Studying the effects of intermittent faults on a microcontroller

As CMOS technology scales to the nanometer range, designers have to deal with a growing number and variety of fault types. Particularly, intermittent faults are expected to be an important issue in modern VLSI circuits. The complexity of manufacturing processes, producing residues and parameter variations, together with special aging mechanisms, may increase the presence of such faults. This work presents a case study of the impact of intermittent faults on the behavior of a commercial microcontroller. In order to carry out an exhaustive reliability assessment, the methodology used lies in VHDL-based fault injection technique. In this way, a set of intermittent fault models at logic and register transfer abstraction levels have been generated and injected in the VHDL model of the system. From the simulation traces, the occurrences of failures and latent errors have been logged. The impact of intermittent faults has been also compared to that got when injecting transient and permanent faults. Finally, some injection experiments have been reproduced in a RISC microprocessor and compared with those of the microcontroller. © 2012 Elsevier Ltd. All rights reserved.This work has been funded by the Spanish Government under the Research Project TIN2009-13825.Gil Tomás, DA.; Gracia-Morán, J.; Baraza Calvo, JC.; Saiz-Adalid, L.; Gil Vicente, PJ. (2012). Studying the effects of intermittent faults on a microcontroller. Microelectronics Reliability. 52(11):2837-2846. https://doi.org/10.1016/j.microrel.2012.06.004S28372846521

A novel low-swing voltage driver design and the analysis of its robustness to the effects of process variation and external disturbances

arket forces are continually demanding devices with increased functionality/unit area; these demands have been satisfied through aggressive technology scaling which, unfortunately, has impacted adversely on the global interconnect delay subsequently reducing system performance. Line drivers have been used to mitigate the problems with delay; however, these have a large power consumption. A solution to reducing the power dissipation of the drivers is to use lower supply voltages. However, by adopting a lower power supply voltage, the performance of the line drivers for global interconnects is impaired unless low-swing signalling techniques are implemented. Low-swing signalling techniques can provide high speed signalling with low power consumption and hence can be used to drive global on-chip interconnect. Most of the proposed low-swing signalling schemes are immune to noise as they have a good SNR. However, they tend to have a large penalty in area and complexity as they require additional circuitry such as voltage generators and low-Vth devices. Most of the schemes also incorporate multiple Vdd and reference voltages which increase the overall circuit complexity. A diode-connected driver circuit has the best attributes over other low-swing signalling techniques in terms of low power, low delay, good SNR and low area overhead. By incorporating a diode-connected configuration at the output, it can provide high speed signalling due to its high driving capability. However, this configuration also has its limitations as it has issues with its adaptability to process variations, as well as an issue with leakage currents. To address these limitations, two novel driver schemes have been designed, namely, nLVSD and mLVSD, which, additionally, have improvements in performance and power consumption. Comparisons between the proposed schemes with the existing diode-connected driver circuits (MJ and DDC) showed that the nLVSD and mLVSD drivers have approximately 46% and 50% less delay. The name MJ originates from the driver’s designer called Juan A. Montiel-Nelson, while DDC stands for dynamic diode-connected. In terms of power consumption, the nLVSD and mLVSD drivers also produce 43% and 7% improvement. Additionally, the mLVSD driver scheme is the most robust as its SNR is 14 to 44% higher compared to other diode-connected driver circuits. On the other hand, the nLVSD driver has 6% lower SNR compared to the MJ driver, even though it is 19% more robust than the DDC driver. However, since its SNR is still above 1, its improved performance and reduced power consumption, as well other advantages it has over other diode-connected driver circuits can compensate for this limitation. Regarding the robustness to external disturbances, the proposedmdriver circuits are more robust to crosstalk effects as the nLVSD and mLVSD drivers are approximately 35% and 7% more robust than other diode-connected drivers. Furthermore, the mLVSD driver is 5%, 33% and 47% more tolerant to SEUs compared to the nLVSD, MJ and DDC driver circuits respectively, whilst the MJ and DDC drivers are 26% and 40% less tolerant to SEUs iii compared to the nLVSD circuit. A comparison between the four schemes was also undertaken in the presence of ±3σ process and voltage (PV) variations. The analysis indicated that both proposed driver schemes are more robust than other diode-connected driver schemes, namely, the MJ and DDC driver circuits. The MJ driver scheme deviates approximately 18% and 35% more in delay and power consumption compared to the proposed schemes. The DDC driver has approximately 20% and 57% more variations in delay and power consumption in comparison to the proposed schemes. In order to further improve the robustness of the proposed driver circuits against process variation and environmental disturbances, they were further analysed to identify which process variables had the most impact on circuit delay and power consumption, as well as identifying several design techniques to mitigate problems with environmental disturbances. The most significant process parameters to have impact on circuit delay and power consumption were identified to be Vdd, tox, Vth, s, w and t. The impact of SEUs on the circuit can be reduced by increasing the bias currents whilst design methods such as increasing the interconnect spacing can help improve the circuit robustness against crosstalk. Overall it is considered that the proposed nLVSD and mLVSD circuits advance the state of the art in driver design for on-chip signalling applications.EThOS - Electronic Theses Online ServiceGBUnited Kingdo

