2,239 research outputs found

    Technology Independent Synthesis of CMOS Operational Amplifiers

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    Analog circuit design does not enjoy as much automation as its digital counterpart. Analog sizing is inherently knowledge intensive and requires accurate modeling of the different parametric effects of the devices. Besides, the set of constraints in a typical analog design problem is large, involving complex tradeoffs. For these reasons, the task of modeling an analog design problem in a form viable for automation is much more tedious than the digital design. Consequently, analog blocks are still handcrafted intuitively and often become a bottleneck in the integrated circuit design, thereby increasing the time to market. In this work, we address the problem of automatically solving an analog circuit design problem. Specifically, we propose methods to automate the transistor-level sizing of OpAmps. Given the specifications and the netlist of the OpAmp, our methodology produces a design that has the accuracy of the BSIM models used for simulation and the advantage of a quick design time. The approach is based on generating an initial first-order design and then refining it. In principle, the refining approach is a simulated-annealing scheme that uses (i) localized simulations and (ii) convex optimization scheme (COS). The optimal set of input variables for localized simulations has been selected by using techniques from Design of Experiments (DOE). To formulate the design problem as a COS problem, we have used monomial circuit models that are fitted from simulation data. These models accurately predict the performance of the circuit in the proximity of the initial guess. The models can also be used to gain valuable insight into the behavior of the circuit and understand the interrelations between the different performance constraints. A software framework that implements this methodology has been coded in SKILL language of Cadence. The methodology can be applied to design different OpAmp topologies across different technologies. In other words, the framework is both technology independent and topology independent. In addition, we develop a scheme to empirically model the small signal parameters like \u27gm\u27 and \u27gds\u27 of CMOS transistors. The monomial device models are reusable for a given technology and can be used to formulate the OpAmp design problem as a COS problem. The efficacy of the framework has been demonstrated by automatically designing different OpAmp topologies across different technologies. We designed a two-stage OpAmp and a telescopic OpAmp in TSMC025 and AMI016 technologies. Our results show significant (10–15%) improvement in the performance of both the OpAmps in both the technologies. While the methodology has shown encouraging results in the sub-micrometer regime, the effectiveness of the tool has to be investigated in the deep-sub-micron technologies

    Layout-level Circuit Sizing and Design-for-manufacturability Methods for Embedded RF Passive Circuits

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    The emergence of multi-band communications standards, and the fast pace of the consumer electronics markets for wireless/cellular applications emphasize the need for fast design closure. In addition, there is a need for electronic product designers to collaborate with manufacturers, gain essential knowledge regarding the manufacturing facilities and the processes, and apply this knowledge during the design process. In this dissertation, efficient layout-level circuit sizing techniques, and methodologies for design-for-manufacturability have been investigated. For cost-effective fabrication of RF modules on emerging technologies, there is a clear need for design cycle time reduction of passive and active RF modules. This is important since new technologies lack extensive design libraries and layout-level electromagnetic (EM) optimization of RF circuits become the major bottleneck for reduced design time. In addition, the design of multi-band RF circuits requires precise control of design specifications that are partially satisfied due to manufacturing variations, resulting in yield loss. In this work, a broadband modeling and a layout-level sizing technique for embedded inductors/capacitors in multilayer substrate has been presented. The methodology employs artificial neural networks to develop a neuro-model for the embedded passives. Secondly, a layout-level sizing technique for RF passive circuits with quasi-lumped embedded inductors and capacitors has been demonstrated. The sizing technique is based on the circuit augmentation technique and a linear optimization framework. In addition, this dissertation presents a layout-level, multi-domain DFM methodology and yield optimization technique for RF circuits for SOP-based wireless applications. The proposed statistical analysis framework is based on layout segmentation, lumped element modeling, sensitivity analysis, and extraction of probability density functions using convolution methods. The statistical analysis takes into account the effect of thermo-mechanical stress and process variations that are incurred in batch fabrication. Yield enhancement and optimization methods based on joint probability functions and constraint-based convex programming has also been presented. The results in this work have been demonstrated to show good correlation with measurement data.Ph.D.Committee Chair: Swaminathan, Madhavan; Committee Member: Fathianathan, Mervyn; Committee Member: Lim, Sung Kyu; Committee Member: Peterson, Andrew; Committee Member: Tentzeris, Mano

    Yield-driven power-delay-optimal CMOS full-adder design complying with automotive product specifications of PVT variations and NBTI degradations

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    We present the detailed results of the application of mathematical optimization algorithms to transistor sizing in a full-adder cell design, to obtain the maximum expected fabrication yield. The approach takes into account all the fabrication process parameter variations specified in an industrial PDK, in addition to operating condition range and NBTI aging. The final design solutions present transistor sizing, which depart from intuitive transistor sizing criteria and show dramatic yield improvements, which have been verified by Monte Carlo SPICE analysis

    FPGA Architecture Optimization Using Geometric Programming

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    Volume 4 No 13 of the periodical Progression. Published November, February, May and August by The Radiant Healing Centre. SPCL PER BT 732 P76 V.1,1932-V.5,193

    A Powerful Optimization Tool for Analog Integrated Circuits Design

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    This paper presents a new optimization tool for analog circuit design. Proposed tool is based on the robust version of the differential evolution optimization method. Corners of technology, temperature, voltage and current supplies are taken into account during the optimization. That ensures robust resulting circuits. Those circuits usually do not need any schematic change and are ready for the layout.. The newly developed tool is implemented directly to the Cadence design environment to achieve very short setup time of the optimization task. The design automation procedure was enhanced by optimization watchdog feature. It was created to control optimization progress and moreover to reduce the search space to produce better design in shorter time. The optimization algorithm presented in this paper was successfully tested on several design examples
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