Programmable photonics : an opportunity for an accessible large-volume PIC ecosystem

We look at the opportunities presented by the new concepts of generic programmable photonic integrated circuits (PIC) to deploy photonics on a larger scale. Programmable PICs consist of waveguide meshes of tunable couplers and phase shifters that can be reconfigured in software to define diverse functions and arbitrary connectivity between the input and output ports. Off-the-shelf programmable PICs can dramatically shorten the development time and deployment costs of new photonic products, as they bypass the design-fabrication cycle of a custom PIC. These chips, which actually consist of an entire technology stack of photonics, electronics packaging and software, can potentially be manufactured cheaper and in larger volumes than application-specific PICs. We look into the technology requirements of these generic programmable PICs and discuss the economy of scale. Finally, we make a qualitative analysis of the possible application spaces where generic programmable PICs can play an enabling role, especially to companies who do not have an in-depth background in PIC technology

Current-mode processing based Temperature-to-Digital Converters for MEMS applications

This thesis presents novel Temperature-to-Digital Converters (TDCs) designed and fabricated in CMOS technology. These integrated smart temperature sensing circuits are widely employed in the Micro-Electro-Mechanical Systems (MEMS) field in order to mitigate the impact of the ambient temperature on their performance. In this framework, the increasingly stringent demands of the market have led the cost-effectiveness specification of these compensation solutions to an higher and higher level, directly translating into the requirement of more and more compact designs (< 0.1 mm²); in addition to this, considering that the great majority of the systems whose thermal drift needs to be compensated is battery supplied, ultra-low energy-per-conversion (< 10 nJ) is another requirement of primary importance. This thesis provides a detailed description of two different test-chips (mas fuerte and es posible) that have been designed with this orientation and that are the result of three years of research activity; for both devices, the conception, design, layout and testing phases are all described in detail and are supported by simulation and measurement results.This thesis presents novel Temperature-to-Digital Converters (TDCs) designed and fabricated in CMOS technology. These integrated smart temperature sensing circuits are widely employed in the Micro-Electro-Mechanical Systems (MEMS) field in order to mitigate the impact of the ambient temperature on their performance. In this framework, the increasingly stringent demands of the market have led the cost-effectiveness specification of these compensation solutions to an higher and higher level, directly translating into the requirement of more and more compact designs (< 0.1 mm²); in addition to this, considering that the great majority of the systems whose thermal drift needs to be compensated is battery supplied, ultra-low energy-per-conversion (< 10 nJ) is another requirement of primary importance. This thesis provides a detailed description of two different test-chips (mas fuerte and es posible) that have been designed with this orientation and that are the result of three years of research activity; for both devices, the conception, design, layout and testing phases are all described in detail and are supported by simulation and measurement results

Custom Integrated Circuits

Contains table of contents for Part III, table of contents for Section 1 and reports on eleven research projects.IBM CorporationMIT School of EngineeringNational Science Foundation Grant MIP 94-23221Defense Advanced Research Projects Agency/U.S. Army Intelligence Center Contract DABT63-94-C-0053Mitsubishi CorporationNational Science Foundation Young Investigator Award Fellowship MIP 92-58376Joint Industry Program on Offshore Structure AnalysisAnalog DevicesDefense Advanced Research Projects AgencyCadence Design SystemsMAFET ConsortiumConsortium for Superconducting ElectronicsNational Defense Science and Engineering Graduate FellowshipDigital Equipment CorporationMIT Lincoln LaboratorySemiconductor Research CorporationMultiuniversity Research IntiativeNational Science Foundatio

Highway infrastructure health monitoring using micro-electromechanical sensors and systems (MEMS)

The development of novel smart structures by embedding sensing capabilities directly into the construction material during the manufacturing and deployment process has attracted significant attention in autonomous structural health monitoring (SHM). Micro-electromechanical systems (MEMS) provide vast improvements over existing sensing methods in the context of SHM of highway infrastructure systems, including improved system reliability, improved longevity and enhanced system performance, improved safety against natural hazards and vibrations, and a reduction in life cycle cost in both operating and maintaining the infrastructure. Advancements in MEMS technology and wireless sensor networks provide opportunities for long-Term, continuous, real-Time structural health monitoring of pavements and bridges at low cost within the context of sustainable infrastructure systems. Based on a comprehensive review of literature and vendor survey, the latest information available on off-The-shelf MEMS devices, as well as research prototypes, for bridge, pavement, and traffic applications are synthesized in this paper. In addition, the paper discusses the results of a laboratory study as well as a small-scale field study on the use of a wireless concrete monitoring system based on radio-frequency identification (RFID) technology and off-The-shelf MEMS-based temperature and humidity sensors

A Review on Key Issues and Challenges in Devices Level MEMS Testing

The present review provides information relevant to issues and challenges in MEMS testing techniques that are implemented to analyze the microelectromechanical systems (MEMS) behavior for specific application and operating conditions. MEMS devices are more complex and extremely diverse due to the immersion of multidomains. Their failure modes are distinctive under different circumstances. Therefore, testing of these systems at device level as well as at mass production level, that is, parallel testing, is becoming very challenging as compared to the IC test, because MEMS respond to electrical, physical, chemical, and optical stimuli. Currently, test systems developed for MEMS devices have to be customized due to their nondeterministic behavior and complexity. The accurate measurement of test systems for MEMS is difficult to quantify in the production phase. The complexity of the device to be tested required maturity in the test technique which increases the cost of test development; this practice is directly imposed on the device cost. This factor causes a delay in time-to-market

