Studies on Core-Based Testing of System-on-Chips Using Functional Bus and Network-on-Chip Interconnects

The tests of a complex system such as a microprocessor-based system-onchip (SoC) or a network-on-chip (NoC) are difficult and expensive. In this thesis, we propose three core-based test methods that reuse the existing functional interconnects-a flat bus, hierarchical buses of multiprocessor SoC's (MPSoC), and a N oC-in order to avoid the silicon area cost of a dedicated test access mechanism (TAM). However, the use of functional interconnects as functional TAM's introduces several new problems. During tests, the interconnects-including the bus arbitrator, the bus bridges, and the NoC routers-operate in the functional mode to transport the test stimuli and responses, while the core under tests (CUT) operate in the test mode. Second, the test data is transported to the CUT through the functional bus, and not directly to the test port. Therefore, special core test wrappers that can provide the necessary control signals required by the different functional interconnect are proposed. We developed two types of wrappers, one buffer-based wrapper for the bus-based systems and another pair of complementary wrappers for the NoCbased systems. Using the core test wrappers, we propose test scheduling schemes for the three functionally different types of interconnects. The test scheduling scheme for a flat bus is developed based on an efficient packet scheduling scheme that minimizes both the buffer sizes and the test time under a power constraint. The schedulingscheme is then extended to take advantage of the hierarchical bus architecture of the MPSoC systems. The third test scheduling scheme based on the bandwidth sharing is developed specifically for the NoC-based systems. The test scheduling is performed under the objective of co-optimizing the wrapper area cost and the resulting test application time using the two complementary NoC wrappers. For each of the proposed methodology for the three types of SoC architec .. ture, we conducted a thorough experimental evaluation in order to verify their effectiveness compared to other methods

Infrastructures and Algorithms for Testable and Dependable Systems-on-a-Chip

Every new node of semiconductor technologies provides further miniaturization and higher performances, increasing the number of advanced functions that electronic products can offer. Silicon area is now so cheap that industries can integrate in a single chip usually referred to as System-on-Chip (SoC), all the components and functions that historically were placed on a hardware board. Although adding such advanced functionality can benefit users, the manufacturing process is becoming finer and denser, making chips more susceptible to defects. Today’s very deep-submicron semiconductor technologies (0.13 micron and below) have reached susceptibility levels that put conventional semiconductor manufacturing at an impasse. Being able to rapidly develop, manufacture, test, diagnose and verify such complex new chips and products is crucial for the continued success of our economy at-large. This trend is expected to continue at least for the next ten years making possible the design and production of 100 million transistor chips. To speed up the research, the National Technology Roadmap for Semiconductors identified in 1997 a number of major hurdles to be overcome. Some of these hurdles are related to test and dependability. Test is one of the most critical tasks in the semiconductor production process where Integrated Circuits (ICs) are tested several times starting from the wafer probing to the end of production test. Test is not only necessary to assure fault free devices but it also plays a key role in analyzing defects in the manufacturing process. This last point has high relevance since increasing time-to-market pressure on semiconductor fabrication often forces foundries to start volume production on a given semiconductor technology node before reaching the defect densities, and hence yield levels, traditionally obtained at that stage. The feedback derived from test is the only way to analyze and isolate many of the defects in today’s processes and to increase process’s yield. With the increasing need of high quality electronic products, at each new physical assembly level, such as board and system assembly, test is used for debugging, diagnosing and repairing the sub-assemblies in their new environment. Similarly, the increasing reliability, availability and serviceability requirements, lead the users of high-end products performing periodic tests in the field throughout the full life cycle. To allow advancements in each one of the above scaling trends, fundamental changes are expected to emerge in different Integrated Circuits (ICs) realization disciplines such as IC design, packaging and silicon process. These changes have a direct impact on test methods, tools and equipment. Conventional test equipment and methodologies will be inadequate to assure high quality levels. On chip specialized block dedicated to test, usually referred to as Infrastructure IP (Intellectual Property), need to be developed and included in the new complex designs to assure that new chips will be adequately tested, diagnosed, measured, debugged and even sometimes repaired. In this thesis, some of the scaling trends in designing new complex SoCs will be analyzed one at a time, observing their implications on test and identifying the key hurdles/challenges to be addressed. The goal of the remaining of the thesis is the presentation of possible solutions. It is not sufficient to address just one of the challenges; all must be met at the same time to fulfill the market requirements

