Timing Closure in Chip Design

Achieving timing closure is a major challenge to the physical design of a computer chip. Its task is to find a physical realization fulfilling the speed specifications. In this thesis, we propose new algorithms for the key tasks of performance optimization, namely repeater tree construction; circuit sizing; clock skew scheduling; threshold voltage optimization and plane assignment. Furthermore, a new program flow for timing closure is developed that integrates these algorithms with placement and clocktree construction. For repeater tree construction a new algorithm for computing topologies, which are later filled with repeaters, is presented. To this end, we propose a new delay model for topologies that not only accounts for the path lengths, as existing approaches do, but also for the number of bifurcations on a path, which introduce extra capacitance and thereby delay. In the extreme cases of pure power optimization and pure delay optimization the optimum topologies regarding our delay model are minimum Steiner trees and alphabetic code trees with the shortest possible path lengths. We presented a new, extremely fast algorithm that scales seamlessly between the two opposite objectives. For special cases, we prove the optimality of our algorithm. The efficiency and effectiveness in practice is demonstrated by comprehensive experimental results. The task of circuit sizing is to assign millions of small elementary logic circuits to elements from a discrete set of logically equivalent, predefined physical layouts such that power consumption is minimized and all signal paths are sufficiently fast. In this thesis we develop a fast heuristic approach for global circuit sizing, followed by a local search into a local optimum. Our algorithms use, in contrast to existing approaches, the available discrete layout choices and accurate delay models with slew propagation. The global approach iteratively assigns slew targets to all source pins of the chip and chooses a discrete layout of minimum size preserving the slew targets. In comprehensive experiments on real instances, we demonstrate that the worst path delay is within 7% of its lower bound on average after a few iterations. The subsequent local search reduces this gap to 2% on average. Combining global and local sizing we are able to size more than 5.7 million circuits within 3 hours. For the clock skew scheduling problem we develop the first algorithm with a strongly polynomial running time for the cycle time minimization in the presence of different cycle times and multi-cycle paths. In practice, an iterative local search method is much more efficient. We prove that this iterative method maximizes the worst slack, even when restricting the feasible schedule to certain time intervals. Furthermore, we enhance the iterative local approach to determine a lexicographically optimum slack distribution. The clock skew scheduling problem is then generalized to allow for simultaneous data path optimization. In fact, this is a time-cost tradeoff problem. We developed the first combinatorial algorithm for computing time-cost tradeoff curves in graphs that may contain cycles. Starting from the lowest-cost solution, the algorithm iteratively computes a descent direction by a minimum cost flow computation. The maximum feasible step length is then determined by a minimum ratio cycle computation. This approach can be used in chip design for several optimization tasks, e.g. threshold voltage optimization or plane assignment. Finally, the optimization routines are combined into a timing closure flow. Here, the global placement is alternated with global performance optimization. Netweights are used to penalize the length of critical nets during placement. After the global phase, the performance is improved further by applying more comprehensive optimization routines on the most critical paths. In the end, the clock schedule is optimized and clocktrees are inserted. Computational results of the design flow are obtained on real-world computer chips

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

Power Reduction Techniques in Clock Distribution Networks with Emphasis on LC Resonant Clocking

