1,270 research outputs found
Design and modelling of variability tolerant on-chip communication structures for future high performance system on chip designs
The incessant technology scaling has enabled the integration of functionally complex System-on-Chip (SoC) designs with a large number of heterogeneous systems on a single chip. The processing elements on these chips are integrated through on-chip communication structures which provide the infrastructure necessary for the exchange of data and control signals, while meeting the strenuous physical and design constraints. The use of vast amounts of on chip communications will be central to future designs where variability is an inherent characteristic. For this reason, in this thesis we investigate the performance and variability tolerance of typical on-chip communication structures. Understanding of the relationship between variability and communication is paramount for the designers; i.e. to devise new methods and techniques for designing performance and power efficient communication circuits in the forefront of challenges presented by deep sub-micron (DSM) technologies.
The initial part of this work investigates the impact of device variability due to Random Dopant Fluctuations (RDF) on the timing characteristics of basic communication elements. The characterization data so obtained can be used to estimate the performance and failure probability of simple links through the methodology proposed in this work. For the Statistical Static Timing Analysis (SSTA) of larger circuits, a method for accurate estimation of the probability density functions of different circuit parameters is proposed. Moreover, its significance on pipelined circuits is highlighted. Power and area are one of the most important design metrics for any integrated circuit (IC) design. This thesis emphasises the consideration of communication reliability while optimizing for power and area. A methodology has been proposed for the simultaneous optimization of performance, area, power and delay variability for a repeater inserted interconnect. Similarly for multi-bit parallel links, bandwidth driven optimizations have also been performed. Power and area efficient semi-serial links, less vulnerable to delay variations than the corresponding fully parallel links are introduced. Furthermore, due to technology scaling, the coupling noise between the link lines has become an important issue. With ever decreasing supply voltages, and the corresponding reduction in noise margins, severe challenges are introduced for performing timing verification in the presence of variability. For this reason an accurate model for crosstalk noise in an interconnection as a function of time and skew is introduced in this work. This model can be used for the identification of skew condition that gives maximum delay noise, and also for efficient design verification
Analog/RF Circuit Design Techniques for Nanometerscale IC Technologies
CMOS evolution introduces several problems in analog design. Gate-leakage mismatch exceeds conventional matching tolerances requiring active cancellation techniques or alternative architectures. One strategy to deal with the use of lower supply voltages is to operate critical parts at higher supply voltages, by exploiting combinations of thin- and thick-oxide transistors. Alternatively, low voltage circuit techniques are successfully developed. In order to benefit from nanometer scale CMOS technology, more functionality is shifted to the digital domain, including parts of the RF circuits. At the same time, analog control for digital and digital control for analog emerges to deal with current and upcoming imperfections
Overcoming the challenges in very deep submicron for area reduction, power reduction and faster design closure
The project is aimed at understanding the existing very deep sub-micron (VDSM) implementation of a digital design, analyzing it from the point of view of power, area and timing and to come up with solutions and strategies to optimize the implementation in terms of power, area and timing. The effort involved, to understand the constraints, reasons and the requirements resulting in the existing implementation of the design. Further, various experiments were carried out to improve the design in various aspects like power, area and timing. The tradeoffs required and the benefits of each of the experiments were contrasted and analyzed. The optimum solutions and strategies which balance the requirements were tried out and published at the end of the report
Course grained low power design flow using UPF
Increased system complexity has led to the substitution of the traditional bottom-up design flow by systematic hierarchical design flow. The main motivation behind the evolution of such an approach is the increasing difficulty in hardware realization of complex systems. With decreasing channel lengths, few key problems such as timing closure, design sign-off, routing complexity, signal integrity, and power dissipation arise in the design flows. Specifically, minimizing power dissipation is critical in several high-end processors. In high-end processors, the design complexity contributes to the overall dynamic power while the decreasing transistor size results in static power dissipation. This research aims at optimizing the design flow for power and timing using the unified power format (UPF). UPF provides a strategic format to specify power-aware design information at every stage in the flow. The low power reduction techniques enforced in this research are multi-voltage, multi-threshold voltage (Vth), and power gating with state retention. An inherent design challenge addressed in this research is the choice of power optimization techniques as the flow advances from synthesis to physical design. A top-down digital design flow for a 32 bit MIPS RISC processor has been implemented with and without UPF synthesis flow for 65nm technology. The UPF synthesis is implemented with two voltages, 1.08V and 0.864V (Multi-VDD). Area, power and timing metrics are analyzed for the flows developed. Power savings of about 20 % are achieved in the design flow with \u27multi-threshold\u27 power technique compared to that of the design flow with no low power techniques employed. Similarly, 30 % power savings are achieved in the design flow with the UPF implemented when compared to that of the design flow with \u27multi-threshold\u27 power technique employed. Thus, a cumulative power savings of 42% has been achieved in a complete power efficient design flow (UPF) compared to that of the generic top-down standard flow with no power saving techniques employed. This is substantiated by the low voltage operation of modules in the design, reduction in clock switching power by gating clocks in the design and extensive use of HVT and LVT standard cells for implementation. The UPF synthesis flow saw the worst timing slack and more area when compared to those of the `multi-threshold\u27 or the generic flow. Percentage increase in the area with UPF is approximately 15%; a significant source for this increase being the additional power controlling logic added
A Survey of Fault-Injection Methodologies for Soft Error Rate Modeling in Systems-on-Chips
The development of process technology has increased system performance, but the system failure probability has also significantly increased. It is important to consider the system reliability in addition to the cost, performance, and power consumption. In this paper, we describe the types of faults that occur in a system and where these faults originate. Then, fault-injection techniques, which are used to characterize the fault rate of a system-on-chip (SoC), are investigated to provide a guideline to SoC designers for the realization of resilient SoCs