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

<p>As integrated circuits (ICs) continue to scale to smaller dimensions, long interconnects</p><p>have become the dominant contributor to circuit delay and a significant component of</p><p>power consumption. In order to reduce the length of these interconnects, 3D integration</p><p>and 3D stacked ICs (3D SICs) are active areas of research in both academia and industry.</p><p>3D SICs not only have the potential to reduce average interconnect length and alleviate</p><p>many of the problems caused by long global interconnects, but they can offer greater design</p><p>flexibility over 2D ICs, significant reductions in power consumption and footprint in</p><p>an era of mobile applications, increased on-chip data bandwidth through delay reduction,</p><p>and improved heterogeneous integration.</p><p>Compared to 2D ICs, the manufacture and test of 3D ICs is significantly more complex.</p><p>Through-silicon vias (TSVs), which constitute the dense vertical interconnects in a</p><p>die stack, are a source of additional and unique defects not seen before in ICs. At the same</p><p>time, testing these TSVs, especially before die stacking, is recognized as a major challenge.</p><p>The testing of a 3D stack is constrained by limited test access, test pin availability,</p><p>power, and thermal constraints. Therefore, efficient and optimized test architectures are</p><p>needed to ensure that pre-bond, partial, and complete stack testing are not prohibitively</p><p>expensive.</p><p>Methods of testing TSVs prior to bonding continue to be a difficult problem due to test</p><p>access and testability issues. Although some built-in self-test (BIST) techniques have been</p><p>proposed, these techniques have numerous drawbacks that render them impractical. In this dissertation, a low-cost test architecture is introduced to enable pre-bond TSV test through</p><p>TSV probing. This has the benefit of not needing large analog test components on the die,</p><p>which is a significant drawback of many BIST architectures. Coupled with an optimization</p><p>method described in this dissertation to create parallel test groups for TSVs, test time for</p><p>pre-bond TSV tests can be significantly reduced. The pre-bond probing methodology is</p><p>expanded upon to allow for pre-bond scan test as well, to enable both pre-bond TSV and</p><p>structural test to bring pre-bond known-good-die (KGD) test under a single test paradigm.</p><p>The addition of boundary registers on functional TSV paths required for pre-bond</p><p>probing results in an increase in delay on inter-die functional paths. This cost of test</p><p>architecture insertion can be a significant drawback, especially considering that one benefit</p><p>of 3D integration is that critical paths can be partitioned between dies to reduce their delay.</p><p>This dissertation derives a retiming flow that is used to recover the additional delay added</p><p>to TSV paths by test cell insertion.</p><p>Reducing the cost of test for 3D-SICs is crucial considering that more tests are necessary</p><p>during 3D-SIC manufacturing. To reduce test cost, the test architecture and test</p><p>scheduling for the stack must be optimized to reduce test time across all necessary test</p><p>insertions. This dissertation examines three paradigms for 3D integration - hard dies, firm</p><p>dies, and soft dies, that give varying degrees of control over 2D test architectures on each</p><p>die while optimizing the 3D test architecture. Integer linear programming models are developed</p><p>to provide an optimal 3D test architecture and test schedule for the dies in the 3D</p><p>stack considering any or all post-bond test insertions. Results show that the ILP models</p><p>outperform other optimization methods across a range of 3D benchmark circuits.</p><p>In summary, this dissertation targets testing and design-for-test (DFT) of 3D SICs.</p><p>The proposed techniques enable pre-bond TSV and structural test while maintaining a</p><p>relatively low test cost. Future work will continue to enable testing of 3D SICs to move</p><p>industry closer to realizing the true potential of 3D integration.</p>Dissertatio

Test and security in a System-on-Chip environment

This dissertation outlines new approaches for test and security in a System-on-Chip (SoC) environment. A methodology is proposed for designing a single test access mechanism (TAM) architecture on each die with a "bandwidth adapter" that allows it to be efficiently used for multiple different test data bandwidths in three-dimensional integrated circuits (3D-IC) using through-silicon vias (TSVs). In this way, a single test architecture can be re-used for pre-bond, partial stack, and post-bond testing while minimizing test time across all phases of test. Unlike previous approaches, this methodology does not need multiple TAM architectures or reconfigurable wrappers in order to be efficient when the test data bandwidth changes. In industry, sequential linear decompression is widely used to reduce data and bandwidth requirements. A new scheme using a multiple polynomial linear feedback shift register (LFSR) with rotating polynomial is proposed here to increase encoding flexibility resulting in higher compression ratios. An algorithm is described to assign test cubes to polynomials in a way that enhances encoding efficiency. For hardware security, a new attack strategy against logic obfuscation is described here. It is based on applying brute force iteratively to each logic cone one at a time and is shown to significantly reduce the number of brute force key combinations that need to be tried by an attacker. It is shown that inserting key gates based on MUXes is an effective approach to increase security against this type of attack. In data security for hardware, existing techniques for computing with encrypted operands are either prohibitively expense (e.g., fully homomorphic encryption) or only work for special cases (e.g., linear circuits). A lightweight scheme implemented at the gate-level is proposed for computing with noise-obfuscated data. By carefully selecting internal locations for noise cancellation in arbitrary logic circuits, the overhead can be greatly minimized. One important application of the proposed scheme is for protecting data inside a computing unit obtained from a third party IP provider where a hidden backdoor access mechanism or hardware Trojan could be maliciously inserted.Electrical and Computer Engineerin