In this thesis we propose a set of independent techniques in the overall concept of LC resonant clocking where each technique reduces power consumption and improve system performance. Low-power design is becoming a crucial design objective due to the growing demand on portable applications and the increasing difficulties in cooling and heat removal. The clock distribution network delivers the clock signal which acts as a reference to all sequential elements in the synchronous system. The clock distribution network consumes a considerable amount of power in synchronous digital systems. Resonant clocking is an emerging promising technique to reduce the power of the clock network. The inductor used in resonant clocking enables the conversion of the electric energy stored on the clock capacitance to magnetic energy in the inductor and vice versa. In this thesis, the concept of the slack in the clock skew has been extended for an LC fully-resonant clock distribution network. This extra slack in comparison to standard clock distribution networks can be used to reduce routing complexity, achieve reduction in wire elongation, total wire length, and power consumption. Simulation results illustrate that by utilizing the proposed approach, an average reduction of 53% in the number of wire elongations and 11% reduction in total wire length can be achieved. A dual-edge clocking scheme introduced in the literature to enable the operation of the flip-flop at the rising- and falling edges of the clock has been modified. The interval by which the charging elements in the flip-flop are being switched-on was reduced causing a reduction in power consumption. Simulating the flip-flop in STMicroelectronics 90-nm technology shows correct functionality of the Sense Amplifier flip-flop with a resonant clock signal of 500 MHz and a throughput of 1 GHz under process, voltage, and temperature (PVT) variations. Modeling the resonant system with the proposed flip-flop illustrates that dual-edge compared to single-edge triggering can achieve up to 58% reduction in power consumption when the clock capacitance is the dominating factor. The application of low-swing clocking to LC resonant clock distribution network has been investigated on-chip. The proposed low-swing resonant clocking scheme operates with one voltage supply and does not require an additional supply voltage. The Differential Conditional Capturing flip-flop introduced in the literature was modified to operate with a low-swing sinusoidal clock. Low-swing resonant clocking achieved around 5.8% reduction in total power with 5.7% area overhead. Modeling the clock network with the proposed flip-flop illustrates that low-swing clocking can achieve up to 58% reduction in the power consumption of the resonant clock. An analytical approach was introduced to estimate the required driver strength in the clock generator. Using the proposed approach early in the design stage reduces area and power overhead by eliminating the need for programmable switches in the driving circuit

Voltage drop tolerance by adaptive voltage scaling using clock-data compensation

Proyecto de Graduación (Maestría en Ingeniería en Electrónica) Instituto Tecnológico de Costa Rica, Escuela de Ingeniería Electrónica, 2019.El ruido de alta frecuencia en la red de alimentación compromete el rendimiento y la eficiencia energética de los sistemas electrónicos con microprocesadores, restringiendo la frecuencia máxima de operación de los sistemas y disminuyendo la confiabilidad de los dispositivos. La frecuencia máxima será determinada por la ruta de datos más crítica (la ruta de datos más lenta). De esta manera, es necesario configurar una banda de guarda para tolerar caídas de voltaje sin tener ningún problema de ejecución, pero sacrificando el rendimiento eléctrico. Este trabajo evalúa el impacto de la caída de voltaje en el rendimiento de los circuitos CMOS de alta densidad, estableciendo un conjunto de casos de prueba que contienen diferentes configuraciones de circuitos. Se desarrolló una técnica adaptable y escalable para mejorar la tolerancia a la caída de voltaje en los circuitos CMOS a través del escalado adaptativo, aprovechando el efecto de compensación de datos del reloj. La solución propuesta se validó aplicándola a diferentes casos de prueba en una tecnología FinFet-CMOS a nivel de simulación del diseño físico.High-frequency power supply noise compromises performance and energy efficiency of microprocessor-based products, restricting the maximum frequency of operation for electronic systems and decreasing device reliability. The maximum frequency is going to be determine by the most critical data path (the slowest data path). In this way, a guard band needs to be set in order to tolerate voltage drops without having any execution problem, but leading to a performance reduction. This work evaluates the impact of voltage drop in the performance of CMOS circuits by establishing a set of test cases containing different circuit configurations. An adaptive and scalable technique is proposed to enhance voltage drop tolerance in CMOS circuits through adaptive scaling, taking advantage of the clock-data compensation effect. The proposed solution is validated by applying it to different test cases in a FinFet CMOS technology at a post-layout simulation level

