On the Distribution of Control in Asynchronous Processor Architectures

Institute for Computing Systems ArchitectureThe effective performance of computer systems is to a large measure determined by the synergy between the processor architecture, the instruction set and the compiler. In the past, the sequencing of information within processor architectures has normally been synchronous: controlled centrally by a clock. However, this global signal could possibly limit the future gains in performance that can potentially be achieved through improvements in implementation technology. This thesis investigates the effects of relaxing this strict synchrony by distributing control within processor architectures through the use of a novel asynchronous design model known as a micronet. The impact of asynchronous control on the performance of a RISC-style processor is explored at different levels. Firstly, improvements in the performance of individual instructions by exploiting actual run-time behaviours are demonstrated. Secondly, it is shown that micronets are able to exploit further (both spatial and temporal) instructionlevel parallelism (ILP) efficiently through the distribution of control to datapath resources. Finally, exposing fine-grain concurrency within a datapath can only be of benefit to a computer system if it can easily be exploited by the compiler. Although compilers for micronet-based asynchronous processors may be considered to be more complex than their synchronous counterparts, it is shown that the variable execution time of an instruction does not adversely affect the compiler's ability to schedule code efficiently. In conclusion, the modelling of a processor's datapath as a micronet permits the exploitation of both finegrain ILP and actual run-time delays, thus leading to the efficient utilisation of functional units and in turn resulting in an improvement in overall system performance

Cutting Edge Nanotechnology

The main purpose of this book is to describe important issues in various types of devices ranging from conventional transistors (opening chapters of the book) to molecular electronic devices whose fabrication and operation is discussed in the last few chapters of the book. As such, this book can serve as a guide for identifications of important areas of research in micro, nano and molecular electronics. We deeply acknowledge valuable contributions that each of the authors made in writing these excellent chapters

Predicting power scalability in a reconfigurable platform

This thesis focuses on the evolution of digital hardware systems. A reconfigurable platform is proposed and analysed based on thin-body, fully-depleted silicon-on-insulator Schottky-barrier transistors with metal gates and silicide source/drain (TBFDSBSOI). These offer the potential for simplified processing that will allow them to reach ultimate nanoscale gate dimensions. Technology CAD was used to show that the threshold voltage in TBFDSBSOI devices will be controllable by gate potentials that scale down with the channel dimensions while remaining within appropriate gate reliability limits. SPICE simulations determined that the magnitude of the threshold shift predicted by TCAD software would be sufficient to control the logic configuration of a simple, regular array of these TBFDSBSOI transistors as well as to constrain its overall subthreshold power growth. Using these devices, a reconfigurable platform is proposed based on a regular 6-input, 6-output NOR LUT block in which the logic and configuration functions of the array are mapped onto separate gates of the double-gate device. A new analytic model of the relationship between power (P), area (A) and performance (T) has been developed based on a simple VLSI complexity metric of the form ATσ = constant. As σ defines the performance “return” gained as a result of an increase in area, it also represents a bound on the architectural options available in power-scalable digital systems. This analytic model was used to determine that simple computing functions mapped to the reconfigurable platform will exhibit continuous power-area-performance scaling behavior. A number of simple arithmetic circuits were mapped to the array and their delay and subthreshold leakage analysed over a representative range of supply and threshold voltages, thus determining a worse-case range for the device/circuit-level parameters of the model. Finally, an architectural simulation was built in VHDL-AMS. The frequency scaling described by σ, combined with the device/circuit-level parameters predicts the overall power and performance scaling of parallel architectures mapped to the array

Optimizing the integration and energy efficiency of through silicon via-based 3D interconnects

The aggressive scaling of CMOS process technology has been driving the rapid growth of the semiconductor industry for more than three decades. In recent years, the performance gains enabled by CMOS scaling have been increasingly challenged by highlyparasitic on-chip interconnects as wire parasitics do not scale at the same pace. Emerging 3D integration technologies based on vertical through-silicon vias (TSVs) promise a solution to the interconnect performance bottleneck, along with reduced fabrication cost and heterogeneous integration. As TSVs are a relatively recent interconnect technology, innovative test structures are required to evaluate and optimise the process, as well as extract parameters for the generation of design rules and models. From the circuit designer’s perspective, critical TSV characteristics are its parasitic capacitance, and thermomechanical stress distribution. This work proposes new test structures for extracting these characteristics. The structures were fabricated on a 65nm 3D process and used for the evaluation of that technology. Furthermore, as TSVs are implemented in large, densely interconnected 3D-system-on-chips (SoCs), the TSV parasitic capacitance may become an important source of energy dissipation. Typical low-power techniques based on voltage scaling can be used, though this represents a technical challenge in modern technology nodes. In this work, a novel TSV interconnection scheme is proposed based on reversible computing, which shows frequencydependent energy dissipation. The scheme is analysed using theoretical modelling, while a demonstrator IC was designed based on the developed theory and fabricated on a 130nm 3D process.EThOS - Electronic Theses Online ServiceEngineering and Physical Science Research Council (EPSRC)GBUnited Kingdo

Aerial Vehicles

This book contains 35 chapters written by experts in developing techniques for making aerial vehicles more intelligent, more reliable, more flexible in use, and safer in operation.It will also serve as an inspiration for further improvement of the design and application of aeral vehicles. The advanced techniques and research described here may also be applicable to other high-tech areas such as robotics, avionics, vetronics, and space

Proceedings of the 22nd Conference on Formal Methods in Computer-Aided Design – FMCAD 2022

The Conference on Formal Methods in Computer-Aided Design (FMCAD) is an annual conference on the theory and applications of formal methods in hardware and system verification. FMCAD provides a leading forum to researchers in academia and industry for presenting and discussing groundbreaking methods, technologies, theoretical results, and tools for reasoning formally about computing systems. FMCAD covers formal aspects of computer-aided system design including verification, specification, synthesis, and testing