Reliability Assessment Of Self-Alignment Assemblies Of Chip Component After Reflow Soldering Process

Reliability of surface mount components and interconnect are significant issues in electronic manufacturing. Although the reliability of devices has been broadly studied,here we are focusing on the reliability of the solder joint after the self-alignment phenomena during reflow soldering.In this study,the quality of the self-alignment assemblies was analyzed relate to the joint shear strength according to the JIS Z3 198-7 standard and the inspection according to IPC-A-610E standard.The results from reliability study indicate that the shear strength of the misalignment component of solder joints indeed depends on the degree of chip component misalignment.For shift mode configuration in the range of 0-300µm,the resulted chip assembly inspection after the reflow process was in line with the IPC-A-610E standard

Deposition and application of electroless Ni–W–P under bump metallisation for high temperature lead-free solder interconnects

A reliable and robust diffusion barrier, commonly known as under bump metallisation (UBM), is indispensable in solder interconnects in order to retard the interfacial reaction rate, hence the growth of intermetallic compounds (IMCs). However, electroless Ni-P coatings are not adequate to inhibit interfacial reactions effectively since the formation of columnar structure and voids in the crystalline Ni3P layer in hybrid automotive devices (operating temperature above 300ºC) can significantly deteriorate the mechanical integrity of solder joints. In this thesis, electroless Ni-W-P coatings, as an effective UBM capable to serving under high temperature (up to 450ºC), are developed, characterised and subsequently applied onto the high temperature lead-free solder interconnects. [Continues.

Performance of SAC305 and SAC305-0.4La lead free electronic solders at high temperature

Purpose – Tin-Silver-Copper is widely accepted as the best alternative to replace Tin-Lead solders in microelectronics packaging due to their acceptable properties. However, to overcome some of the shortcomings related to its microstructure and in turn, its mechanical properties at high temperature, the addition of different elements into Tin-Silver-Copper is important for investigations. The purpose of this paper is to analyse the effect of lanthanum doping on the microstructure, microhardness and tensile properties of Tin-Silver-Copper as a function of thermal aging time for 60, 120 and 180 h at a high temperature of 150°C and at high strain rates of 25, 35 and 45/s. Design/methodology/approach – The microstructure of un-doped and Lanthanum-doped Tin-Silver-Copper after different thermal aging time is examined using scanning electron microscopy followed by digital image analyses using ImageJ. Brinell hardness is used to find out the microhardness properties. The tensile tests are performed using the universal testing machine. All the investigations are done after the above selected thermal aging time at high temperature. The tensile tests of the thermally aged specimens are further investigated at high strain rates of 25, 35 and 45/s. Findings – According to the microstructural examination, Tin-Silver-Copper with 0.4 Wt.% Lanthanum is found to be more sensitive at high temperature as the aging time increases which resulted in coarse microstructure due to the non-uniform distribution of intermetallic compounds. Similarly, lower values of microhardness, yield strength and ultimate tensile strength come in favours of 0.4 Wt.% Lanthanum added Tin-Silver- Copper. Furthermore, when the thermally aged tensile specimen is tested at high strains, two trends in tensile curves of both the solder alloys are noted. The trends showed that yield strength and ultimate tensile strength increase as the strain rate increase and decrease when there is an increase in thermal aging. Originality/value – The addition of higher supplement (0.4Wt.%) of Lanthanum into Tin-Silver-Copper showed a lower hardness value, yield strength, ultimate tensile strength, ductility, toughness and fatigue in comparison to un-doped Tin-Silver-Copper at high temperature and at high strain rates. Finally, simplified material property models with minimum error are developed which will help when the actual test data are not available

Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications

Satu nano-pes argentum-kuprum (Ag-Cu) yang dirumuskan dengan mencampurkan nanopartikel Ag dan Cu dengan penambah organik (pelekat resin, terpineol dan ethylene glycol) telah dihasilkan bagi diaplikasikan sebagai bahan lampir-dai suhu tinggi. Pelbagai peratus berat nanopartikel Cu (20-80 wt%) telah ditambahkan ke dalam nano-pes Ag-Cu, diikuti oleh pensinteran di udara terbuka pada suhu 380°C selama 30 min tanpa bantuan tekanan luar, untuk mengkaji kesan terhadap sifat-sifat fizikal, elektrikal, terma dan mekanikal. A silver-copper (Ag-Cu) nanopaste formulated by mixing Ag and Cu nanoparticles with organic additives (i.e., resin binder, terpineol and ethylene glycol) which is meant for high-temperature die-attach applications has been developed. Various weight percent of Cu nanoparticles (20-80 wt%) has been loaded into the Ag-Cu nanopaste, followed by sintering in open air at temperature of 380°C for 30 min without the need of applied external pressure

Hiroshima University Research and Technology Guide 2012 Version : Physical Science & Engineering

II Environment/Energy III Design and Manufacturing IV Material/Device V Mechanical Engineering VI Civil Engineering/Architecture VII Computer Science, Information, Communication and System Engineering VIII Measurement & Control/Scientific Analyse

NBS monograph

From Abstract: "An extensive compilation is given of the measured values of thermal conductivity for nearly all solid materials from room temperature down to 0.02 kelvin. Experimental methods and physical phenomena are discussed in the text and coded in the tables for references for which curves are shown.

Towards a circular economy: fabrication and characterization of biodegradable plates from sugarcane waste

Bagasse pulp is a promising material to produce biodegradable plates. Bagasse is the fibrous residue that remains after sugarcane stalks are crushed to extract their juice. It is a renewable resource and is widely available in many countries, making it an attractive alternative to traditional plastic plates. Recent research has shown that biodegradable plates made from Bagasse pulp have several advantages over traditional plastic plates. For example, they are more environmentally friendly because they are made from renewable resources and can be composted after use. Additionally, they are safer for human health because they do not contain harmful chemicals that can leach into food. The production process for Bagasse pulp plates is also relatively simple and cost-effective. Bagasse is first collected and then processed to remove impurities and extract the pulp. The pulp is then molded into the desired shape and dried to form a sturdy plate. Overall, biodegradable plates made from Bagasse pulp are a promising alternative to traditional plastic plates. They are environmentally friendly, safe for human health, and cost-effective to produce. As such, they have the potential to play an important role in reducing plastic waste and promoting sustainable practices. Over the years, the world was not paying strict attention to the impact of rapid growth in plastic use. As a result, uncontrollable volumes of plastic garbage have been released into the environment. Half of all plastic garbage generated worldwide is made up of packaging materials. The purpose of this article is to offer an alternative by creating bioplastic goods that can be produced in various shapes and sizes across various sectors, including food packaging, single-use tableware, and crafts. Products made from bagasse help address the issue of plastic pollution. To find the optimum option for creating bagasse-based biodegradable dinnerware in Egypt and throughout the world, researchers tested various scenarios. The findings show that bagasse pulp may replace plastics in biodegradable packaging. As a result of this value-added utilization of natural fibers, less waste and less of it ends up in landfills. The practical significance of this study is to help advance low-carbon economic solutions and to produce secure bioplastic materials that can replace Styrofoam in tableware and food packaging production