Small Signals’ Study of Thermal Induced Current in Nanoscale SOI Sensor

A new nanoscale SOI dual-mode modulator is investigated as a function of optical and thermal activation modes. In order to accurately characterize the device specifications towards its future integration in microelectronics circuitry, current time variations are studied and compared for “large signal” constant temperature changes, as well as for “small signal” fluctuating temperature sources. An equivalent circuit model is presented to define the parameters which are assessed by numerical simulation. Assuring that the thermal response is fast enough, the device can be operated as a modulator via thermal stimulation or, on the other hand, can be used as thermal sensor/imager. We present here the design, simulation, and model of the next generation which seems capable of speeding up the processing capabilities. This novel device can serve as a building block towards the development of optical/thermal data processing while breaking through the way to all optic processors based on silicon chips that are fabricated via typical microelectronics fabrication process

The relevance of point defects in studying silica-based materials from bulk to nanosystems

The macroscopic properties of silica can be modified by the presence of local microscopic modifications at the scale of the basic molecular units (point defects). Such defects can be generated during the production of glass, devices, or by the environments where the latter have to operate, impacting on the devices’ performance. For these reasons, the identification of defects, their generation processes, and the knowledge of their electrical and optical features are relevant for microelectronics and optoelectronics. The aim of this manuscript is to report some examples of how defects can be generated, how they can impact device performance, and how a defect species or a physical phenomenon that is a disadvantage in some fields can be used as an advantage in others

Solid State Circuits Technologies

The evolution of solid-state circuit technology has a long history within a relatively short period of time. This technology has lead to the modern information society that connects us and tools, a large market, and many types of products and applications. The solid-state circuit technology continuously evolves via breakthroughs and improvements every year. This book is devoted to review and present novel approaches for some of the main issues involved in this exciting and vigorous technology. The book is composed of 22 chapters, written by authors coming from 30 different institutions located in 12 different countries throughout the Americas, Asia and Europe. Thus, reflecting the wide international contribution to the book. The broad range of subjects presented in the book offers a general overview of the main issues in modern solid-state circuit technology. Furthermore, the book offers an in depth analysis on specific subjects for specialists. We believe the book is of great scientific and educational value for many readers. I am profoundly indebted to the support provided by all of those involved in the work. First and foremost I would like to acknowledge and thank the authors who worked hard and generously agreed to share their results and knowledge. Second I would like to express my gratitude to the Intech team that invited me to edit the book and give me their full support and a fruitful experience while working together to combine this book

DESIGN, COMPACT MODELING AND CHARACTERIZATION OF NANOSCALE DEVICES

Electronic device modeling is a crucial step in the advancement of modern nanotechnology and is gaining more and more interest. Nanoscale complementary metal oxide semiconductor (CMOS) transistors, being the backbone of the electronic industry, are pushed to below 10 nm dimensions using novel manufacturing techniques including extreme lithography. As their dimensions are pushed into such unprecedented limits, their behavior is still captured using models that are decades old. Among many other proposed nanoscale devices, silicon vacuum electron devices are regaining attention due to their presumed advantages in operating at very high power, high speed and under harsh environment, where CMOS cannot compete. Another type of devices that have the potential to complement CMOS transistors are nano-electromechanical systems (NEMS), with potential applications in filters, stable frequency sources, non-volatile memories and reconfigurable and neuromorphic electronics

Field-Effect Sensors

This Special Issue focuses on fundamental and applied research on different types of field-effect chemical sensors and biosensors. The topics include device concepts for field-effect sensors, their modeling, and theory as well as fabrication strategies. Field-effect sensors for biomedical analysis, food control, environmental monitoring, and the recording of neuronal and cell-based signals are discussed, among other factors

MEMS tunable infrared metamaterial and mechanical sensors

Sub-wavelength resonant structures open the path for fine controlling the near-field at the nanoscale dimension. They constitute into macroscopic “metamaterials” with macroscale properties such as transmission, reflection, and absorption being tailored to exhibit a particular electromagnetic response. The properties of the resonators are often fixed at the time of fabrication wherein the tunability is demanding to overcome fabrication tolerances and afford fast signal processing. Hybridizing dynamic components such as optically active medium into the device makes tunable devices. Microelectromechanical systems (MEMS) compatible integrated circuit fabrication process is a promising platform that can be merged with photonics or novel 2D materials. The prospect of enormous freedom in integrating nanophotonics, MEMS actuators and sensors, and microelectronics into a single platform has driven the rapid development of MEMS-based sensing devices. This thesis describes the design and development of four tunable plasmonic structures based on active media or MEMS, two graphene-based MEMS sensors and a novel tape-based cost-effective nanotransfer printing techniques. First of all, we present two tunable plasmonic devices with the use of two active medium, which are electrically controlled liquid crystals and temperature-responsive hydrogels, respectively. By incorporating a nematic liquid crystal layer into quasi-3D mushroom plasmonic nanostructures and thanks to the unique coupling between surface plasmon polariton and Rayleigh anomaly, we have achieved the electrical tuning of the properties of plasmonic crystal at a low operating electric field. We also present another tunable plasmonic device with the capability to sense environmental temperature variations. The device is bowtie nanoantenna arrays coated with a submicron-thick, thermos-responsive hydrogel. The favorable scaling of plasmonic dimers at the nanometer scale and ionic diffusion at the submicron scale is leveraged to achieve strong optical resonance and rapid hydrogel response, respectively. Secondly, we present two MEMS -based tunable near-to-mid infrared metamaterials on a silicon-on-insulator wafer via electrically and thermally actuating the freestanding nanocantilevers. The two devices are developed on the basis of the same fabrication process and are easy-to-implement. The electrostatically driven metamaterial affords ultrahigh mechanical modulation (several tens of MHz) of an optical signal while the thermo-mechanically tunable metamaterial provides up to 90% optical signal modulation at a wavelength of 3.6 õm. Next, we present MEMS graphene-based pressure and gas flow sensors realized by transferring a large area and few-layered graphene onto a suspended silicon nitride thin membrane perforated with micro-through-holes. Due to the increased strain in the through-holes, the pressure sensor exhibits a very high sensitivty outperformed than most existing MEMS-based pressure sensors using graphene, silicon, and carbon nanotubes. An air flow sensor is also demonstrated via patterning graphene sheets with flow-through microholes. The flow rate of the air is measured by converting the mechanically deflection of the membrane into the electrical readout due to the graphene piezeroresistors. Finally, we present a tape-based multifunctional nanotransfer printing process based on a simple stick-and-peel procedure. It affords fast production of large-area metallic and dielectric nanophotonic sensing devices and metamaterials using Scotch tape