Reconfigurable Computing Systems for Robotics using a Component-Oriented Approach

Robotic platforms are becoming more complex due to the wide range of modern applications, including multiple heterogeneous sensors and actuators. In order to comply with real-time and power-consumption constraints, these systems need to process a large amount of heterogeneous data from multiple sensors and take action (via actuators), which represents a problem as the resources of these systems have limitations in memory storage, bandwidth, and computational power. Field Programmable Gate Arrays (FPGAs) are programmable logic devices that offer high-speed parallel processing. FPGAs are particularly well-suited for applications that require real-time processing, high bandwidth, and low latency. One of the fundamental advantages of FPGAs is their flexibility in designing hardware tailored to specific needs, making them adaptable to a wide range of applications. They can be programmed to pre-process data close to sensors, which reduces the amount of data that needs to be transferred to other computing resources, improving overall system efficiency. Additionally, the reprogrammability of FPGAs enables them to be repurposed for different applications, providing a cost-effective solution that needs to adapt quickly to changing demands. FPGAs' performance per watt is close to that of Application-Specific Integrated Circuits (ASICs), with the added advantage of being reprogrammable. Despite all the advantages of FPGAs (e.g., energy efficiency, computing capabilities), the robotics community has not fully included them so far as part of their systems for several reasons. First, designing FPGA-based solutions requires hardware knowledge and longer development times as their programmability is more challenging than Central Processing Units (CPUs) or Graphics Processing Units (GPUs). Second, porting a robotics application (or parts of it) from software to an accelerator requires adequate interfaces between software and FPGAs. Third, the robotics workflow is already complex on its own, combining several fields such as mechanics, electronics, and software. There have been partial contributions in the state-of-the-art for FPGAs as part of robotics systems. However, a study of FPGAs as a whole for robotics systems is missing in the literature, which is the primary goal of this dissertation. Three main objectives have been established to accomplish this. (1) Define all components required for an FPGAs-based system for robotics applications as a whole. (2) Establish how all the defined components are related. (3) With the help of Model-Driven Engineering (MDE) techniques, generate these components, deploy them, and integrate them into existing solutions. The component-oriented approach proposed in this dissertation provides a proper solution for designing and implementing FPGA-based designs for robotics applications. The modular architecture, the tool 'FPGA Interfaces for Robotics Middlewares' (FIRM), and the toolchain 'FPGA Architectures for Robotics' (FAR) provide a set of tools and a comprehensive design process that enables the development of complex FPGA-based designs more straightforwardly and efficiently. The component-oriented approach contributed to the state-of-the-art in FPGA-based designs significantly for robotics applications and helps to promote their wider adoption and use by specialists with little FPGA knowledge

Software tools for the rapid development of signal processing and communications systems on configurable platforms

Programmers and engineers in the domains of high performance computing (HPC) and electronic system design have a shared goal: to define a structure for coordination and communication between nodes in a highly parallel network of processing tasks. Practitioners in both of these fields have recently encountered additional constraints that motivate the use of multiple types of processing device in a hybrid or heterogeneous platform, but constructing a working "program" to be executed on such an architecture is very time-consuming with current domain-specific design methodologies. In the field of HPC, research has proposed solutions involving the use of alternative computational devices such as FPGAs (field-programmable gate arrays), since these devices can exhibit much greater performance per unit of power consumption. The appeal of integrating these devices into traditional microprocessor-based systems is mitigated, however, by the greater difficulty in constructing a system for the resulting hybrid platform. In the field of electronic system design, a similar problem of integration exists. Many of the highly parallel FPGA-based systems that Xilinx and its customers produce for applications such as telecommunications and video processing require the additional use of one or more microprocessors, but coordinating the interactions between existing FPGA cores and software running on the microprocessors is difficult. The aim of my project is to improve the design flow for hybrid systems by proposing, firstly, an abstract representation of these systems and their components which captures in metadata their different models of computation and communication; secondly, novel design checking, exploration and optimisation techniques based around this metadata; and finally, a novel design methodology in which component and system metadata is used to generate software simulation models. The effectiveness of this approach will be evaluated through the implementation of two physical-layer telecommunications system models that meet the requirements of the 3GPP "LTE" standard, which is commercially relevant to Xilinx and many other organisations