Effects of intermittent faults on the reliability of a Reduced Instruction Set Computing (RISC) microprocessor

© 2014 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.With the scaling of complementary metal-oxide-semiconductor (CMOS) technology to the submicron range, designers have to deal with a growing number and variety of fault types. In this way, intermittent faults are gaining importance in modern very large scale integration (VLSI) circuits. The presence of these faults is increasing due to the complexity of manufacturing processes (which produce residues and parameter variations), together with special aging mechanisms. This work presents a case study of the impact of intermittent faults on the behavior of a reduced instruction set computing (RISC) microprocessor. We have carried out an exhaustive reliability assessment by using very-high-speed-integrated-circuit hardware description language (VHDL)-based fault injection. In this way, we have been able to modify different intermittent fault parameters, to select various targets, and even, to compare the impact of intermittent faults with those induced by transient and permanent faults.This work was supported by the Spanish Government under the Research Project TIN2009-13825 and by the Universitat Politecnica de Valencia under the Project SP20120806. Associate Editor: L. Cui.Gracia-Morán, J.; Baraza Calvo, JC.; Gil Tomás, DA.; Saiz-Adalid, L.; Gil, P. (2014). Effects of intermittent faults on the reliability of a Reduced Instruction Set Computing (RISC) microprocessor. IEEE Transactions on Reliability. 63(1):144-153. https://doi.org/10.1109/TR.2014.2299711S14415363

Injecting Intermittent Faults for the Dependability Assessment of a Fault-Tolerant Microcomputer System

© 2016 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.As scaling is more and more aggressive, intermittent faults are increasing their importance in current deep submicron complementary metal-oxide-semiconductor (CMOS) technologies. This work shows the dependability assessment of a fault-tol- erant computer system against intermittent faults. The applied methodology lies in VHDL-based fault injection, which allows the assessment in early design phases, together with a high level of observability and controllability. The evaluated system is a duplex microcontroller system with cold stand-by sparing. A wide set of intermittent fault models have been injected, and from the simulation traces, coverages and latencies have been measured. Markov models for this system have been generated and some dependability functions, such as reliability and safety, have been calculated. From these results, some enhancements of detection and recovery mechanisms have been suggested. The methodology presented is general to any fault-tolerant computer system.This work was supported in part by the Universitat Politecnica de Valencia under the Research Project SP20120806, and in part by the Spanish Government under the Research Project TIN2012-38308-C02-01. Associate Editor: J. Shortle.Gil Tomás, DA.; Gracia Morán, J.; Baraza Calvo, JC.; Saiz Adalid, LJ.; Gil Vicente, PJ. (2016). Injecting Intermittent Faults for the Dependability Assessment of a Fault-Tolerant Microcomputer System. IEEE Transactions on Reliability. 65(2):648-661. https://doi.org/10.1109/TR.2015.2484058S64866165