Development of suspended thermoreflectance technique and its application in thermal property measurement of semiconductor materials

Doctor of PhilosophyDepartment of Mechanical and Nuclear EngineeringGurpreet SinghThis dissertation details the development of a new scientific tool for the thermal characterization of freestanding micro/nano-scale materials, with specific application to thin films. The tool consists of a custom-designed and calibrated opto-electric system with superior spatial and temporal resolutions in thermal measurement. The tool, termed as Suspended ThermoReflectance (STR), can successfully perform thermal mappings at the submicron level and is able to produce unconstrained thermal conductivity unlike other optical measurement techniques where independent conductivity measurement is not possible due to their reliance on heat capacity. STR works by changing the temperature of a material and collecting the associated change in light reflection from multiple points on the sample surface. The reflection is a function of the material being tested, the wavelength of the probe light and the composition of the specimen for transparent and quasi-transparent materials. Coupling the change in reflection, along the sample’s length, with the knowledge of heat conduction allows for the determination of the thermal properties of interest. A thermal analytical model is developed and incorporated with optical equations to characterize the conductivity of thin films. The analytical model is compared with a finite element model to check its applicability in the STR experiment and data analysis. Ultimately, thermal conductivity of 2 µm and 3 µm thick Si samples were determined using STR at a temperature range of 20K – 350K and compared to literature as a validation of the technique. The system was automated using a novel LabView-based program. This program allowed the user to control the equipment including electronics, optics and optical cryostat. Moreover, data acquisition and real-time monitoring of the system are also accomplished through this computer application. A description of the development, fabrication and characterization of the freestanding thin films is detailed in this dissertation. For the most part, the thin films were fabricated using standard microfabrication techniques. However, different dry and wet etching techniques were compared for minimum surface roughness to reduce light scattering. The best etching technique was used to trim the Si films for the desired thicknesses. Besides, vapor HF was used to avoid stiction-failure during the release of suspended films

Low-Cost, Water Pressure Sensing and Leakage Detection Using Micromachined Membranes

This work presents the only known SOI membrane approach, using Microelectromechanical systems (MEMS) fabrication techniques, to address viable water leakage sensing requirements at low cost. In this research, membrane thickness and diameter are used in concert to target specific stiffness values that will result in targeted operational pressure ranges of approximately 0-120 psi. A MEMS membrane device constructed using silicon-on-insulator (SOI) wafers, has been tested and packaged for the water environment. MEMS membrane arrays will be used to determine operational pressure range by bursting.Two applications of these SOI membranes in aqueous environment are investigated in this research. The first one is water pressure sensing. We demonstrate that robustness of these membranes depends on their thickness and surface area. Their mechanical strength and robustness against applied pressure are determined using Finite Element Analysis (FEA). The mechanical response of a membrane pressure sensor is determined by physical factors such as surface area, thickness and material properties. The second application of this device is water leak detection. In devices such as pressure sensors, microvalves and micropumps, membranes can be subjected to immense pressure that causes them to fail or burst. However, this event can be used to indicate the precise pressure level that malfunction occurred. These membrane arrays can be used to determine pressure values by bursting. We discuss the background information related to the proposed device: MEMS fabrication processes (especially related to proposed device), common MEMS materials, general micromachining process steps, packaging and wire bonding techniques, and common micromachined pressure sensors. Besides, FEA on SOLIDWORKS simulation module is utilized to understand membrane sensitivity and robustness. In addition, we focus on theories supporting the simulated results. We also discuss the device fabrication process, which consists of the tested device’s fabrication process, Deep Reactive Ion Etching (DRIE) for membrane formation, two different realizable fabrication technique (depending on sensing material) of sensing element, metal contact pads, and connectors deposition. In addition, a brief description and operation procedures of the device fabrication tools are provided as well. We also include detailed electrical and mechanical testing procedures and the collected data