE) and a high thermal conductivity. These properties make SWNT an excellent reinforcement in nanocomposite for various applications. However, there has been a challenge of utilizing SWNTs for engineering applications due to difficulties in quality control and handling too small (1-2nm in diameter). A novel copper/SWNT nanocomposite has been developed during this dissertational research. The goal of this research was to develop a heat spreader for high power electronics (HPE). Semiconductors for HPE, such as AlGaN/GaN high electron mobility transistors grown on SiC dies have a typical CTE about 4~6x10-6/k while most metallic heat spreaders such as copper have a CTE of more than 10x10-6/k. The SWNTs were successfully dispersed in the copper matrix to form the SWNT/Cu nano composite. The tested composite density is about 7.54 g/cm3, which indicating the SWNT volumetric fraction of 18%. SEM pictures show copper univformly coated on SWNT (worm-shaped structure). The measured CTE of the nanocomposite is 4.7 x 10-6/°C, perfectly matching that of SiC die (3.8 x 10-6/°C). The thermal conductivity derived by Wiedemann-Franz law after measuring composit\u27s electrical conductivity, is 588 W/m-K, which is 40% better than that of pure copper. These properties are extremely important for the heat spreader/exchanger to remove the heat from HPE devices (SiC dies). Meanwhile, the matched CTE will reduce the resulted stress in the interface to prevent delaminations. Therefore, the naocomposite developed will be an excellent replacement material for the CuMo currently used in high power radar, and other HPE devices under developing. The mechanical performance and reliability of micro mechanical devices are critical for their application. In order to validate the design & simulation results, a direct (tensile) test method was developed to test the mechanical properties of the materials involved in this research, including nickel and SU-8. Micro machined specimens were fabricated and tested on a MTS Tytron Micro Force Tester with specially designed gripers. The tested fracture strength of nanostructured nickel is 900±70 MPa and of 50MPa for SU-8, resepctively which are much higher than published values

Fabrication of micro bumps for micro scale thermal management

Cryopreservation is storage of biological systems at ultra low temperatures for a prolonged duration; such that they can be thawed and restored to the same living state. It is important to understand the behavior of cells when they are subjected to subzero temperatures. Research in this area has shown the occurrence of two main biophysical events; cellular dehydration and intracellular ice formation. Current techniques for characterizing the dehydration in cells as part of a tissue are not adequate for studying intracellular ice formation in tissues. An integrated device consisting of an array of thermal sensors (microthermocouples) and actuators (microthermoelectric coolers) would help to detect intracellular ice formation by measuring and modulating the heat release of individual cells during freezing. This requires a dense wiring layer below the devices which can act as a heat sink in turn affecting the performance of the device. To alleviate this problem fabrication of bump structures was proposed to isolate the dense wiring layer from the array. Modeling was used to assess the effect of the bumps on the performance of the thermoelectric cooler. Bismuth telluride posts of 10 µm diameter and 20 µm height yielded optimal cooling with a bump radius of 5 µm. A maximum effective change in temperature of 3.47 K was achieved for an applied current of 23.7 mA and Joule’s breakdown was found to occur at 47.7 mA. To avoid the complexities in the measurements due to the presence of second junction, copper and constantan were chosen as bump material. Electrodeposition along with UV-LIGA microfabrication technique was used to fabricate the bumps. Copper and constantan micro bumps, with mean diameters of 6.5 & 27.76 µm and heights of 7.81 and 12.04 µm were fabricated with dimensional variation of ±0.5 µm with a 95% confidence interval. A custom printed circuit board was fabricated on FR4 laminate using lithography and liftoff technique. The mean length and width of the structures were found to be 4151.98 ±1.86 µm and 1003.21 ±0.55 µm, respectively with 95% confidence interval. There is a need for future work to precisely fabricate metal features on FR4 laminate

Micro-Mechanical Voltage Tunable Fabry-Perot Filters Formed in (111) Silicon

The MEMS (Micro-Electro-Mechanical-Systems) technology is quickly evolving as a viable means to combine micro-mechanical and micro-optical elements on the same chip. One MEMS technology that has recently gained attention by the research community is the micro-mechanical Fabry-Perot optical filter. A MEMS based Fabry-Perot consists of a vertically integrated structure composed of two mirrors separated by an air gap. Wavelength tuning is achieved by applying a bias between the two mirrors resulting in an attractive electrostatic force which pulls the mirrors closer. In this work, we present a new micro-mechanical Fabry-Perot structure which is simple to fabricate and is integratable with low cost silicon photodetectors and transistors. The structure consists of a movable gold coated oxide cantilever for the top mirror and a stationary Au/Ni plated silicon bottom mirror. The fabrication process is single mask level, self aligned, and requires only one grown or deposited layer. Undercutting of the oxide cantilever is carried out by a combination of RIE and anisotropic KOH etching of the (111) silicon substrate. Metallization of the mirrors is provided by thermal evaporation and electroplating. The optical and electrical characteristics of the fabricated devices were studied and show promissing results. A wavelength shift of 120nm with 53V applied bias was demonstrated by one device geometry using 6.27 micrometer air gap. The finesse of the structure was 2.4. Modulation bandwidths ranging from 91KHz to greater than 920KHz were also observed. Theoretical calculations show that if mirror reflectivity, smoothness, and parallelism are improved, a finesse of 30 is attainable. The predictions also suggest that a reduction of the air gap to 1 micrometer results in an increased wavelength tuning range of 175 nm with a CMOS compatible 4.75V