On the suitability and development of layout templates for analog layout reuse and layout-aware synthesis

Accelerating the synthesis of increasingly complex analog integrated circuits is key to bridge the widening gap between what we can integrate and what we can design while meeting ever-tightening time-to-market constraints. It is a well-known fact in the semiconductor industry that such goal can only be attained by means of adequate CAD methodologies, techniques, and accompanying tools. This is particularly important in analog physical synthesis (a.k.a. layout generation), where large sensitivities of the circuit performances to the many subtle details of layout implementation (device matching, loading and coupling effects, reliability, and area features are of utmost importance to analog designers), render complete automation a truly challenging task. To approach the problem, two directions have been traditionally considered, knowledge-based and optimization-based, both with their own pros and cons. Besides, recently reported solutions oriented to speed up the overall design flow by means of reuse-based practices or by cutting off time-consuming, error-prone spins between electrical and layout synthesis (a technique known as layout-aware synthesis), rely on a outstandingly rapid yet efficient layout generation method. This paper analyses the suitability of procedural layout generation based on templates (a knowledge-based approach) by examining the requirements that both layout reuse and layout-aware solutions impose, and how layout templates face them. The ability to capture the know-how of experienced layout designers and the turnaround times for layout instancing are considered main comparative aspects in relation to other layout generation approaches. A discussion on the benefit-cost trade-off of using layout templates is also included. In addition to this analysis, the paper delves deeper into systematic techniques to develop fully reusable layout templates for analog circuits, either for a change of the circuit sizing (i.e., layout retargeting) or a change of the fabrication process (i.e., layout migration). Several examples implemented with the Cadence's Virtuoso tool suite are provided as demonstration of the paper's contributions.Ministerio de Educación y Ciencia TEC2004-0175

Tensor Computation: A New Framework for High-Dimensional Problems in EDA

Many critical EDA problems suffer from the curse of dimensionality, i.e. the very fast-scaling computational burden produced by large number of parameters and/or unknown variables. This phenomenon may be caused by multiple spatial or temporal factors (e.g. 3-D field solvers discretizations and multi-rate circuit simulation), nonlinearity of devices and circuits, large number of design or optimization parameters (e.g. full-chip routing/placement and circuit sizing), or extensive process variations (e.g. variability/reliability analysis and design for manufacturability). The computational challenges generated by such high dimensional problems are generally hard to handle efficiently with traditional EDA core algorithms that are based on matrix and vector computation. This paper presents "tensor computation" as an alternative general framework for the development of efficient EDA algorithms and tools. A tensor is a high-dimensional generalization of a matrix and a vector, and is a natural choice for both storing and solving efficiently high-dimensional EDA problems. This paper gives a basic tutorial on tensors, demonstrates some recent examples of EDA applications (e.g., nonlinear circuit modeling and high-dimensional uncertainty quantification), and suggests further open EDA problems where the use of tensor computation could be of advantage.Comment: 14 figures. Accepted by IEEE Trans. CAD of Integrated Circuits and System

Enabling High-Dimensional Hierarchical Uncertainty Quantification by ANOVA and Tensor-Train Decomposition

Hierarchical uncertainty quantification can reduce the computational cost of stochastic circuit simulation by employing spectral methods at different levels. This paper presents an efficient framework to simulate hierarchically some challenging stochastic circuits/systems that include high-dimensional subsystems. Due to the high parameter dimensionality, it is challenging to both extract surrogate models at the low level of the design hierarchy and to handle them in the high-level simulation. In this paper, we develop an efficient ANOVA-based stochastic circuit/MEMS simulator to extract efficiently the surrogate models at the low level. In order to avoid the curse of dimensionality, we employ tensor-train decomposition at the high level to construct the basis functions and Gauss quadrature points. As a demonstration, we verify our algorithm on a stochastic oscillator with four MEMS capacitors and 184 random parameters. This challenging example is simulated efficiently by our simulator at the cost of only 10 minutes in MATLAB on a regular personal computer.Comment: 14 pages (IEEE double column), 11 figure, accepted by IEEE Trans CAD of Integrated Circuits and System

