DESIGN METHODOLOGIES FOR RELIABLE AND ENERGY-EFFICIENT MULTIPROCESSOR SYSTEM

Ph.DDOCTOR OF PHILOSOPH

Real-Time Systems

Since 2004, most of chip vendors have begun to shift their major focus from single-core to multi-core architecture (W. Wolf. Signal Processing Magazine, IEEE, 26(6):50–54, 2009). One major reason of this shift is that it reaches a physical limit by scaling transistor size and increasing the clock frequency to improve the computing performance on a single-core architecture (Agarwal et al. Proceedings of the 27th International Symposium on, pages 248–259, June 2000), that is, the overall chip cannot be reached within a single clock cycle. Multi-core architecture, however, brings innovative and promising opportunities to further improve the computing performance. By providing multiple processing cores on a single chip, multi-core systems can dramatically increase the computing performance and mitigate the power and thermal issues with the same performance achievement as single-core systems. As multi-core architecture has been more and more dominant in the industrial market, there is an urgent demand for effective and efficient techniques for the design of multi-core systems

MULTI-SCALE SCHEDULING TECHNIQUES FOR SIGNAL PROCESSING SYSTEMS

A variety of hardware platforms for signal processing has emerged, from distributed systems such as Wireless Sensor Networks (WSNs) to parallel systems such as Multicore Programmable Digital Signal Processors (PDSPs), Multicore General Purpose Processors (GPPs), and Graphics Processing Units (GPUs) to heterogeneous combinations of parallel and distributed devices. When a signal processing application is implemented on one of those platforms, the performance critically depends on the scheduling techniques, which in general allocate computation and communication resources for competing processing tasks in the application to optimize performance metrics such as power consumption, throughput, latency, and accuracy. Signal processing systems implemented on such platforms typically involve multiple levels of processing and communication hierarchy, such as network-level, chip-level, and processor-level in a structural context, and application-level, subsystem-level, component-level, and operation- or instruction-level in a behavioral context. In this thesis, we target scheduling issues that carefully address and integrate scheduling considerations at different levels of these structural and behavioral hierarchies. The core contributions of the thesis include the following. Considering both the network-level and chip-level, we have proposed an adaptive scheduling algorithm for wireless sensor networks (WSNs) designed for event detection. Our algorithm exploits discrepancies among the detection accuracy of individual sensors, which are derived from a collaborative training process, to allow each sensor to operate in a more energy efficient manner while the network satisfies given constraints on overall detection accuracy. Considering the chip-level and processor-level, we incorporated both temperature and process variations to develop new scheduling methods for throughput maximization on multicore processors. In particular, we studied how to process a large number of threads with high speed and without violating a given maximum temperature constraint. We targeted our methods to multicore processors in which the cores may operate at different frequencies and different levels of leakage. We develop speed selection and thread assignment schedulers based on the notion of a core's steady state temperature. Considering the application-level, component-level and operation-level, we developed a new dataflow based design flow within the targeted dataflow interchange format (TDIF) design tool. Our new multiprocessor system-on-chip (MPSoC)-oriented design flow, called TDIF-PPG, is geared towards analysis and mapping of embedded DSP applications on MPSoCs. An important feature of TDIF-PPG is its capability to integrate graph level parallelism and actor level parallelism into the application mapping process. Here, graph level parallelism is exposed by the dataflow graph application representation in TDIF, and actor level parallelism is modeled by a novel model for multiprocessor dataflow graph implementation that we call the Parallel Processing Group (PPG) model. Building on the contribution above, we formulated a new type of parallel task scheduling problem called Parallel Actor Scheduling (PAS) for chip-level MPSoC mapping of DSP systems that are represented as synchronous dataflow (SDF) graphs. In contrast to traditional SDF-based scheduling techniques, which focus on exploiting graph level (inter-actor) parallelism, the PAS problem targets the integrated exploitation of both intra- and inter-actor parallelism for platforms in which individual actors can be parallelized across multiple processing units. We address a special case of the PAS problem in which all of the actors in the DSP application or subsystem being optimized can be parallelized. For this special case, we develop and experimentally evaluate a two-phase scheduling framework with three work flows --- particle swarm optimization with a mixed integer programming formulation, particle swarm optimization with a simulated annealing engine, and particle swarm optimization with a fast heuristic based on list scheduling. Then, we extend our scheduling framework to support general PAS problem which considers the actors cannot be parallelized

Dynamic Thermal Management for Microprocessors

In deep submicron era, thermal hot spots and large temperature gradients significantly impact system reliability, performance, cost and leakage power. Dynamic thermal management techniques are designed to tackle the problems and control the chip temperature as well as power consumption. They refer to those techniques which enable the chip to autonomously modify the task execution and power dissipation characteristics so that lower-cost cooling solutions could be adopted while still guaranteeing safe temperature regulation. As long as the temperature is regulated, the system reliability can be improved, leakage power can be reduced and cooling system lifetime can be extended significantly. Multimedia applications are expected to form the largest portion of workload in general purpose PC and portable devices. The ever-increasing computation intensity of multimedia applications elevates the processor temperature and consequently impairs the reliability and performance of the system. In this thesis, we propose to perform dynamic thermal management using reinforcement learning algorithm for multimedia applications. The presented learning model does not need any prior knowledge of the workload information or the system thermal and power characteristics. It learns the temperature change and workload switching patterns by observing the temperature sensor and event counters on the processor, and finds the management policy that provides good performance-thermal tradeoff during the runtime. As the system complexity increases, it is more and more difficult to perform thermal management in a centralized manner because of state explosion and the overhead of monitoring the entire chip. In this thesis, we present a framework for distributed thermal management in many-core systems where balanced thermal profile can be achieved by proactive task migration among neighboring cores. The framework has a low cost agent residing in each core that observes the local workload and temperature and communicates with its nearest neighbor for task migration and exchange. By choosing only those migration requests that will result in balanced workload without generating thermal emergency, the presented framework maintains workload balance across the system and avoids unnecessary migration. Experimental results show that, our distributed management policy achieves almost the same performance as a global management policy when the tasks are initially randomly distributed. Compared with existing proactive task migration technique, our approach generates less hotspot, less migration overhead with negligible performance overhead. Temperature affects the leakage power and cooling power. In this thesis, we address the impact of task allocation on a processor\u27s leakage power and cooling fan power. Although the leakage power is determined by the average die temperature and the fan power is determined by the peak temperature, our analysis shows that the overall power can be minimized if a task allocation with minimum peak temperature is adopted together with an intelligent fan speed adjustment technique that finds the optimal tradeoff between fan power and leakage power. We further present a multi-agent distributed task migration technique that searches for the best task allocation during runtime. By choosing only those migration requests that will result chip maximum temperature reduction, the presented framework achieves large fan power savings as well as overall power reduction