Network-on-Chip

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems

A Multi-FPGA Networking Architecture and Its Implementation

FPGAs show great promise in accelerating compute-bound parallelizable applications by offloading kernels into programmable logic. However, currently FPGAs present significant hurdles in being a viable technology, due to both the capital outlay required for specialized hardware as well as the logic required to support the offloaded kernels on the FPGA. This thesis seeks to change that by making it easy to communicate clusters of FPGAs over IP networks and providing infrastructure for common application use cases, allowing authors to focus on their application and not the procurement and details of interacting with a specific FPGA. Our approach is twofold. First, we develop an FPGA IP network stack and bitfile management system allowing users to upload their logic to a server and have it run on FPGAs accessible through the Internet. Second, we engineer a programmable logic interface which authors can use to move data to their application kernels. This interface provides communication over the Internet as well as the scaffolding typically re-invented for each application by providing I/O between application logic, even if spread across different FPGAs. We utilize Partial Reconfiguration to divide the FPGAs into regions, each of which can host different applications from different users. We then provide a web service through which users can upload their FPGA logic. The service finds a spot for the logic on the FPGAs, reconfigures them to contain the logic, then sends back the user their IP addresses. To ease development of the application pieces themselves, our framework abstracts away the complexity of communicating over IP networks as well as between different FPGAs. Instead we provide an interface to applications consisting simply of a RAM port. Applications write packets of data into the port, and they appear at the other end, whether that other end is across an IP network or another FPGA. Finally, we then prove the feasibility and utility of our approach by implementing it on an array of Xilinx Virtex 5 FPGAs, linked together with GTP serial links and connected via Gigabit Ethernet. We port a compute-bound application based on regular expression string matching to the framework, demonstrating that our approach is feasible for implementing a realistic application

A High Performance Advanced Encryption Standard (AES) Encrypted On-Chip Bus Architecture for Internet-of-Things (IoT) System-on-Chips (SoC)

With industry expectations of billions of Internet-connected things, commonly referred to as the IoT, we see a growing demand for high-performance on-chip bus architectures with the following attributes: small scale, low energy, high security, and highly configurable structures for integration, verification, and performance estimation. Our research thus mainly focuses on addressing these key problems and finding the balance among all these requirements that often work against each other. First of all, we proposed a low-cost and low-power System-on-Chips (SoCs) architecture (IBUS) that can frame data transfers differently. The IBUS protocol provides two novel transfer modes – the block and state modes, and is also backward compatible with the conventional linear mode. In order to evaluate the bus performance automatically and accurately, we also proposed an evaluation methodology based on the standard circuit design flow. Experimental results show that the IBUS based design uses the least hardware resource and reduces energy consumption to a half of an AMBA Advanced High-Performance Bus (AHB) and Advanced eXensible Interface (AXI). Additionally, the valid bandwidth of the IBUS based design is 2.3 and 1.6 times, respectively, compared with the AHB and AXI based implementations. As IoT advances, privacy and security issues become top tier concerns in addition to the high performance requirement of embedded chips. To leverage limited resources for tiny size chips and overhead cost for complex security mechanisms, we further proposed an advanced IBUS architecture to provide a structural support for the block-based AES algorithm. Our results show that the IBUS based AES-encrypted design costs less in terms of hardware resource and dynamic energy (60.2%), and achieves higher throughput (x1.6) compared with AXI. Effectively dealing with the automation in design and verification for mixed-signal integrated circuits is a critical problem, particularly when the bus architecture is new. Therefore, we further proposed a configurable and synthesizable IBUS design methodology. The flexible structure, together with bus wrappers, direct memory access (DMA), AES engine, memory controller, several mixed-signal verification intellectual properties (VIPs), and bus performance models (BPMs), forms the basic for integrated circuit design, allowing engineers to integrate application-specific modules and other peripherals to create complex SoCs