Aircraft electromagnetic compatibility

Illustrated are aircraft architecture, electromagnetic interference environments, electromagnetic compatibility protection techniques, program specifications, tasks, and verification and validation procedures. The environment of 400 Hz power, electrical transients, and radio frequency fields are portrayed and related to thresholds of avionics electronics. Five layers of protection for avionics are defined. Recognition is given to some present day electromagnetic compatibility weaknesses and issues which serve to reemphasize the importance of EMC verification of equipment and parts, and their ultimate EMC validation on the aircraft. Proven standards of grounding, bonding, shielding, wiring, and packaging are laid out to help provide a foundation for a comprehensive approach to successful future aircraft design and an understanding of cost effective EMC in an aircraft setting

The ALICE TPC, a large 3-dimensional tracking device with fast readout for ultra-high multiplicity events

The design, construction, and commissioning of the ALICE Time-Projection Chamber (TPC) is described. It is the main device for pattern recognition, tracking, and identification of charged particles in the ALICE experiment at the CERN LHC. The TPC is cylindrical in shape with a volume close to 90 m^3 and is operated in a 0.5 T solenoidal magnetic field parallel to its axis. In this paper we describe in detail the design considerations for this detector for operation in the extreme multiplicity environment of central Pb--Pb collisions at LHC energy. The implementation of the resulting requirements into hardware (field cage, read-out chambers, electronics), infrastructure (gas and cooling system, laser-calibration system), and software led to many technical innovations which are described along with a presentation of all the major components of the detector, as currently realized. We also report on the performance achieved after completion of the first round of stand-alone calibration runs and demonstrate results close to those specified in the TPC Technical Design Report.Comment: 55 pages, 82 figure

New Fault Detection, Mitigation and Injection Strategies for Current and Forthcoming Challenges of HW Embedded Designs