Digital Sensitivity: Predicting signal interaction using functional analysis
Abstract Maintaining signal integrity in digital systems is becoming increasingly dicult due to the rising number of analog effects seen in deep sub-micron design. One such eect, the signal crosstalk problem, is now a serious design concern. Signals which couple electrically may not aect system behavior because of timing or function in the digital domain. If we can isolate observable coupling eects then we can constrain layout synthesis to eliminate the
An Electromigration and Thermal Model of Power Wires for a Priori High-Level Reliability Prediction
In this paper, a simple power-distribution electrothermal model including the interconnect self-heating is used together with a statistical model of average and rms currents of functional blocks and a high-level model of fanout distribution and interconnect wirelength. Following the 2001 SIA roadmap projections, we are able to predict a priori that the minimum width that satisfies the electromigration constraints does not scale like the minimum metal pitch in future technology nodes. As a consequence, the percentage of chip area covered by power lines is expected to increase at the expense of wiring resources unless proper countermeasures are taken. Some possible solutions are proposed in the paper
Design Methodologies and Architecture Solutions for High-Performance Interconnects
ABSTRACT In Deep Sub-Micron (DSM) technologies, interconnects play a crucial role in the correct functionality and largely impact the performance of complex System-on-Chip (SoC) designs. For technologies of 0.25µm and below, wiring capacitance dominates gate capacitance, thus rapidly increasing the interconnect-induced delay. Moreover, the coupling capacitance becomes a significant portion of the on-chip total wiring capacitance, and coupling between adjacent wires cannot be considered as a second-order effect any longer. As a consequence, the traditional top-down design methodology is ineffective, since the actual wiring delays can be computed only after layout parasitic extraction, when the physical design is completed. Fixing all the timing violations often requires several time-consuming iterations of logical and physical design, and it is essentially a trial-and-error approach. Increasingly tighter time-to-market requirements dictate that interconnect parasitics must be taken into account during all phases of the design flow, at different level of abstractions. However, given the aggressive technology scaling trends and the growing design complexity, this approach will only temporarily ameliorate the interconnect problem. We believe that in order to achieve gigascale designs in the nanometer regime, a novel design paradigm, based on new forms of regularity and newly created IP (Intellectual Property) blocks must be developed, to provide a direct path from system-level architectural exploration to physical implementation
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On Co-Optimization Of Constrained Satisfiability Problems For Hardware Software Applications
Manufacturing technology has permitted an exponential growth in transistor count and density. However, making efficient use of the available transistors in the design has become exceedingly difficult. Standard design flow involves synthesis, verification, placement and routing followed by final tape out of the design. Due to the presence of various undesirable effects like capacitive crosstalk, supply noise, high temperatures, etc., verification/validation of the design has become a challenging problem. Therefore, having a good design convergence may not be possible within the target time, due to a need for a large number of design iterations.
Capacitive crosstalk is one of the major causes of design convergence problems in deep sub-micron era. With scaling, the number of crosstalk violations has been increasing because of reduced inter-wire distances. Consequently only the most severe crosstalk faults are fixed pre-silicon while the rest are tested post-silicon. Testing for capacitive crosstalk involves generation of input patterns which can be applied post-silicon to the integrated circuit and comparison of the output response. These patterns are generated at the gate/ Register Transfer Level (RTL) of abstraction using Automatic Test Pattern Generation (ATPG) tools. In this dissertation, anInteger Linear Programming (ILP) based ATPG technique for maximizing crosstalk induced delay increase at the victim net, for multiple aggressor crosstalk faults, is presented. Moreover, various solutions for pattern generation considering both zero as well as unit delay models is also proposed.
With voltage scaling, power supply switching noise has become one of the leading causes of signal integrity related failures in deep sub-micron designs. Hence, during power supply network design and analysis of power supply switching noise, computation of peak supply current is an essential step. Traditional peak current estimation approaches involve addition of peak current associated with all the CMOS gates which are switching in a combinational circuit. Consequently, this approach does not take the Boolean and temporal relationships of the circuit into account. This work presents an ILP based technique for generation of an input pattern pair which maximizes switching supply currents for a combinational circuit in the presence of integer gate delays. The input pattern pair generated using the above approach can be applied post-silicon for power droop testing.
With high level of integration, Multi-Processor Systems on Chip (MPSoC) feature multiple processor cores and accelerators on the same die, so as to exploit the instruction level parallelism in the application. For hardware-software co-design, application programming model is based on a Task Graph, which represents task dependencies and execution/transfer times for various threads and processes within an application. Mapping an application to an MPSoC traditionally involves representing it in the form of a task graph and employing static scheduling in order to minimize the schedule length. Dynamic system behavior is not taken into consideration during static scheduling, while dynamic scheduling requires the knowledge of task graph at runtime. A run-time task graph extraction heuristic to facilitate dynamic scheduling is also presented here. A novel game theory based approach uses this extracted task graph to perform run-time scheduling in order to minimize total schedule length.
With increase in transistor density, power density has gone up substantially. This has lead to generation of regions with very high temperature called Hotspots. Hotspots lead to reliability and performance issues and affect design convergence. In current generation Integrated Circuits (ICs) temperature is controlled by reducing power dissipation using Dynamic Thermal Management (DTM) techniques like frequency and/or voltage scaling. These techniques are reactive in nature and have detrimental effects on performance. Here, a look-ahead based task migration technique is proposed, in order to utilize the multitude of cores available in an MPSoC to eliminate thermal emergencies. Our technique is based on temperature prediction, leveraging upon a novel wavelet based thermal modeling approach.
Hence, this work addresses several optimization problems that can be reduced to constrained max-satisfiability, involving integer as well as Boolean constraints in hardware and software domains. Moreover, it provides domain specific heuristic solutions for each of them
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