Power Reductions with Energy Recovery Using Resonant Topologies

The problem of power densities in system-on-chips (SoCs) and processors has become more exacerbated recently, resulting in high cooling costs and reliability issues. One of the largest components of power consumption is the low skew clock distribution network (CDN), driving large load capacitance. This can consume as much as 70% of the total dynamic power that is lost as heat, needing elaborate sensing and cooling mechanisms. To mitigate this, resonant clocking has been utilized in several applications over the past decade. An improved energy recovering reconfigurable generalized series resonance (GSR) solution with all the critical support circuitry is developed in this work. This LC resonant clock driver is shown to save about 50% driver power (\u3e40% overall), on a 22nm process node and has 50% less skew than a non-resonant driver at 2GHz. It can operate down to 0.2GHz to support other energy savings techniques like dynamic voltage and frequency scaling (DVFS). As an example, GSR can be configured for the simpler pulse series resonance (PSR) operation to enable further power saving for double data rate (DDR) applications, by using de-skewing latches instead of flip-flop banks. A PSR based subsystem for 40% savings in clocking power with 40% driver active area reduction xii is demonstrated. This new resonant driver generates tracking pulses at each transition of clock for dual edge operation across DVFS. PSR clocking is designed to drive explicit-pulsed latches with negative setup time. Simulations using 45nm IBM/PTM device and interconnect technology models, clocking 1024 flip-flops show the reductions, compared to non-resonant clocking. DVFS range from 2GHz/1.3V to 200MHz/0.5V is obtained. The PSR frequency is set \u3e3× the clock rate, needing only 1/10th the inductance of prior-art LC resonance schemes. The skew reductions are achieved without needing to increase the interconnect widths owing to negative set-up times. Applications in data circuits are shown as well with a 90nm example. Parallel resonant and split-driver non-resonant configurations as well are derived from GSR. Tradeoffs in timing performance versus power, based on theoretical analysis, are compared for the first time and verified. This enables synthesis of an optimal topology for a given application from the GSR

A Novel Boost Converter Based LED Driver Chip Targeting Mobile Applications

abstract: A novel integrated constant current LED driver design on a single chip is developed in this dissertation. The entire design consists of two sections. The first section is a DC-DC switching regulator (boost regulator) as the frontend power supply; the second section is the constant current LED driver system. In the first section, a pulse width modulated (PWM) peak current mode boost regulator is utilized. The overall boost regulator system and its related sub-cells are explained. Among them, an original error amplifier design, a current sensing circuit and slope compensation circuit are presented. In the second section – the focus of this dissertation – a highly accurate constant current LED driver system design is unveiled. The detailed description of this highly accurate LED driver system and its related sub-cells are presented. A hybrid PWM and linear current modulation scheme to adjust the LED driver output currents is explained. The novel design ideas to improve the LED current accuracy and channel-to-channel output current mismatch are also explained in detail. These ideas include a novel LED driver system architecture utilizing 1) a dynamic current mirror structure and 2) a closed loop structure to keep the feedback loop of the LED driver active all the time during both PWM on-duty and PWM off-duty periods. Inside the LED driver structure, the driving amplifier with a novel slew rate enhancement circuit to dramatically accelerate its response time is also presented.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201

A fast and retargetable framework for logic-IP-internal electromigration assessment comprehending advanced waveform effects

A new methodology for system-on-chip-level logic-IP-internal electromigration verification is presented in this paper, which significantly improves accuracy by comprehending the impact of the parasitic RC loading and voltage-dependent pin capacitance in the library model. It additionally provides an on-the-fly retargeting capability for reliability constraints by allowing arbitrary specifications of lifetimes, temperatures, voltages, and failure rates, as well as interoperability of the IPs across foundries. The characterization part of the methodology is expedited through the intelligent IP-response modeling. The ultimate benefit of the proposed approach is demonstrated on a 28-nm design by providing an on-the-fly specification of retargeted reliability constraints. The results show a high correlation with SPICE and were obtained with an order of magnitude reduction in the verification runtime.Peer ReviewedPostprint (author's final draft