Power and Reliability Management of SoCs

Today's embedded systems integrate multiple IP cores for processing, communication, and sensing on a single die as systems-on-chip (SoCs). Aggressive transistor scaling, decreased voltage margins and increased processor power and temperature have made reliability assessment a much more significant issue. Although reliability of devices and interconnect has been broadly studied, in this work, we study a tradeoff between reliability and power consumption for component-based SoC designs. We specifically focus on hard error rates as they cause a device to permanently stop operating. We also present a joint reliability and power management optimization problem whose solution is an optimal management policy. When careful joint policy optimization is performed, we obtain a significant improvement in energy consumption (40%) in tandem with meeting a reliability constraint for all SoC operating temperatures

Thermal Characterization of Next-Generation Workloads on Heterogeneous MPSoCs

Next-generation High-Performance Computing (HPC) applications need to tackle outstanding computational complexity while meeting latency and Quality-of-Service constraints. Heterogeneous Multi-Processor Systems-on-Chip (MPSoCs), equipped with a mix of general-purpose cores and reconfigurable fabric for custom acceleration of computational blocks, are key in providing the flexibility to meet the requirements of next-generation HPC. However, heterogeneity brings new challenges to efficient chip thermal management. In this context, accurate and fast thermal simulators are becoming crucial to understand and exploit the trade-offs brought by heterogeneous MPSoCs. In this paper, we first thermally characterize a next-generation HPC workload, the online video transcoding application, using a highly-accurate Infra-Red (IR) microscope. Second, we extend the 3D-ICE thermal simulation tool with a new generic heat spreader model capable of accurately reproducing package surface temperature, with an average error of 6.8% for the hot spots of the chip. Our model is used to characterize the thermal behaviour of the online transcoding application when running on a heterogeneous MPSoC. Moreover, by using our detailed thermal system characterization we are able to explore different application mappings as well as the thermal limits of such heterogeneous platforms

Self-adaptivity of applications on network on chip multiprocessors: the case of fault-tolerant Kahn process networks

Technology scaling accompanied with higher operating frequencies and the ability to integrate more functionality in the same chip has been the driving force behind delivering higher performance computing systems at lower costs. Embedded computing systems, which have been riding the same wave of success, have evolved into complex architectures encompassing a high number of cores interconnected by an on-chip network (usually identified as Multiprocessor System-on-Chip). However these trends are hindered by issues that arise as technology scaling continues towards deep submicron scales. Firstly, growing complexity of these systems and the variability introduced by process technologies make it ever harder to perform a thorough optimization of the system at design time. Secondly, designers are faced with a reliability wall that emerges as age-related degradation reduces the lifetime of transistors, and as the probability of defects escaping post-manufacturing testing is increased. In this thesis, we take on these challenges within the context of streaming applications running in network-on-chip based parallel (not necessarily homogeneous) systems-on-chip that adopt the no-remote memory access model. In particular, this thesis tackles two main problems: (1) fault-aware online task remapping, (2) application-level self-adaptation for quality management. For the former, by viewing fault tolerance as a self-adaptation aspect, we adopt a cross-layer approach that aims at graceful performance degradation by addressing permanent faults in processing elements mostly at system-level, in particular by exploiting redundancy available in multi-core platforms. We propose an optimal solution based on an integer linear programming formulation (suitable for design time adoption) as well as heuristic-based solutions to be used at run-time. We assess the impact of our approach on the lifetime reliability. We propose two recovery schemes based on a checkpoint-and-rollback and a rollforward technique. For the latter, we propose two variants of a monitor-controller- adapter loop that adapts application-level parameters to meet performance goals. We demonstrate not only that fault tolerance and self-adaptivity can be achieved in embedded platforms, but also that it can be done without incurring large overheads. In addressing these problems, we present techniques which have been realized (depending on their characteristics) in the form of a design tool, a run-time library or a hardware core to be added to the basic architecture

Reliabilibity Aware Thermal Management of Real-time Multi-core Systems

Continued scaling of CMOS technology has led to increasing working temperature of VLSI circuits. High temperature brings a greater probability of permanent errors (failure) in VLSI circuits, which is a critical threat for real-time systems. As the multi-core architecture is gaining in popularity, this research proposes an adaptive workload assignment approach for multi-core real-time systems to balance thermal stress among cores. While previously developed scheduling algorithms use temperature as the criterion, the proposed algorithm uses reliability of each core in the system to dynamically assign tasks to cores. The simulation results show that the proposed algorithm gains as large as 10% benefit in system reliability compared with commonly used static assignment while algorithms using temperature as criterion gain 4%. The reliability difference between cores, which indicates the imbalance of thermal stress on each core, is as large as 25 times smaller when proposed algorithm is applied