A Review of Bayesian Methods in Electronic Design Automation

The utilization of Bayesian methods has been widely acknowledged as a viable solution for tackling various challenges in electronic integrated circuit (IC) design under stochastic process variation, including circuit performance modeling, yield/failure rate estimation, and circuit optimization. As the post-Moore era brings about new technologies (such as silicon photonics and quantum circuits), many of the associated issues there are similar to those encountered in electronic IC design and can be addressed using Bayesian methods. Motivated by this observation, we present a comprehensive review of Bayesian methods in electronic design automation (EDA). By doing so, we hope to equip researchers and designers with the ability to apply Bayesian methods in solving stochastic problems in electronic circuits and beyond.Comment: 24 pages, a draft version. We welcome comments and feedback, which can be sent to [email protected]

Stochastic Testing Simulator for Integrated Circuits and MEMS: Hierarchical and Sparse Techniques

Process variations are a major concern in today's chip design since they can significantly degrade chip performance. To predict such degradation, existing circuit and MEMS simulators rely on Monte Carlo algorithms, which are typically too slow. Therefore, novel fast stochastic simulators are highly desired. This paper first reviews our recently developed stochastic testing simulator that can achieve speedup factors of hundreds to thousands over Monte Carlo. Then, we develop a fast hierarchical stochastic spectral simulator to simulate a complex circuit or system consisting of several blocks. We further present a fast simulation approach based on anchored ANOVA (analysis of variance) for some design problems with many process variations. This approach can reduce the simulation cost and can identify which variation sources have strong impacts on the circuit's performance. The simulation results of some circuit and MEMS examples are reported to show the effectiveness of our simulatorComment: Accepted to IEEE Custom Integrated Circuits Conference in June 2014. arXiv admin note: text overlap with arXiv:1407.302

Communication Subsystems for Emerging Wireless Technologies

The paper describes a multi-disciplinary design of modern communication systems. The design starts with the analysis of a system in order to define requirements on its individual components. The design exploits proper models of communication channels to adapt the systems to expected transmission conditions. Input filtering of signals both in the frequency domain and in the spatial domain is ensured by a properly designed antenna. Further signal processing (amplification and further filtering) is done by electronics circuits. Finally, signal processing techniques are applied to yield information about current properties of frequency spectrum and to distribute the transmission over free subcarrier channels

Piezo-electromechanical smart materials with distributed arrays of piezoelectric transducers: Current and upcoming applications

This review paper intends to gather and organize a series of works which discuss the possibility of exploiting the mechanical properties of distributed arrays of piezoelectric transducers. The concept can be described as follows: on every structural member one can uniformly distribute an array of piezoelectric transducers whose electric terminals are to be connected to a suitably optimized electric waveguide. If the aim of such a modification is identified to be the suppression of mechanical vibrations then the optimal electric waveguide is identified to be the 'electric analog' of the considered structural member. The obtained electromechanical systems were called PEM (PiezoElectroMechanical) structures. The authors especially focus on the role played by Lagrange methods in the design of these analog circuits and in the study of PEM structures and we suggest some possible research developments in the conception of new devices, in their study and in their technological application. Other potential uses of PEMs, such as Structural Health Monitoring and Energy Harvesting, are described as well. PEM structures can be regarded as a particular kind of smart materials, i.e. materials especially designed and engineered to show a specific andwell-defined response to external excitations: for this reason, the authors try to find connection between PEM beams and plates and some micromorphic materials whose properties as carriers of waves have been studied recently. Finally, this paper aims to establish some links among some concepts which are used in different cultural groups, as smart structure, metamaterial and functional structural modifications, showing how appropriate would be to avoid the use of different names for similar concepts. © 2015 - IOS Press and the authors