Physical Design Methodologies for Low Power and Reliable 3D ICs

As the semiconductor industry struggles to maintain its momentum down the path following the Moore's Law, three dimensional integrated circuit (3D IC) technology has emerged as a promising solution to achieve higher integration density, better performance, and lower power consumption. However, despite its significant improvement in electrical performance, 3D IC presents several serious physical design challenges. In this dissertation, we investigate physical design methodologies for 3D ICs with primary focus on two areas: low power 3D clock tree design, and reliability degradation modeling and management. Clock trees are essential parts for digital system which dissipate a large amount of power due to high capacitive loads. The majority of existing 3D clock tree designs focus on minimizing the total wire length, which produces sub-optimal results for power optimization. In this dissertation, we formulate a 3D clock tree design flow which directly optimizes for clock power. Besides, we also investigate the design methodology for clock gating a 3D clock tree, which uses shutdown gates to selectively turn off unnecessary clock activities. Different from the common assumption in 2D ICs that shutdown gates are cheap thus can be applied at every clock node, shutdown gates in 3D ICs introduce additional control TSVs, which compete with clock TSVs for placement resources. We explore the design methodologies to produce the optimal allocation and placement for clock and control TSVs so that the clock power is minimized. We show that the proposed synthesis flow saves significant clock power while accounting for available TSV placement area. Vertical integration also brings new reliability challenges including TSV's electromigration (EM) and several other reliability loss mechanisms caused by TSV-induced stress. These reliability loss models involve complex inter-dependencies between electrical and thermal conditions, which have not been investigated in the past. In this dissertation we set up an electrical/thermal/reliability co-simulation framework to capture the transient of reliability loss in 3D ICs. We further derive and validate an analytical reliability objective function that can be integrated into the 3D placement design flow. The reliability aware placement scheme enables co-design and co-optimization of both the electrical and reliability property, thus improves both the circuit's performance and its lifetime. Our electrical/reliability co-design scheme avoids unnecessary design cycles or application of ad-hoc fixes that lead to sub-optimal performance. Vertical integration also enables stacking DRAM on top of CPU, providing high bandwidth and short latency. However, non-uniform voltage fluctuation and local thermal hotspot in CPU layers are coupled into DRAM layers, causing a non-uniform bit-cell leakage (thereby bit flip) distribution. We propose a performance-power-resilience simulation framework to capture DRAM soft error in 3D multi-core CPU systems. In addition, a dynamic resilience management (DRM) scheme is investigated, which adaptively tunes CPU's operating points to adjust DRAM's voltage noise and thermal condition during runtime. The DRM uses dynamic frequency scaling to achieve a resilience borrow-in strategy, which effectively enhances DRAM's resilience without sacrificing performance. The proposed physical design methodologies should act as important building blocks for 3D ICs and push 3D ICs toward mainstream acceptance in the near future

Clock Generator Circuits for Low-Power Heterogeneous Multiprocessor Systems-on-Chip