A Review on Key Issues and Challenges in Devices Level MEMS Testing

The present review provides information relevant to issues and challenges in MEMS testing techniques that are implemented to analyze the microelectromechanical systems (MEMS) behavior for specific application and operating conditions. MEMS devices are more complex and extremely diverse due to the immersion of multidomains. Their failure modes are distinctive under different circumstances. Therefore, testing of these systems at device level as well as at mass production level, that is, parallel testing, is becoming very challenging as compared to the IC test, because MEMS respond to electrical, physical, chemical, and optical stimuli. Currently, test systems developed for MEMS devices have to be customized due to their nondeterministic behavior and complexity. The accurate measurement of test systems for MEMS is difficult to quantify in the production phase. The complexity of the device to be tested required maturity in the test technique which increases the cost of test development; this practice is directly imposed on the device cost. This factor causes a delay in time-to-market

High-Speed Performance, Power and Thermal Co-simulation For SoC Design

This dissertation presents a multi-faceted effort at developing standard System Design Language based tools that allow designers to the model power and thermal behavior of SoCs, including heterogeneous SoCs that include non-digital components. The research contributions made in this dissertation include: • SystemC-based power/performance co-simulation for the Intel XScale microprocessor. We performed detailed characterization of the power dissipation patterns of a variety of system components and used these results to build detailed power models, including a highly accurate, validated instruction-level power model of the XScale processor. We also proposed a scalable, efficient and validated methodology for incorporating fast, accurate power modeling capabilities into system description languages such as SystemC. This was validated against physical measurements of hardware power dissipation. • Modeling the behavior of non-digital SoC components within standard System Design Languages. We presented an approach for modeling the functionality, performance, power, and thermal behavior of a complex class of non-digital components — MEMS microhotplate-based gas sensors — within a SystemC design framework. The components modeled include both digital components (such as microprocessors, busses and memory) and MEMS devices comprising a gas sensor SoC. The first SystemC models of a MEMS-based SoC and the first SystemC models of MEMS thermal behavior were described. Techniques for significantly improving simulation speed were proposed, and their impact quantified. • Vertically Integrated Execution-Driven Power, Performance and Thermal Co-Simulation For SoCs. We adapted the above techniques and used numerical methods to model the system of differential equations that governs on-chip thermal diffusion. This allows a single high-speed simulation to span performance, power and thermal modeling of a design. It also allows feedback behaviors, such as the impact of temperature on power dissipation or performance, to be modeled seamlessly. We validated the thermal equation-solving engine on test layouts against detailed low-level tools, and illustrated the power of such a strategy by demonstrating a series of studies that designers can perform using such tools. We also assessed how simulation and accuracy are impacted by spatial and temporal resolution used for thermal modeling

NASA Tech Briefs, January 2007

Topics covered include: Flexible Skins Containing Integrated Sensors and Circuitry; Artificial Hair Cells for Sensing Flows; Video Guidance Sensor and Time-of-Flight Rangefinder; Optical Beam-Shear Sensors; Multiple-Agent Air/Ground Autonomous Exploration Systems; A 640 512-Pixel Portable Long-Wavelength Infrared Camera; An Array of Optical Receivers for Deep-Space Communications; Microstrip Antenna Arrays on Multilayer LCP Substrates; Applications for Subvocal Speech; Multiloop Rapid-Rise/Rapid Fall High-Voltage Power Supply; The PICWidget; Fusing Symbolic and Numerical Diagnostic Computations; Probabilistic Reasoning for Robustness in Automated Planning; Short-Term Forecasting of Radiation Belt and Ring Current; JMS Proxy and C/C++ Client SDK; XML Flight/Ground Data Dictionary Management; Cross-Compiler for Modeling Space-Flight Systems; Composite Elastic Skins for Shape-Changing Structures; Glass/Ceramic Composites for Sealing Solid Oxide Fuel Cells; Aligning Optical Fibers by Means of Actuated MEMS Wedges; Manufacturing Large Membrane Mirrors at Low Cost; Double-Vacuum-Bag Process for Making Resin- Matrix Composites; Surface Bacterial-Spore Assay Using Tb3+/DPA Luminescence; Simplified Microarray Technique for Identifying mRNA in Rare Samples; High-Resolution, Wide-Field-of-View Scanning Telescope; Multispectral Imager With Improved Filter Wheel and Optics; Integral Radiator and Storage Tank; Compensation for Phase Anisotropy of a Metal Reflector; Optical Characterization of Molecular Contaminant Films; Integrated Hardware and Software for No-Loss Computing; Decision-Tree Formulation With Order-1 Lateral Execution; GIS Methodology for Planning Planetary-Rover Operations; Optimal Calibration of the Spitzer Space Telescope; Automated Detection of Events of Scientific Interest; Representation-Independent Iteration of Sparse Data Arrays; Mission Operations of the Mars Exploration Rovers; and More About Software for No-Loss Computing