Tesis por compendio[EN] Relevance of electronics towards safety of common devices has only been growing, as an ever growing stake of the functionality is assigned to them. But of course, this comes along the constant need for higher performances to fulfill such functionality requirements, while keeping power and budget low. In this scenario, industry is struggling to provide a technology which meets all the performance, power and price specifications, at the cost of an increased vulnerability to several types of known faults or the appearance of new ones. To provide a solution for the new and growing faults in the systems, designers have been using traditional techniques from safety-critical applications, which offer in general suboptimal results. In fact, modern embedded architectures offer the possibility of optimizing the dependability properties by enabling the interaction of hardware, firmware and software levels in the process. However, that point is not yet successfully achieved. Advances in every level towards that direction are much needed if flexible, robust, resilient and cost effective fault tolerance is desired. The work presented here focuses on the hardware level, with the background consideration of a potential integration into a holistic approach. The efforts in this thesis have focused several issues: (i) to introduce additional fault models as required for adequate representativity of physical effects blooming in modern manufacturing technologies, (ii) to provide tools and methods to efficiently inject both the proposed models and classical ones, (iii) to analyze the optimum method for assessing the robustness of the systems by using extensive fault injection and later correlation with higher level layers in an effort to cut development time and cost, (iv) to provide new detection methodologies to cope with challenges modeled by proposed fault models, (v) to propose mitigation strategies focused towards tackling such new threat scenarios and (vi) to devise an automated methodology for the deployment of many fault tolerance mechanisms in a systematic robust way. The outcomes of the thesis constitute a suite of tools and methods to help the designer of critical systems in his task to develop robust, validated, and on-time designs tailored to his application.[ES] La relevancia que la electrónica adquiere en la seguridad de los productos ha crecido inexorablemente, puesto que cada vez ésta copa una mayor influencia en la funcionalidad de los mismos. Pero, por supuesto, este hecho viene acompañado de una necesidad constante de mayores prestaciones para cumplir con los requerimientos funcionales, al tiempo que se mantienen los costes y el consumo en unos niveles reducidos. En este escenario, la industria está realizando esfuerzos para proveer una tecnología que cumpla con todas las especificaciones de potencia, consumo y precio, a costa de un incremento en la vulnerabilidad a múltiples tipos de fallos conocidos o la introducción de nuevos. Para ofrecer una solución a los fallos nuevos y crecientes en los sistemas, los diseñadores han recurrido a técnicas tradicionalmente asociadas a sistemas críticos para la seguridad, que ofrecen en general resultados sub-óptimos. De hecho, las arquitecturas empotradas modernas ofrecen la posibilidad de optimizar las propiedades de confiabilidad al habilitar la interacción de los niveles de hardware, firmware y software en el proceso. No obstante, ese punto no está resulto todavía. Se necesitan avances en todos los niveles en la mencionada dirección para poder alcanzar los objetivos de una tolerancia a fallos flexible, robusta, resiliente y a bajo coste. El trabajo presentado aquí se centra en el nivel de hardware, con la consideración de fondo de una potencial integración en una estrategia holística. Los esfuerzos de esta tesis se han centrado en los siguientes aspectos: (i) la introducción de modelos de fallo adicionales requeridos para la representación adecuada de efectos físicos surgentes en las tecnologías de manufactura actuales, (ii) la provisión de herramientas y métodos para la inyección eficiente de los modelos propuestos y de los clásicos, (iii) el análisis del método óptimo para estudiar la robustez de sistemas mediante el uso de inyección de fallos extensiva, y la posterior correlación con capas de más alto nivel en un esfuerzo por recortar el tiempo y coste de desarrollo, (iv) la provisión de nuevos métodos de detección para cubrir los retos planteados por los modelos de fallo propuestos, (v) la propuesta de estrategias de mitigación enfocadas hacia el tratamiento de dichos escenarios de amenaza y (vi) la introducción de una metodología automatizada de despliegue de diversos mecanismos de tolerancia a fallos de forma robusta y sistemática. Los resultados de la presente tesis constituyen un conjunto de herramientas y métodos para ayudar al diseñador de sistemas críticos en su tarea de desarrollo de diseños robustos, validados y en tiempo adaptados a su aplicación.[CA] La rellevància que l'electrònica adquireix en la seguretat dels productes ha crescut inexorablement, puix cada volta més aquesta abasta una major influència en la funcionalitat dels mateixos. Però, per descomptat, aquest fet ve acompanyat d'un constant necessitat de majors prestacions per acomplir els requeriments funcionals, mentre es mantenen els costos i consums en uns nivells reduïts. Donat aquest escenari, la indústria està fent esforços per proveir una tecnologia que complisca amb totes les especificacions de potència, consum i preu, tot a costa d'un increment en la vulnerabilitat a diversos tipus de fallades conegudes, i a la introducció de nous tipus. Per oferir una solució a les noves i creixents fallades als sistemes, els dissenyadors han recorregut a tècniques tradicionalment associades a sistemes crítics per a la seguretat, que en general oferixen resultats sub-òptims. De fet, les arquitectures empotrades modernes oferixen la possibilitat d'optimitzar les propietats de confiabilitat en habilitar la interacció dels nivells de hardware, firmware i software en el procés. Tot i això eixe punt no està resolt encara. Es necessiten avanços a tots els nivells en l'esmentada direcció per poder assolir els objectius d'una tolerància a fallades flexible, robusta, resilient i a baix cost. El treball ací presentat se centra en el nivell de hardware, amb la consideració de fons d'una potencial integració en una estratègia holística. Els esforços d'esta tesi s'han centrat en els següents aspectes: (i) la introducció de models de fallada addicionals requerits per a la representació adequada d'efectes físics que apareixen en les tecnologies de fabricació actuals, (ii) la provisió de ferramentes i mètodes per a la injecció eficient del models proposats i dels clàssics, (iii) l'anàlisi del mètode òptim per estudiar la robustesa de sistemes mitjançant l'ús d'injecció de fallades extensiva, i la posterior correlació amb capes de més alt nivell en un esforç per retallar el temps i cost de desenvolupament, (iv) la provisió de nous mètodes de detecció per cobrir els reptes plantejats pels models de fallades proposats, (v) la proposta d'estratègies de mitigació enfocades cap al tractament dels esmentats escenaris d'amenaça i (vi) la introducció d'una metodologia automatitzada de desplegament de diversos mecanismes de tolerància a fallades de forma robusta i sistemàtica. Els resultats de la present tesi constitueixen un conjunt de ferramentes i mètodes per ajudar el dissenyador de sistemes crítics en la seua tasca de desenvolupament de dissenys robustos, validats i a temps adaptats a la seua aplicació.Espinosa García, J. (2016). New Fault Detection, Mitigation and Injection Strategies for Current and Forthcoming Challenges of HW Embedded Designs [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/73146TESISCompendi