In this work concepts and circuits for local clock generation in low-power heterogeneous multiprocessor systems-on-chip (MPSoCs) are researched and developed. The targeted systems feature a globally asynchronous locally synchronous (GALS) clocking architecture and advanced power management functionality, as for example fine-grained ultra-fast dynamic voltage and frequency scaling (DVFS). To enable this functionality compact clock generators with low chip area, low power consumption, wide output frequency range and the capability for ultra-fast frequency changes are required. They are to be instantiated individually per core. For this purpose compact all digital phase-locked loop (ADPLL) frequency synthesizers are developed. The bang-bang ADPLL architecture is analyzed using a numerical system model and optimized for low jitter accumulation. A 65nm CMOS ADPLL is implemented, featuring a novel active current bias circuit which compensates the supply voltage and temperature sensitivity of the digitally controlled oscillator (DCO) for reduced digital tuning effort. Additionally, a 28nm ADPLL with a new ultra-fast lock-in scheme based on single-shot phase synchronization is proposed. The core clock is generated by an open-loop method using phase-switching between multi-phase DCO clocks at a fixed frequency. This allows instantaneous core frequency changes for ultra-fast DVFS without re-locking the closed loop ADPLL. The sensitivity of the open-loop clock generator with respect to phase mismatch is analyzed analytically and a compensation technique by cross-coupled inverter buffers is proposed. The clock generators show small area (0.0097mm2 (65nm), 0.00234mm2 (28nm)), low power consumption (2.7mW (65nm), 0.64mW (28nm)) and they provide core clock frequencies from 83MHz to 666MHz which can be changed instantaneously. The jitter performance is compliant to DDR2/DDR3 memory interface specifications. Additionally, high-speed clocks for novel serial on-chip data transceivers are generated. The ADPLL circuits have been verified successfully by 3 testchip implementations. They enable efficient realization of future low-power MPSoCs with advanced power management functionality in deep-submicron CMOS technologies.In dieser Arbeit werden Konzepte und Schaltungen zur lokalen Takterzeugung in heterogenen Multiprozessorsystemen (MPSoCs) mit geringer Verlustleistung erforscht und entwickelt. Diese Systeme besitzen eine global-asynchrone lokal-synchrone Architektur sowie Funktionalität zum Power Management, wie z.B. das feingranulare, schnelle Skalieren von Spannung und Taktfrequenz (DVFS). Um diese Funktionalität zu realisieren werden kompakte Taktgeneratoren benötigt, welche eine kleine Chipfläche einnehmen, wenig Verlustleitung aufnehmen, einen weiten Bereich an Ausgangsfrequenzen erzeugen und diese sehr schnell ändern können. Sie sollen individuell pro Prozessorkern integriert werden. Dazu werden kompakte volldigitale Phasenregelkreise (ADPLLs) entwickelt, wobei eine bang-bang ADPLL Architektur numerisch modelliert und für kleine Jitterakkumulation optimiert wird. Es wird eine 65nm CMOS ADPLL implementiert, welche eine neuartige Kompensationsschlatung für den digital gesteuerten Oszillator (DCO) zur Verringerung der Sensitivität bezüglich Versorgungsspannung und Temperatur beinhaltet. Zusätzlich wird eine 28nm CMOS ADPLL mit einer neuen Technik zum schnellen Einschwingen unter Nutzung eines Phasensynchronisierers realisiert. Der Prozessortakt wird durch ein neuartiges Phasenmultiplex- und Frequenzteilerverfahren erzeugt, welches es ermöglicht die Taktfrequenz sofort zu ändern um schnelles DVFS zu realisieren. Die Sensitivität dieses Frequenzgenerators bezüglich Phasen-Mismatch wird theoretisch analysiert und durch Verwendung von kreuzgekoppelten Taktverstärkern kompensiert. Die hier entwickelten Taktgeneratoren haben eine kleine Chipfläche (0.0097mm2 (65nm), 0.00234mm2 (28nm)) und Leistungsaufnahme (2.7mW (65nm), 0.64mW (28nm)). Sie stellen Frequenzen von 83MHz bis 666MHz bereit, welche sofort geändert werden können. Die Schaltungen erfüllen die Jitterspezifikationen von DDR2/DDR3 Speicherinterfaces. Zusätzliche können schnelle Takte für neuartige serielle on-Chip Verbindungen erzeugt werden. Die ADPLL Schaltungen wurden erfolgreich in 3 Testchips erprobt. Sie ermöglichen die effiziente Realisierung von zukünftigen MPSoCs mit Power Management in modernsten CMOS Technologien

VLSI Design

This book provides some recent advances in design nanometer VLSI chips. The selected topics try to present some open problems and challenges with important topics ranging from design tools, new post-silicon devices, GPU-based parallel computing, emerging 3D integration, and antenna design. The book consists of two parts, with chapters such as: VLSI design for multi-sensor smart systems on a chip, Three-dimensional integrated circuits design for thousand-core processors, Parallel symbolic analysis of large analog circuits on GPU platforms, Algorithms for CAD tools VLSI design, A multilevel memetic algorithm for large SAT-encoded problems, etc

Recent Trends in Communication Networks

In recent years there has been many developments in communication technology. This has greatly enhanced the computing power of small handheld resource-constrained mobile devices. Different generations of communication technology have evolved. This had led to new research for communication of large volumes of data in different transmission media and the design of different communication protocols. Another direction of research concerns the secure and error-free communication between the sender and receiver despite the risk of the presence of an eavesdropper. For the communication requirement of a huge amount of multimedia streaming data, a lot of research has been carried out in the design of proper overlay networks. The book addresses new research techniques that have evolved to handle these challenges

