Simultaneous slack budgeting and retiming for synchronous circuits optimization

Abstract- With the challenges of growing functionality and scaling chip size, the possible performance improvements should be considered in the earlier IC design stages, which gives more freedom to the later optimization. Potential slack as an effective metric of possible performance improvements is considered in this work which, as far as we known, is the first work that maximizes the potential slack by retiming for synchronous sequential circuit. A simultaneous slack budgeting and incremental retiming algorithm is proposed for maximizing potential slack. The overall slack budget is optimized by relocating the FFs iteratively with the MIS-based slack estimation. Compared with the potential slack of a well-known min-period retiming, our algorithm improves potential slack averagely 19.6 % without degrading the circuit performance in reasonable runtime. Furthermore, at the expense of a small amount of timing performance, 0.52 % and 2.08%, the potential slack is increased averagely by 19.89 % and 28.16 % separately, which give a hint of the tradeoff between the timing performance and the slack budget.

Broadening the Scope of Multi-Objective Optimizations in Physical Synthesis of Integrated Circuits.

In modern VLSI design, physical synthesis tools are primarily responsible for satisfying chip-performance constraints by invoking a broad range of circuit optimizations, such as buffer insertion, logic restructuring, gate sizing and relocation. This process is known as timing closure. Our research seeks more powerful and efficient optimizations to improve the state of the art in modern chip design. In particular, we integrate timing-driven relocation, retiming, logic cloning, buffer insertion and gate sizing in novel ways to create powerful circuit transformations that help satisfy setup-time constraints. State-of-the-art physical synthesis optimizations are typically applied at two scales: i) global algorithms that affect the entire netlist and ii) local transformations that focus on a handful of gates or interconnections. The scale of modern chip designs dictates that only near-linear-time optimization algorithms can be applied at the global scope — typically limited to wirelength-driven placement and legalization. Localized transformations can rely on more time-consuming optimizations with accurate delay models. Few techniques bridge the gap between fully-global and localized optimizations. This dissertation broadens the scope of physical synthesis optimization to include accurate transformations operating between the global and local scales. In particular, we integrate groups of related transformations to break circular dependencies and increase the number of circuit elements that can be jointly optimized to escape local minima. Integrated transformations in this dissertation are developed by identifying and removing obstacles to successful optimizations. Integration is achieved through mapping multiple operations to rigorous mathematical optimization problems that can be solved simultaneously. We achieve computational scalability in our techniques by leveraging analytical delay models and focusing optimization efforts on carefully selected regions of the chip. In this regard, we make extensive use of a linear interconnect-delay model that accounts for the impact of subsequent repeated insertion. Our integrated transformations are evaluated on high-performance circuits with over 100,000 gates. Integrated optimization techniques described in this dissertation ensure graceful timing-closure process and impact nearly every aspect of a typical physical synthesis flow. They have been validated in EDA tools used at IBM for physical synthesis of high-performance CPU and ASIC designs, where they significantly improved chip performance.Ph.D.Computer Science & EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/78744/1/iamyou_1.pd

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

An Ultra-Low-Energy, Variation-Tolerant FPGA Architecture Using Component-Specific Mapping

As feature sizes scale toward atomic limits, parameter variation continues to increase, leading to increased margins in both delay and energy. Parameter variation both slows down devices and causes devices to fail. For applications that require high performance, the possibility of very slow devices on critical paths forces designers to reduce clock speed in order to meet timing. For an important and emerging class of applications that target energy-minimal operation at the cost of delay, the impact of variation-induced defects at very low voltages mandates the sizing up of transistors and operation at higher voltages to maintain functionality. With post-fabrication configurability, FPGAs have the opportunity to self-measure the impact of variation, determining the speed and functionality of each individual resource. Given that information, a delay-aware router can use slow devices on non-critical paths, fast devices on critical paths, and avoid known defects. By mapping each component individually and customizing designs to a component's unique physical characteristics, we demonstrate that we can eliminate delay margins and reduce energy margins caused by variation. To quantify the potential benefit we might gain from component-specific mapping, we first measure the margins associated with parameter variation, and then focus primarily on the energy benefits of FPGA delay-aware routing over a wide range of predictive technologies (45 nm--12 nm) for the Toronto20 benchmark set. We show that relative to delay-oblivious routing, delay-aware routing without any significant optimizations can reduce minimum energy/operation by 1.72x at 22 nm. We demonstrate how to construct an FPGA architecture specifically tailored to further increase the minimum energy savings of component-specific mapping by using the following techniques: power gating, gate sizing, interconnect sparing, and LUT remapping. With all optimizations considered we show a minimum energy/operation savings of 2.66x at 22 nm, or 1.68--2.95x when considered across 45--12 nm. As there are many challenges to measuring resource delays and mapping per chip, we discuss methods that may make component-specific mapping more practical. We demonstrate that a simpler, defect-aware routing achieves 70% of the energy savings of delay-aware routing. Finally, we show that without variation tolerance, scaling from 16 nm to 12 nm results in a net increase in minimum energy/operation; component-specific mapping, however, can extend minimum energy/operation scaling to 12 nm and possibly beyond.</p

Proceedings of the 3rd International Conference on Models and Technologies for Intelligent Transportation Systems 2013

Challenges arising from an increasing traffic demand, limited resource availability and growing quality expectations of the customers can only be met successfully, if each transport mode is regarded as an intelligent transportation system itself, but also as part of one intelligent transportation system with “intelligent” intramodal and intermodal interfaces. This topic is well reflected in the Third International Conference on “Models and Technologies for Intelligent Transportation Systems” which took place in Dresden 2013 (previous editions: Rome 2009, Leuven 2011). With its variety of traffic management problems that can be solved using similar methods and technologies, but with application specific models, objective functions and constraints the conference stands for an intensive exchange between theory and practice and the presentation of case studies for all transport modes and gives a discussion forum for control engineers, computer scientists, mathematicians and other researchers and practitioners. The present book comprises fifty short papers accepted for presentation at the Third Edition of the conference. All submissions have undergone intensive reviews by the organisers of the special sessions, the members of the scientific and technical advisory committees and further external experts in the field. Like the conference itself the proceedings are structured in twelve streams: the more model-oriented streams of Road-Bound Public Transport Management, Modelling and Control of Urban Traffic Flow, Railway Traffic Management in four different sessions, Air Traffic Management, Water Traffic and Traffic and Transit Assignment, as well as the technology-oriented streams of Floating Car Data, Localisation Technologies for Intelligent Transportation Systems and Image Processing in Transportation. With this broad range of topics this book will be of interest to a number of groups: ITS experts in research and industry, students of transport and control engineering, operations research and computer science. The case studies will also be of interest for transport operators and members of traffic administration

Flight Mechanics/Estimation Theory Symposium, 1991

Twenty-six papers and abstracts are presented. A wide range of issues related to orbit attitude prediction, orbit determination, and orbit control are examined including attitude sensor calibration, attitude dynamics, and orbit decay and maneuver strategy. Government, industry, and the academic community participated in the preparation and presentation of these papers