57 research outputs found

    Reliable and Energy Efficient MLC STT-RAM Buffer for CNN Accelerators

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    We propose a lightweight scheme where the formation of a data block is changed in such a way that it can tolerate soft errors significantly better than the baseline. The key insight behind our work is that CNN weights are normalized between -1 and 1 after each convolutional layer, and this leaves one bit unused in half-precision floating-point representation. By taking advantage of the unused bit, we create a backup for the most significant bit to protect it against the soft errors. Also, considering the fact that in MLC STT-RAMs the cost of memory operations (read and write), and reliability of a cell are content-dependent (some patterns take larger current and longer time, while they are more susceptible to soft error), we rearrange the data block to minimize the number of costly bit patterns. Combining these two techniques provides the same level of accuracy compared to an error-free baseline while improving the read and write energy by 9% and 6%, respectively

    DESTINY: A Comprehensive Tool with 3D and Multi-Level Cell Memory Modeling Capability

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    To enable the design of large capacity memory structures, novel memory technologies such as non-volatile memory (NVM) and novel fabrication approaches, e.g., 3D stacking and multi-level cell (MLC) design have been explored. The existing modeling tools, however, cover only a few memory technologies, technology nodes and fabrication approaches. We present DESTINY, a tool for modeling 2D/3D memories designed using SRAM, resistive RAM (ReRAM), spin transfer torque RAM (STT-RAM), phase change RAM (PCM) and embedded DRAM (eDRAM) and 2D memories designed using spin orbit torque RAM (SOT-RAM), domain wall memory (DWM) and Flash memory. In addition to single-level cell (SLC) designs for all of these memories, DESTINY also supports modeling MLC designs for NVMs. We have extensively validated DESTINY against commercial and research prototypes of these memories. DESTINY is very useful for performing design-space exploration across several dimensions, such as optimizing for a target (e.g., latency, area or energy-delay product) for a given memory technology, choosing the suitable memory technology or fabrication method (i.e., 2D v/s 3D) for a given optimization target, etc. We believe that DESTINY will boost studies of next-generation memory architectures used in systems ranging from mobile devices to extreme-scale supercomputers. The latest source-code of DESTINY is available from the following git repository: https://bitbucket.org/sparsh_mittal/destiny_v2

    Error Characterization and Correction Techniques for Reliable STT-RAM Designs

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    The concerns on the continuous scaling of mainstream memory technologies have motivated tremendous investment to emerging memories. Being a promising candidate, spin-transfer torque random access memory (STT-RAM) offers nanosecond access time comparable to SRAM, high integration density close to DRAM, non-volatility as Flash memory, and good scalability. It is well positioned as the replacement of SRAM and DRAM for on-chip cache and main memory applications. However, reliability issue continues being one of the major challenges in STT-RAM memory designs due to the process variations and unique thermal fluctuations, i.e., the stochastic resistance switching property of magnetic devices. In this dissertation, I decoupled the reliability issues as following three-folds: First, the characterization of STT-RAM operation errors often require expensive Monte-Carlo runs with hybrid magnetic-CMOS simulation steps, making it impracticable for architects and system designs; Second, the state of the art does not have sufficiently understanding on the unique reliability issue of STT-RAM, and conventional error correction codes (ECCs) cannot efficiently handle such errors; Third, while the information density of STT-RAM can be boosted by multi-level cell (MLC) design, the more prominent reliability concerns and the complicated access mechanism greatly limit its applications in memory subsystems. Thus, I present a novel through solution set to both characterize and tackle the above reliability challenges in STT-RAM designs. In the first part of the dissertation, I introduce a new characterization method that can accurately and efficiently capture the multi-variable design metrics of STT-RAM cells; Second, a novel ECC scheme, namely, content-dependent ECC (CD-ECC), is developed to combat the characterized asymmetric errors of STT-RAM at 0->1 and 1->0 bit flipping's; Third, I present a circuit-architecture design, namely state-restricted multi-level cell (SR-MLC) STT-RAM design, which simultaneously achieves high information density, good storage reliability and fast write speed, making MLC STT-RAM accessible for system designers under current technology node. Finally, I conclude that efficient robust (or ECC) designs for STT-RAM require a deep holistic understanding on three different levels-device, circuit and architecture. Innovative ECC schemes and their architectural applications, still deserve serious research and investigation in the near future

    ARCHITECTING EMERGING MEMORY TECHNOLOGIES FOR ENERGY-EFFICIENT COMPUTING IN MODERN PROCESSORS

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    Ph.DDOCTOR OF PHILOSOPH

    Circuit and Architecture Co-Design of STT-RAM for High Performance and Low Energy