MediaSync: Handbook on Multimedia Synchronization

This book provides an approachable overview of the most recent advances in the fascinating field of media synchronization (mediasync), gathering contributions from the most representative and influential experts. Understanding the challenges of this field in the current multi-sensory, multi-device, and multi-protocol world is not an easy task. The book revisits the foundations of mediasync, including theoretical frameworks and models, highlights ongoing research efforts, like hybrid broadband broadcast (HBB) delivery and users' perception modeling (i.e., Quality of Experience or QoE), and paves the way for the future (e.g., towards the deployment of multi-sensory and ultra-realistic experiences). Although many advances around mediasync have been devised and deployed, this area of research is getting renewed attention to overcome remaining challenges in the next-generation (heterogeneous and ubiquitous) media ecosystem. Given the significant advances in this research area, its current relevance and the multiple disciplines it involves, the availability of a reference book on mediasync becomes necessary. This book fills the gap in this context. In particular, it addresses key aspects and reviews the most relevant contributions within the mediasync research space, from different perspectives. Mediasync: Handbook on Multimedia Synchronization is the perfect companion for scholars and practitioners that want to acquire strong knowledge about this research area, and also approach the challenges behind ensuring the best mediated experiences, by providing the adequate synchronization between the media elements that constitute these experiences

Avoin alustakehitys IEEE 802.15.4 -standardin mukaisessa langattomassa automaatiossa

This doctoral dissertation focuses on open source platform development in wireless automation under IEEE 802.15.4 standard. Research method is empirical. A platform based approach, which targets to the design of a generic open source sensor platform, was selected as a design method. The design targets were further focused by interviewing the experts from the academia and industry. Generic and modular sensor platform, the UWASA Node, was developed as an outcome of this process. Based on the implementation results, a wireless sensor and actuator network based on the UWASA Node was a feasible solution for many types of wireless automation applications. It was also possible to interface it with the other parts of the system. The targeted level of sensor platform genericity was achieved. However, it was also observed that the achieved level of genericity increased the software complexity. The development of commercial sensor platforms, which support IEEE 802.15.4 sensor networking, has narrowed down the role of open source sensor platforms, but they are not disappearing. Commercial software is usually closed and connected to a specified platform, which makes it unsuitable for research and development work. Even though there exits many commercial WSN solutions and the market expectations in this area are high, there is still a lot of work to do before the visions about Internet of Things (IoT) are fulfilled, especially in the context of distributed and locally centralized operations in the network. In terms of control engineering, one of the main research issues is to figure out how the well-known control techniques may be applied in wireless automation where WSN is part of the automation system. Open source platforms offer an important tool in this research and development work.Tämä väitöskirja käsittelee avointa alustakehitystä IEEE 802.15.4 -standardin mukaisessa langattomassa automaatiossa. Tutkimusmenetelmä on empiirinen. Työssä sovelletaan alustaperustaista suunnittelutapaa, joka tähtää yleiskäyttöisen avoimen anturialustan kehittämiseen. Suunnittelun tavoitteita tarkennettiin haastattelemalla alan asiantuntijoita teollisuudesta ja yliopistomaailmasta. Tuloksena suunniteltiin ja toteutettiin anturialusta, the UWASA Node. Implementointituloksista voidaan vetää johtopäätös, että anturialustan tavoiteltu yleiskäyttöisyystaso saavutettiin. Toisaalta saavutettu yleiskäyttöisyystaso lisäsi alustan ohjelmistoarkkitehtuurin monimutkaisuutta. Kaupallisten IEEE 802.15.4 -standardia tukevien anturialustojen tulo markkinoille vähentää avointen anturialustojen käyttöä, mutta ne eivät ole katoamassa. Kaupalliset ohjelmistot ovat tyypillisesti suljettuja ja sidoksissa tiettyyn alustaan, mikä tekee niistä sopimattomia tutkimus- ja tuotekehityskäyttöön. Vaikka nykyään on saatavilla useita kaupallisia langattomia anturi- ja toimilaiteverkkoja, vaaditaan vielä paljon työtä ennen kun kaikki esineiden Internetiin (Internet of Things) liittyvät visiot voidaan toteuttaa. Tämä koskee erityisesti langattomassa anturi- ja toimilaiteverkossa hajautetusti tai paikallisesti toteutettavia toimintoja. Säätötekniikan näkökulmasta keskeinen kysymys on, miten tunnettuja säätömenetelmiä tulee soveltaa langattomassa automaatiossa, jossa langaton anturi- ja toimilaiteverkko on osa automaatiojärjestelmää. Avoimet anturialustat ovat tärkeä työkalu sen selvittämisessä.fi=vertaisarvioitu|en=peerReviewed