Electro-optic architecture (EOA) for sensors and actuators in aircraft propulsion systems

Results of a study to design an optimal architecture for electro-optical sensing and control in advanced aircraft and space systems are described. The propulsion full authority digital Electronic Engine Control (EEC) was the focus for the study. The recommended architecture is an on-engine EEC which contains electro-optic interface circuits for fiber-optic sensors on the engine. Size and weight are reduced by multiplexing arrays of functionally similar sensors on a pair of optical fibers to common electro-optical interfaces. The architecture contains common, multiplex interfaces to seven sensor groups: (1) self luminous sensors; (2) high temperatures; (3) low temperatures; (4) speeds and flows; (5) vibration; (6) pressures; and (7) mechanical positions. Nine distinct fiber-optic sensor types were found to provide these sensing functions: (1) continuous wave (CW) intensity modulators; (2) time division multiplexing (TDM) digital optic codeplates; (3) time division multiplexing (TDM) analog self-referenced sensors; (4) wavelength division multiplexing (WDM) digital optic code plates; (5) wavelength division multiplexing (WDM) analog self-referenced intensity modulators; (6) analog optical spectral shifters; (7) self-luminous bodies; (8) coherent optical interferometers; and (9) remote electrical sensors. The report includes the results of a trade study including engine sensor requirements, environment, the basic sensor types, and relevant evaluation criteria. These figures of merit for the candidate interface types were calculated from the data supplied by leading manufacturers of fiber-optic sensors

Speeding-up model-based fault injection of deep-submicron CMOS fault models through dynamic and partially reconfigurable FPGAS

Actualmente, las tecnologías CMOS submicrónicas son básicas para el desarrollo de los modernos sistemas basados en computadores, cuyo uso simplifica enormemente nuestra vida diaria en una gran variedad de entornos, como el gobierno, comercio y banca electrónicos, y el transporte terrestre y aeroespacial. La continua reducción del tamaño de los transistores ha permitido reducir su consumo y aumentar su frecuencia de funcionamiento, obteniendo por ello un mayor rendimiento global. Sin embargo, estas mismas características que mejoran el rendimiento del sistema, afectan negativamente a su confiabilidad. El uso de transistores de tamaño reducido, bajo consumo y alta velocidad, está incrementando la diversidad de fallos que pueden afectar al sistema y su probabilidad de aparición. Por lo tanto, existe un gran interés en desarrollar nuevas y eficientes técnicas para evaluar la confiabilidad, en presencia de fallos, de sistemas fabricados mediante tecnologías submicrónicas. Este problema puede abordarse por medio de la introducción deliberada de fallos en el sistema, técnica conocida como inyección de fallos. En este contexto, la inyección basada en modelos resulta muy interesante, ya que permite evaluar la confiabilidad del sistema en las primeras etapas de su ciclo de desarrollo, reduciendo por tanto el coste asociado a la corrección de errores. Sin embargo, el tiempo de simulación de modelos grandes y complejos imposibilita su aplicación en un gran número de ocasiones. Esta tesis se centra en el uso de dispositivos lógicos programables de tipo FPGA (Field-Programmable Gate Arrays) para acelerar los experimentos de inyección de fallos basados en simulación por medio de su implementación en hardware reconfigurable. Para ello, se extiende la investigación existente en inyección de fallos basada en FPGA en dos direcciones distintas: i) se realiza un estudio de las tecnologías submicrónicas existentes para obtener un conjunto representativo de modelos de fallos transitoriosAndrés Martínez, DD. (2007). Speeding-up model-based fault injection of deep-submicron CMOS fault models through dynamic and partially reconfigurable FPGAS [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/1943Palanci