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    Spin-Transfer Torque Random Access Memory (STT-RAM) has been proved a promising emerging nonvolatile memory technology suitable for many applications such as cache mem- ory of CPU. Compared with other conventional memory technology, STT-RAM offers many attractive features such as nonvolatility, fast random access speed and extreme low leakage power. However, STT-RAM is still facing many challenges. First of all, programming STT-RAM is a stochastic process due to random thermal fluctuations, so the write errors are hard to avoid. Secondly, the existing STT-RAM cell designs can be used for only single-port accesses, which limits the memory access bandwidth and constraints the system performance. Finally, while other memory technology supports multi-level cell (MLC) design to boost the storage density, adopting MLC to STT-RAM brings many disadvantages such as requirement for large transistor and low access speed. In this work, we proposed solutions on both circuit and architecture level to address these challenges. For the write error issues, we proposed two probabilistic methods, namely write-verify- rewrite with adaptive period (WRAP) and verify-one-while-writing (VOW), for performance improvement and write failure reduction. For dual-port solution, we propose the design methods to support dual-port accesses for STT-RAM. The area increment by introducing an additional port is reduced by leveraging the shared source-line structure. Detailed analysis on the performance/reliability degrada- tion caused by dual-port accesses is performed, and the corresponding design optimization is provided. To unleash the potential of MLC STT-RAM cache, we proposed a new design through a cross-layer co-optimization. The memory cell structure integrated the reversed stacking of magnetic junction tunneling (MTJ) for a more balanced device and design trade-off. In architecture development, we presented an adaptive mode switching mechanism: based on application’s memory access behavior, the MLC STT-RAM cache can dynamically change between low latency SLC mode and high capacity MLC mode. Finally, we present a 4Kb test chip design which can support different types and sizes of MTJs. A configurable sensing solution is used in the test chip so that it can support wide range of MTJ resistance. Such test chip design can help to evaluate various type of MTJs in the future

    Bit-Write-Reducing and Error-Correcting Code Generation Methods for Non-Volatile Memories

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    早大学位記番号:新8124早稲田大

    Anchor: Architecture for Secure Non-Volatile Memories

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    The rapid growth of memory-intensive applications like cloud computing, deep learning, bioinformatics, etc., have propelled memory industry to develop scalable, high density, low power non-volatile memory (NVM) technologies; however, computing systems that integrate these advanced NVMs are vulnerable to several security attacks that threaten (i) data confidentiality, (ii) data availability, and (iii) data integrity. This dissertation presents ANCHOR, which integrates 4 low overhead, high performance security solutions SECRET, COVERT, ACME, and STASH to thwart these attacks on NVM systems. SECRET is a low cost security solution for data confidentiality in multi-/triple-level cell (i.e., MLC/TLC) NVMs. SECRET synergistically combines (i) smart encryption, which prevents re-encryption of unmodified or zero-words during a write-back with (ii) XOR-based energy masking, which further optimizes NVM writes by transforming a high-energy ciphertext into a low-energy ciphertext. SECRET outperforms state-of-the-art encryption solutions, with the lowest write energy and latency, as well as the highest lifetime. COVERT and ACME complement SECRET to improve system availability of counter mode encryption (CME). COVERT repurposes unused error correction resources to dynamically extend time to counter overflow of fast growing counters, thereby delaying frequent full memory re-encryption (system freeze). ACME performs counter write leveling (CWL) to further increase time to counter overflow, and thereby delays the time to full memory re-encryption. COVERT+ACME achieves system availability of 99.999% during normal operation and 99.9% under a denial of memory service (DoMS) attack. In contrast, conventional CME achieves system availability of only 85.71% during normal operation and is rendered non-operational under a DoMS attack. Finally, STASH is a comprehensive end-to-end security architecture for state-of-the-art smart hybrid memories (SHMs) that employ a smart DRAM cache with smart NVM-based main memory. STASH integrates (i) CME for data confidentiality, (ii) page-level Merkle Tree authentication for data integrity, (iii) recovery-compatible MT updates to withstand power/system failures, and (iv) page-migration friendly security meta-data management. For security guarantees equivalent to state-of-the-art, STASH reduces memory overhead by 12.7x, improves system performance by 65%, and increases NVM lifetime by 5x. This dissertation thus addresses the core security challenges of next-generation NVM-based memory systems. Directions for future research include (i) exploration of holistic architectures that ensure both security and reliability of smart memory systems, (ii) investigating applications of ANCHOR to reduce security overhead of Internet-of-Things, and (iii) extending ANCHOR to safeguard emerging non-volatile processors, especially in the light of advanced attacks like Spectre and Meltdown

    Architectural Techniques for Multi-Level Cell Phase Change Memory Based Main Memory

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    Phase change memory (PCM) recently has emerged as a promising technology to meet the fast growing demand for large capacity main memory in modern computing systems. Multi-level cell (MLC) PCM storing multiple bits in a single cell offers high density with low per-byte fabrication cost. However, PCM suffers from long write latency, short cell endurance, limited write throughput and high peak power, which makes it challenging to be integrated in the memory hierarchy. To address the long write latency, I propose write truncation to reduce the number of write iterations with the assistance of an extra error correction code (ECC). I also propose form switch (FS) to reduce the storage overhead of the ECC. By storing highly compressible lines in single level cell (SLC) form, FS improves read latency as well. To attack the short cell endurance and large peak power, I propose elastic RESET (ER) to construct triple-level cell PCM. By reducing RESET energy, ER significantly reduces peak power and prolongs PCM lifetime. To improve the write concurrency, I propose fine-grained write power budgeting (FPB) observing a global power budget and regulates power across write iterations according to the step-down power demand of each iteration. A global charge pump is also integrated onto a DIMM to boost power for hot PCM chips while staying within the global power budget. To further reduce the peak power, I propose intra-write RESET scheduling distributing cell RESET initializations in the whole write operation duration, so that the on-chip charge pump size can also be reduced
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