Design of a Torque Current Generator for Strapdown Gyroscopes

The design, analysis, and experimental evaluation of an optimum performance torque current generator for use with strapdown gyroscopes, is presented. Among the criteria used to evaluate the design were the following: (1) steady-state accuracy; (2) margins of stability against self-oscillation; (3) temperature variations; (4) aging; (5) static errors drift errors, and transient errors, (6) classical frequency and time domain characteristics; and (7) the equivalent noise at the input of the comparater operational amplifier. The DC feedback loop of the torque current generator was approximated as a second-order system. Stability calculations for gain margins are discussed. Circuit diagrams are shown and block diagrams showing the implementation of the torque current generator are discussed

Statistical circuit simulations - from ‘atomistic’ compact models to statistical standard cell characterisation

This thesis describes the development and application of statistical circuit simulation methodologies to analyse digital circuits subject to intrinsic parameter fluctuations. The specific nature of intrinsic parameter fluctuations are discussed, and we explain the crucial importance to the semiconductor industry of developing design tools which accurately account for their effects. Current work in the area is reviewed, and three important factors are made clear: any statistical circuit simulation methodology must be based on physically correct, predictive models of device variability; the statistical compact models describing device operation must be characterised for accurate transient analysis of circuits; analysis must be carried out on realistic circuit components. Improving on previous efforts in the field, we posit a statistical circuit simulation methodology which accounts for all three of these factors. The established 3-D Glasgow atomistic simulator is employed to predict electrical characteristics for devices aimed at digital circuit applications, with gate lengths from 35 nm to 13 nm. Using these electrical characteristics, extraction of BSIM4 compact models is carried out and their accuracy in performing transient analysis using SPICE is validated against well characterised mixed-mode TCAD simulation results for 35 nm devices. Static d.c. simulations are performed to test the methodology, and a useful analytic model to predict hard logic fault limitations on CMOS supply voltage scaling is derived as part of this work. Using our toolset, the effect of statistical variability introduced by random discrete dopants on the dynamic behaviour of inverters is studied in detail. As devices scaled, dynamic noise margin variation of an inverter is increased and higher output load or input slew rate improves the noise margins and its variation. Intrinsic delay variation based on CV/I delay metric is also compared using ION and IEFF definitions where the best estimate is obtained when considering ION and input transition time variations. Critical delay distribution of a path is also investigated where it is shown non-Gaussian. Finally, the impact of the cell input slew rate definition on the accuracy of the inverter cell timing characterisation in NLDM format is investigated

Load Slammer Design for DC-DC Converter Testing

In this work, we dive into the detailed design of a test load or load slammer circuit for DC/DC converters to ensure their correct functioning. This is accomplished through quick variations in frequency, amplitude, and duty cycle of the current being drawn by the converter into the load. Computer simulations of the design were performed using LTSpice and the results show that the load current could be varied per design objectives. Hardware implementation of the design was also conducted and then tested. Results were then compared with the design requirements at lower currents to evaluate the validity of the design. Although good results were obtained from the current design, further improvements would still be needed to improve the overall performance and design of the load slammer circuit

Junction Temperature Estimation of Silicon Carbide Power Module using Internal Gate Resistance as Temperature Sensitive Electrical Parameter

The junction temperature of a power module is measured non-intrusively and uninterrupted in its application by analyzing the dependency of gate resistance to temperature. The circuit configuration proposed consists of altering the gate loop path and adding a basic peak detection circuit with an added low-pass filter to accurately measure the small differences seen during a temperature change on the internal gate resistance. The testing on this Silicon Carbide power module shows that the internal gate resistance has a positive temperature coefficient. This causes the current and the voltage drop on the gate loop sensing resistance to reduce as the temperature rises. The voltage drops on the sensing resistance forms a steady downward linear slope that is used to establish an accurate estimation of the junction temperature. This implementation has future implications on a smart gate-driver board that can actively measure the junction temperature of the Silicon Carbide power module and shut off the module when approaching a critical failing temperature