Reliable chip design from low powered unreliable components

The pace of technological improvement of the semiconductor market is driven by Moore’s Law, enabling chip transistor density to double every two years. The transistors would continue to decline in cost and size but increase in power. The continuous transistor scaling and extremely lower power constraints in modern Very Large Scale Integrated(VLSI) chips can potentially supersede the benefits of the technology shrinking due to reliability issues. As VLSI technology scales into nanoscale regime, fundamental physical limits are approached, and higher levels of variability, performance degradation, and higher rates of manufacturing defects are experienced. Soft errors, which traditionally affected only the memories, are now also resulting in logic circuit reliability degradation. A solution to these limitations is to integrate reliability assessment techniques into the Integrated Circuit(IC) design flow. This thesis investigates four aspects of reliability driven circuit design: a)Reliability estimation; b) Reliability optimization; c) Fault-tolerant techniques, and d) Delay degradation analysis. To guide the reliability driven synthesis and optimization of combinational circuits, highly accurate probability based reliability estimation methodology christened Conditional Probabilistic Error Propagation(CPEP) algorithm is developed to compute the impact of gate failures on the circuit output. CPEP guides the proposed rewriting based logic optimization algorithm employing local transformations. The main idea behind this methodology is to replace parts of the circuit with functionally equivalent but more reliable counterparts chosen from a precomputed subset of Negation-Permutation-Negation(NPN) classes of 4-variable functions. Cut enumeration and Boolean matching driven by reliability-aware optimization algorithm are used to identify the best possible replacement candidates. Experiments on a set of MCNC benchmark circuits and 8051 functional microcontroller units indicate that the proposed framework can achieve up to 75% reduction of output error probability. On average, about 14% SER reduction is obtained at the expense of very low area overhead of 6.57% that results in 13.52% higher power consumption. The next contribution of the research describes a novel methodology to design fault tolerant circuitry by employing the error correction codes known as Codeword Prediction Encoder(CPE). Traditional fault tolerant techniques analyze the circuit reliability issue from a static point of view neglecting the dynamic errors. In the context of communication and storage, the study of novel methods for reliable data transmission under unreliable hardware is an increasing priority. The idea of CPE is adapted from the field of forward error correction for telecommunications focusing on both encoding aspects and error correction capabilities. The proposed Augmented Encoding solution consists of computing an augmented codeword that contains both the codeword to be transmitted on the channel and extra parity bits. A Computer Aided Development(CAD) framework known as CPE simulator is developed providing a unified platform that comprises a novel encoder and fault tolerant LDPC decoders. Experiments on a set of encoders with different coding rates and different decoders indicate that the proposed framework can correct all errors under specific scenarios. On average, about 1000 times improvement in Soft Error Rate(SER) reduction is achieved. Last part of the research is the Inverse Gaussian Distribution(IGD) based delay model applicable to both combinational and sequential elements for sub-powered circuits. The Probability Density Function(PDF) based delay model accurately captures the delay behavior of all the basic gates in the library database. The IGD model employs these necessary parameters, and the delay estimation accuracy is demonstrated by evaluating multiple circuits. Experiments results indicate that the IGD based approach provides a high matching against HSPICE Monte Carlo simulation results, with an average error less than 1.9% and 1.2% for the 8-bit Ripple Carry Adder(RCA), and 8-bit De-Multiplexer(DEMUX) and Multiplexer(MUX) respectively